Startup rewrites NXP’s legacy in 3D passive integration News & Analysis 8/27/2009 Post a comment Economic crises can have positive as well as negative impacts. Thus, if NXP had not divested its wireless business and decided to sell its integrated passives device unit near Caen, Normandy (France), Ipdia would not have emerged with an ambition to deliver next-generation 3D-SiP modules for various applications, including advanced LED modules.
Dresden is like Silicon Valley: hungry talent & excellent education News & Analysis 8/27/2009 1 comment How comes that the Dresden area is the most remarkable center for start-up activities in Germany? The answer is that in the town, all ingredients necessary such as excellent mathematical education and a generation of engineers with great ideas meet. The ignition spark, however, has been imported from the U.S. – in person of Gerhard Fettweis, professor at the Dresden Technical University. In the interview Fettweis explains what are the essentials for start-up friendly environments and which techn
Plenty of business in VDSL for Lantiq News & Analysis 8/27/2009 Post a comment Christian Wolff, designated CEO of Infineon's wireline business sold to Golden Gate Capital, explains the company's strategies in terms of product spectrum, technologies and geographies.
Arasan adds MIPI to IP stable Product News 8/27/2009 Post a comment Arasan Chip Systems, Inc. has released its MIPI (Mobile Industry Processor Interface) High Speed Synchronous Interface (HSI) controller IP and software stack.
Taray appoints Bernie Aronson to Board of Directors Product News 8/27/2009 Post a comment Taray, Inc., a supplier of electronic design automation for design of
FPGA-based systems, announced it has made a key addition to
its board of directors with the appointment of Bernie Aronson, an
industry veteran in semiconductors and electronic design automation.
Small engines get greener Product News 8/26/2009 7 comments Emissions from small gasoline engines could be reduced using a new analog chip that Freescale Semiconductor introduced at a technology forum in Shenzhen, China.
Comment: A cold corporate hand chills Hot Chips Blog 8/26/2009 4 comments The cold hand of corporate marketing has a firm grip on the esophagus of the electronics industry, controlling what gets said, when it gets said and in what key it is vocalized, muting technical conferences such as Hot Chips and ISSCC.
Fishy power requirements Power DesignLine Blog 8/26/2009 Post a comment MIT researchers have displayed prototype robotic fish that have just ten moving parts, including a single motor. Some prototypes have survived in the lab for four years of constant underwater tests without a leak.
Sun, IBM push multicore boundaries News & Analysis 8/26/2009 Post a comment Sun Microsystems claimed a new watermark for server CPUs, unveiling Rainbow Falls, a 16-core, 128-thread processor at the Hot Chips conference, but analysts gave the IBM Power7 kudos as the more compelling achievement in the latest round of high-end server processors.
MIPS adds high def, ALi to its Android push Product News 8/26/2009 Post a comment MIPS Technologies took small steps forward on its journey to bring the Google Android operating system to consumer electronics devices, demonstrating a high def Android system and adding Taiwan's Ali Corp. to its list of partners.
Gartner ups semi market expectations News & Analysis 8/26/2009 Post a comment Strong customer demand and the effects of stimulus packages in China helped to partially iron out the dent in the global semiconductor market. Against this background, market researcher Gartner has lifted its revenue forecast to minus 17 percent for 2009. Earlier, the experts predicted a decline of 22.4 percent. But reasons persist to remain cautious.
Camden : Power fuses conform with IEC 60269 Product News 8/26/2009 Post a comment The CamdenBoss Powerfuse range includes aR semiconductor fuses in 8.5 x 31.5 mm and 10 x 38 mm sizes, aM motor circuit protection fuses in 8.5 x 31.5 mm sizes and gG general fuses in 8.5 x 31.5 mm and 10 x 38 mm sizes.
Trends in power management semiconductors in mobile applications Design How-To 8/25/2009 Post a comment It's a fact, that consumers have an insatiable appetite for smaller, lighter, and function-rich portable electronic devices. But to do so, designers need to grasp integration, and the latest integration trends are in the power management ICs that have come from the simple MOSFET switch, to today's advanced load switches. Learn how with this design article.
Making bare essentials work Blog 8/25/2009 Post a comment Startup siXis Inc. claims mounting bare die on a wafer-scale silicon circuit board essentially eliminates the power-hungry soldered interconnections between packages.
Chip supports realtime accident data recording Product News 8/25/2009 Post a comment Automotive OEMs, accident researchers and insurance companies increasingly are interested in an equipment component for cars which in aircraft has been established as standard equipment already for a long time: A drive recorder. This 'black box' could record accident data in realtime, shedding light on the cause of an accident.
Toyota tops 'clunker' sales list News & Analysis 8/25/2009 1 comment Toyota Motor Co. was the primary beneficiary of the U.S. government's "Cash for Clunkers" program, accounting for three of the top five models purchased by new car buyers, according to a new survey of the auto stimulus program.
Carbon nanotube interconnect startup raises $4.1 million News & Analysis 8/25/2009 Post a comment Surrey NanoSystems Ltd. (Newhaven, England) has raised £2.5 million (about $4.1 million) in second round venture capital to help it develop a silicon-friendly, low-temperature carbon nanotube growth process. Surrey NanoSystems believes CNTs can be used as semiconductor interconnect.
Engineer seeks $60 million bonus from Atmel News & Analysis 8/25/2009 3 comments Dr. Andreas Paul Schueppen, a former employee of Atmel Germany GmbH, is preparing for his first day in court in a case filed against his former employer in which he is claiming he is owed 42 million euro (about $60 million) as an "inventor's bonus."
Energy management for automation Design How-To 8/25/2009 Post a comment Energy management and responsible handling of resources is currently the number one topic in industry. In light of this, the Automation Initiative of German Automobile Manufacturers (AIDA) asked the PROFIBUS organization and PROFINET International (PI) to provide functions and mechanisms for PROFINET that support energy-efficient production.
Simplifying design of industrial process-control systems with PLC evaluation boards (Part 1 of 2) Design How-To 8/24/2009 1 comment
PLC evaluation board applications for industrial process-control systems are diverse, ranging from simple traffic control to complex electrical power grids, from environmental control systems to oil-refinery process control. This two-part series looks at using a PLC evaluation board to simplify design, with a practical example application outlined including schematics and tutorial on using the system.
Market researcher: Bosch bought Akustica for its MEMS integration approach News & Analysis 8/24/2009 Post a comment When recently automotive electronics giant Bosch toke over tiny MEMS microphone company Akustica, the reason was the latter one's expertise in integrating MEMS on standard chips, presumes market researcher The Information Network. The move is not intended to help Bosch to enter the electro-acoustic devices market, but strengthen its leading position in the automotive MEMS scene.
Comment: Intel's counsel of complacency on energy efficiency News & Analysis 8/24/2009 Post a comment Intel and Microsoft funded a Stanford University professor, to produce a series of research papers that assess the energy and environmental impacts of information technology. Peter Clarke argues that many of the benefits that have been quantified in this research are already factored in to our apprecation and that more needs to be done than we are inheriting from Moore's Law.
Silicon circuit board seeks to replace ASICs News & Analysis 8/24/2009 Post a comment You may be able to kiss that printed-circuit board good-bye soon, instead mounting bare die on a wafer-scale silicon circuit board that essentially eliminates the power-hungry soldered interconnections between packages.
Solarflare integrates 10GBase-T on a single chip News & Analysis 8/24/2009 Post a comment Solarflare Communications debuts two chips that mark a significant milestone on the road to the long delayed transition to 10 Gbit/second Ethernet, but the industry still faces a host of challenges eking out mainstream markets for 10 Gbit Ethernet over copper.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.