KLA-Tencor speeds metrology for reticles in 0.13-micron fabs News & Analysis 9/26/2000 Post a comment
SAN JOSE -- KLA-Tencor Corp. has introduced a new critical dimension scanning electron microscope (CD-SEM) for measurement and control of advanced photolithography reticles used in volume production of 0.13-micron ICs and 0.10-micron devices under development. The 8250-R system uses KLA-Tencor's CEq charge equalization technology, which the company says will alleviate automation and imaging difficulties for challenging substrates such as chrome on glass and molybdenum silicide reticles.
Zuken rolls out synthesizer for stacked-die packages News & Analysis 9/26/2000 Post a comment WESTFORD, Mass. -- Zuken Ltd.'s U.S. subsidiary here today announced development of a three-dimensional package synthesizer for placement and wiring of multiple chips in 3-D, stacked-die packages. Zuken said it expects to deliver the new 3-D synthesizer to development partner Amkor Technology Inc. by the end of the year. Amkor will have exclusive use of the tool for six months, under its agreement with U.K.-based Zuken.
PMC-Sierra to buy SwitchOn Networks for $450 million in stock News & Analysis 9/26/2000 Post a comment CAMPBELL, Calif.--PMC-Sierra Inc. today announced plans to buy packet-content processor supplier SwitchOn Networks Inc. for $450 million in stock. The acquisition is aimed at giving PMC-Sierra additional processing capabilities for next-generation Internet switches, routers, and high-security networks.
Marvell enters switch-chip market with DSP-embedded device News & Analysis 9/26/2000 Post a comment SUNNYVALE, Calif. -- Marvell Semiconductor Inc. here has entered the switch-chip business, rolling out an integrated solution for low-cost systems in Ethernet- and Fast Ethernet-based networks. Built around Marvell's digital signal processor (DSP) technology, the new 88E6050 is a five-port product that integrates several components on the same device.
Toshiba, SanDisk to sample first 512-Mbit flash from partnership News & Analysis 9/26/2000 Post a comment SUNNYVALE, Calif. -- SanDisk Corp. here and Toshiba Corp. in Japan have completed joint development of a 512-megabit NAND flash memory chip, and the two companies announced plans to begin shipping samples of the device to customers in the fourth quarter this year. The 512-Mbit flash chip is the first jointly-developed product resulting from a partnership announced earlier this year.
LinkUp licenses Bluetooth technology from Signia News & Analysis 9/25/2000 Post a comment
SANTA CLARA, Calif. -- LinkUp Systems Corp. here today entered the wireless arena, announcing that it has licensed Bluetooth technology from Signia Technologies Inc. of Milpitas, Calif.
Under the terms, LinkUp will provide Bluetooth-enabled capabilities for its L7205 processor line, a product based on ARM Ltd.'s 32-bit RISC chip. Designed for a host of embedded applications, LinkUp's L7205 processor also consists of a digital signal processor (DSP), LCD controller, DMA controller, SDRAM, flas
Schlumberger test handler cuts costs with new thermal control technology News & Analysis 9/25/2000 Post a comment SAN JOSE -- Schlumberger Ltd.'s Test & Transactions division today announced a new semiconductor test handler that enables IC testing at multiple temperature settings with a single insertion of devices into systems. The company said its new single-insertion, multi-temperature (SIM-T) handler addresses a growing need for higher reliability of chips.
Rise unveils first x86-compatible processor, inks deal with Acer News & Analysis 9/25/2000 Post a comment SAN JOSE -- Rise Technology Co. here today unveiled its first product-an x86-compatible, system-on-a-chip processor family designed for use in set-top boxes, Internet appliances, and related platforms.
At the same time, Rise and Taiwan's Acer Laboratories Inc. (ALI) announced a multimedia platform solution for set-top boxes that combines Rise's x86-compatible chip and ALI's Aladdin V chip set.
Alchemy licenses DSP technology from Infineon News & Analysis 9/25/2000 Post a comment AUSTIN, Tex. -- Alchemy Semiconductor Inc. here today announced plans to bolster its networking-chip offerings by licensing some digital signal processor (DSP) technology from Infineon Technologies AG.
Under the terms, Alchemy has licensed Infineon's Carmel line of DSPs, including synthesizable versions of both the company's Carmel DSP 10xx and Carmel DSP 20xx core architectures. The Carmel DSP is a 16-bit, fixed-point product designed for high-performance, low-power applications.
Intel offers 850-MHz mobile Pentium III with battery-optimizing mode News & Analysis 9/25/2000 Post a comment SANTA CLARA, Calif.--Intel Corp. today rolled out faster mobile Pentium III processors featuring the company's SpeedStep technology, which automatically adjusts power settings and system speeds to balance performance and battery life in portable PCs. In addition to 850- and 800-MHz mobile Pentium III processors, Intel is also offering a new 700-MHz Celeron for lower-cost portable PCs.
NEC to invest $60 million in U.S.-based wired communications chip unit News & Analysis 9/25/2000 Post a comment TOKYO -- NEC Corp. here today announced plans to invest $60 million over the next three years in a new U.S.-based Communications Strategic Business Unit, which will develop and market semiconductor products and technologies for wired communications systems applications. The expansion of the business unit, based in Santa Clara, is part of NEC's strategy to transform itself into an Internet-focused company.
Toshiba rolls out 0.11-micron gate process, expands ASIC efforts News & Analysis 9/25/2000 Post a comment SAN JOSE -- Toshiba Corp. today launched its next-generation ASIC offering, based on an advanced CMOS process technology with drawn gate lengths of 0.11 micron. Toshiba is also adding new high-performance networking applications to its ASIC market focus in addition to the company's existing emphasis on low-power and high-density chip applications. Production of the new TC280 ASIC series will start in the spring of 2001.
Infineon takes stake in Colorado startup, cross licenses patents News & Analysis 9/25/2000 Post a comment COLORADO SPRINGS, Colo. -- Celis Semiconductor Corp. here today announced Infineon Technologies AG has taken a minority stake in the four-year-old developer of nonvolatile memories and mixed-signal devices as part of a transaction that includes a cross-licensing pact between the two companies
Industry tries to decipher Intel's shortfall; investors dump stock News & Analysis 9/22/2000 Post a comment SANTA CLARA, Calif. -- Technology stocks took a beating today after Intel Corp. announced lower-than-expected sales in the third quarter, leaving the analysts and industry managers trying to comprehend the factors behind the surprising shortfall in revenues at the world's largest chip maker.
Mips, Ampro ink deal to develop embedded products News & Analysis 9/22/2000 Post a comment MOUNTAIN VIEW, Calif. -- Mips Technologies Inc. and Ampro Computers Inc. have announced an agreement that will accelerate the development of Mips processor-based systems and chips for embedded applications.
Under the terms, Ampro will develop single-board system modules based on MIPS' 32-bit RISC processors. Based on Ampro's EnCore platform, the modules will be designed for Internet- and other network-connected embedded systems.
LSI Logic to enter read-channel IC market following Datapath acquisition News & Analysis 9/22/2000 Post a comment MILPITAS, Calif. -- LSI Logic Inc. is preparing to enter the read-channel IC market for hard-disk drives as one major player--Texas Instruments Inc.--pulls out of the business. At this week's Diskcon trade show in San Jose, LSI Logic dislosed plans to use read-channel technology from recently acquired DataPath Systems Inc. to offer both standard products and customized ASICs for disk-drive applications, starting in the third quarter of 2001.
Macronix grows sales to $1 billion, inks pacts with Analog Devices, Nintendo News & Analysis 9/22/2000 Post a comment HSINCHU, Taiwan -- Closing in on $1 billion in sales this year, Taiwan's Macronix International Co. Ltd. is pushing to expand its chip portfolio by quietly forging separate deals with Analog Devices Inc. and Nintendo Ltd. Macronix is working on a deal with Analog Devices to develop system-on-a-chip products based digital signal processor technology and flash memory. The company is also expanding its ties with Japan's Nintendo, its largest chip customer, to create a new line of chips for a next-g
Chip gear index rises in August with $3 billion in tool orders News & Analysis 9/22/2000 Post a comment SAN JOSE--The year-and-a-half recovery in semiconductor equipment spending continued a little stronger than expected in August, with the book-to-bill ratio for North American-based suppliers rising slightly. Orders for chip-production tools hit a record three-month average of $3 billion in August, which nudged up the book-to-bill to 1.24, said the Semiconductor Equipment and Materials International (SEMI) trade group here.
Xilinx buys formal verification technology from French EDA company News & Analysis 9/21/2000 Post a comment SAN JOSE--Xilinx Inc. today announced the purchase of formal design verification technology from Veriphia, a French electronic design automation company based in Sophia-Antopolis. Along with the purchase of Veriphia's formal verification tool suit, Xilinx said it has hired key engineers responsible for the development of the technology. The verification is expected to complement support for Xilinx's 10-million gate field-programmable gate arrays (FPGAs).
AMCC buys developer of I/O, transceivers for optical IC thrust News & Analysis 9/21/2000 Post a comment SAN DIEGO--Applied Micro Circuits Corp. (AMCC) here today announced it has acquired privately-held SiLutia of Fort Collins, Colo., a digital and mixed-signal company focused on high-speed, low-power I/O and transceiver designs for broadband communications. The acquisition is part of AMCC's efforts to expand its integration and serial backplane technologies for networking products.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.