Agilent announces new memory tester News & Analysis 9/29/2000 Post a comment PALO ALTO, Calif.-- Agilent Technologies Inc. here has expanded its line of automatic test equipment, rolling out a system for use in testing high-speed non-volatile memory devices.
Featuring a tester-per-site architecture, the V4400 NVM Test System from Agilent is a general-purpose wafer-sort and final test system designed for use in testing non-volatile memories, embedded devices, and specialty ICs.
Extreme Devices raises $30 million in funding News & Analysis 9/29/2000 Post a comment AUSTIN, Tex. - Extreme Devices Inc. has raised $30 million in its second round of funding, bringing the total capitalization for the supplier of advanced semiconductor products to $34.25 million.
Investors in the company include KLM Capital Group, Trellis Partners, Dell Ventures, Dow Chemical Co., Austin Ventures, Arch Venture Partners, Tredegar Investments and other institutional and private investors.
STMicro doubles speed of 16-bit MCU, adds DSP functions News & Analysis 9/29/2000 Post a comment GENEVA--STMicroelectronics here today announced a new 16-bit microcontroller core, based on a chip architecture that enables most instructions to be executed in a single clock cycle. The new core--called Super10--doubles the execution speed of existing ST10 microcontrollers in such applications as hard-disk drives, automotive electronics and consumer systems, said STMicroelectronics. It also adds DSP functionality for real-time control.
TI forms cell-phone handset venture in China News & Analysis 9/29/2000 Post a comment BEIJING -- Texas Instruments Inc. here today announced a joint venture with four companies in China to co-develop next-generation cellular phones, based on TI digital signal processors (DSP) technology.
According to a memorandum of understanding (MOU), TI will form a joint venture to develop handsets for the China market with ZTE Corp. Xiamen Overseas Chinese Electronic Inc. Ltd. (Xoceco), Beijing Huahong IC Design Corp., and Ningbao Bird Co. Ltd.
Sun plans to accelerate upgrades to UltraSparc CPUs News & Analysis 9/29/2000 Post a comment
PALO ALTO, Calif. -- With this week's launch of the UltraSparc III architecture, Sun Microsystems Inc. here is aiming to accelerate its 64-bit processor roadmap to stay well ahead of Intel Corp. and Advanced Micro Devices Inc., which are pushing into the 64-bit arena with their own PC-compatible MPUs.
Samsung applies DDR format to speed up 128-Mbit graphics DRAM News & Analysis 9/29/2000 Post a comment SEOUL -- Samsung Electronics Co. Ltd. here today claimed to be the first chip maker to develop a 128-megabit double data rate (DDR) SDRAM for graphics memory applications. The memory supports three-dimensional images and video storage using the DDR memory format, achieving data rates of 500 Mbits per second, according to Samsung.
Motorola sues former chip boss Ruiz for recruiting executives News & Analysis 9/28/2000 Post a comment SCHAUMBURG, Ill.-- Motorola Inc. today announced a lawsuit against the former president of its semiconductor business, Hector de J. Ruiz, alleging that he has broken a contract by recruiting Motorola chip executives to join Advanced Micro Devices Inc. Last January, Ruiz surprised the industry and Motorola by deciding to join AMD as president and chief operating officer.
300-mm fabs could be bad news for current boom cycle, warns analyst News & Analysis 9/28/2000 Post a comment SAN JOSE -- At the annual awards dinner here hosted by the Semiconductor Equipment and Materials International (SEMI) trade group, analyst John Pitzer of Credit Suisse First Boston Corp. said capital spending next year will continue to be strong, but the transition to larger 300-mm wafers could dump too many semiconductors on the market.
Motorola ships world's first certified Bluetooth PC Card News & Analysis 9/28/2000 Post a comment SAN JOSE -- At the Embedded Systems Conference here, Motorola Inc. announced that it has it begun shipping the world's first certified Bluetooth-enabled PC Card for the OEM and retail channels..
Motorola's new product, called the Bluetooth PC Card, has been certified by the Bluetooth Qualifications Body (BQB), which ensures that the product meets the 1.0 standard as defined by the Bluetooth Special Interest Group (BSIG).
Rise discloses more details about its x86 processor strategy News & Analysis 9/28/2000 Post a comment SAN JOSE -- At the Embedded Systems Conference here, Rise Technology Co. disclosed more details about its plans to compete in the x86-based microprocessor business.
The San Jose-based company rolled out the first member of its iDragon System-on-Chip line, an x86-based processor designed for use in set-top boxes, Internet appliances, and related products
Canon plans lithography production for 500 systems per year News & Analysis 9/28/2000 Post a comment TOKYO -- Canon Inc. today announced it will invest an additional $100 million to increase production of lithography tools, including advanced wafer steppers and scanners capable of supporting 300-mm fabs. The company said its expanded manufacturing complex in Utsunomiya, Japan, will operate at an annual capacity of 500 systems per year by the third quarter of 2001.
NEC-Hitachi venture announces 'Elpida' name, 0.13-micron DRAM News & Analysis 9/28/2000 Post a comment TOKYO--The DRAM joint venture between NEC Corp. and Hitachi Ltd. today branded itself as Elpida Memory Inc. The two Japanese chip giants also announced that the joint venture has completed development of its first product using 0.13-micron design rules to create a 256-megabit memory in half the die size of today's 0.18-micron DRAMs.
Sarnoff's I/O protection technology could save fabs $50 per wafer News & Analysis 9/28/2000 Post a comment PRINCETON, N.J. -- Sarnoff Corp. here this week disclosed a new technology that potentially saves one day in the time it takes to fabricate semiconductor wafers by eliminating the need for a silicide-blocking process step. The technology development company estimated that the cost savings in chip-processing plants could be as much as $50 per wafer.
Applied reports breakthrough in inspection of narrow via structures News & Analysis 9/27/2000 Post a comment SANTA CLARA, Calif.--Applied Materials Inc. today announced successful demonstration of breakthrough defect-detection capabilities for semiconductors with 7:1 high aspect ratio structures, such as interconnect vias. In evaluations of optical inspection technologies at International Sematech, Applied's multi-perspective laser-scanning system detected critical defects, such as 50-nanometer (0.05-micron) residue, in narrow via structures, according to the company. Inspection of high aspect ratio vi
Fairchild cuts delivery cycle times for logic, interface chips News & Analysis 9/27/2000 Post a comment SOUTH PORTLAND, Maine -- Fairchild Semiconductor International Corp. today said it has trimmed cycle times for deliveries of logic and interface products by 65% to 90 days. "New tools and processes will further reduce our cycle time on selected products to 75 days by the end of this year," promised W.T. Greer, senior vice president and general manager of Fairchild's Interface & Logic Group.
Singapore's SSMC fab running wafers 90 days after tool installation News & Analysis 9/27/2000 Post a comment SINGAPORE -- Just 90 days after the first chip-processing tools were installed, the silicon wafers have begun running through a new joint-venture fab set up here by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Philips Semiconductors. The new foundry venture--called Systems on Silicon Manufacturing Co. Pte. Ltd. (SSMC)--is now qualifying its processes and aiming to ramp production to full capacity by in 2002.
V3, Infineon collaborate in design boards for TriCore processors News & Analysis 9/27/2000 Post a comment TORONTO--V3 Semiconductor Inc. here today announced a new development board and collaboration with Infineon Technologies AG to support single-board computers with embedded PCI interfaces. V3's new evaluation and reference-design system supports embedded PCI applications using Infineon's TriCore Unified Processor Architecture.
How Zilog aims to pump new life into its Z80 chips News & Analysis 9/27/2000 Post a comment SAN JOSE -- At the Embedded Systems Conference here, Zilog Inc. demonstrated how it hopes to prolong the life of the venerable Z80 8-bit processor architecture. The Campbell, Calif.-based company rolled out a new Internet-enabled version of Z80-based chips, while repositioning the product line for mainstream embedded applications.
On Semi aims to integrate passives with fast transistors on ICs News & Analysis 9/26/2000 Post a comment On Semiconductor here today announced a new development effort to create advanced miniaturization techniques with passive integration technology licensed from Advanced Device Design Inc. (ADD) of Tempe, Ariz. On Semiconductor said it plans to use the technology to develop manufacturing processes that integrate on-chip passives with high-speed silicon transistors.
LSI Logic pushes synthesized Arm processor core to 200 MHz News & Analysis 9/26/2000 Post a comment
MILPITAS, Calif. -- LSI Logic Corp. today announced availability of the industry's first synthesized processor from Arm Ltd. that reaches 200-MHz speeds. The Milpitas company said the synthesized Arm966E-S processor is targeted at communications applications needing highly deterministic control and digital signal processing (DSP) capabilities for such application as digital cellular phones, networking, and mass storage systems.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.