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posted in September 2007
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MCUs add flash, cut power budgets
News & Analysis  
9/3/2007   Post a comment
To help OEMs expand into new embedded markets without having to allocate valuable capital in software rewrites or convert to a new architecture, microcontroller vendors are developing product strategies that include building parts that consume less power, include a larger amount of on-chip flash memory, deliver multicore architectures and offer higher integration.
Brazil treads tough terrain in quest to become IC design hub
News & Analysis  
9/3/2007   Post a comment
There is a saying among suppliers of semiconductors and other electronic products to the booming Brazilian market: "Miami is Brazil."
Under the Hood: 1-Gbit DDR3 SDRAMs square off
9/3/2007   Post a comment
With the launch of Intel's P35 chip sets, the growing list of validated devices and AMD's planned support, DDR3 SDRAMs have become a reality.
Enabling digital microphones with CMOS
Design How-To  
9/3/2007   Post a comment
As micromachining of electret microphones has improved over the years, microphones have become smaller, and their element capacitance has decreased.
p-OLED display maker expands Asian sales channels
Product News  
9/3/2007   Post a comment
Plastic OLED microdisplay specialist MicroEmissive Displays (MED) has appointed another two partners in the Far East to serve its key Asian markets.
Global chip sales up 2.2% from last July
News & Analysis  
9/3/2007   Post a comment
The three-month average of global chip sales for July, was $20.6 billion, up 3.2 percent on the previous month and an increase of 2.2 percent for year-on-year growth, according to numbers from the World Semiconductor Trade Statistics organization. The three-month average of sales of semiconductors in Europe in July 2007 reached $3.28 billion, an annual growth of 3.5 percent.
DEK, BTU partner for solar cell manufacturing
News & Analysis  
9/3/2007   Post a comment
Semiconductor manufacturing equipment makers DEK and BTU International are joining forces to develop and supply solar cell makers with a turnkey in-line metallization process.
Fundamentals of embedded audio, part 1
Design How-To  
9/3/2007   Post a comment
Part 1 of this 3-part series explains the basics of audio converters and the common standards for connecting processors to these converters.
Ten-dollar DaVinci does HD at 400 mW
Product News  
9/3/2007   Post a comment
Texas Instruments has added to its DaVinci family of video-oriented chips.
Enriching the connected car driving experience: Part 1 - connected platforms and the Rich Internet
Design How-To  
9/1/2007   Post a comment
X86 platform architecture delivers a rich and interactive in-car experience in a way that's difficult for non-PC-compatible platforms--and bridges the gap between automotive and consumer product lifecycles.
Motherboard supports two quad processors
Product News  
9/1/2007   Post a comment
ITOX announced the introduction of the G7B630-NRM-G motherboard supporting Intel Core 2 Quad processors.
<<   <   Page 15 / 15

As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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