OSRAM'S new 3-in-1 hybrid sensor Product News 9/3/2011 Post a comment The new 3-in-1 SFH 7773 digital sensor from OSRAM Opto Semiconductors makes it easy to install both proximity and ambient light sensing in smart phones and similar devices by combining the functions of a digital ambient light sensor and a digital proximity sensor in a single compact unit.
Chips in Space: Design challenges, intrigue and solutions Blog 9/3/2011 4 comments We’ve covered a lot of ground in the past seven blog posts. The story had a beginning of an idea (hey, let’s fill a suit with electronics and toss it out of the International Space Station!). Twist and turns (we lost the suit, now what?!). Heroic recovery (that’s a nice aluminum space frame you got there!). And a happy ending (We have liftoff! ARISSat-1 is successfully operating in space!).
IHS projects record growth for consumer MEMS News & Analysis 9/2/2011 5 comments The market for microelectromechanical systems in consumer electronics and mobile communications devices is on pace for record growth in 2011, thanks to the red hot media tablet and smartphone markets, according to market research firm IHS iSuppli.
New JEDEC spec online Blog 9/2/2011 2 comments I just heard from my contacts at JEDEC that they have issued Release 4 of the DDR3 Serial Presence Detect (SPD) Specification.
Synopsys buys Indian verification firm News & Analysis 9/2/2011 4 comments EDA and IP company Synopsys Inc. has acquired nSys Design Systems Private Ltd. (New Delhi, India), a supplier of verification intellectual property, for an undisclosed amount of money.
Japan up, RoW down in flat July chip sales News & Analysis 9/2/2011 3 comments It remains to be seen whether seasonal growth or economic uncertainty will characterize the global chip market in the second-half of 2011 as the July numbers favored neither side of the argument and came in flat and in-line with expectations.
Zarlink says it has other suitors News & Analysis 9/1/2011 3 comments Canadian mixed-signal chipmaker Zarlink Semiconductor said its board of directors is negotiating with 15 unidentified third parties interested in acquiring all or part of the company.
Mobile measurement supports onboard EHV high-voltage testing Design How-To 9/1/2011 Post a comment On-road EHV testing calls for considerably greater data acquisition and wiring challenges than stationary applications. Onboard or road test data collection within a typical test track environment subjects instrumentation to higher-than-usual shock and vibration inputs, placing greater mechanical demands upon components and systems.
Researchers aim for energy-harvesting CPUs News & Analysis 9/1/2011 5 comments A team of researchers from Virginia Commonwealth University was awarded two grants to create powerful, energy-efficient computer processors that can run an embedded system without requiring battery power.
Ti offers 'Qi' inductive power transfer IC News & Analysis 9/1/2011 6 comments Texas Instruments has introduced the bq500210, an IC that controls and transfers wireless power for contactless chargers compliant with the Qi standard from the Wireless Power Consortium.
Intel invests in device security firm Mocana News & Analysis 9/1/2011 2 comments Intel Capital, the venture capital arm of the world's biggest semiconductor maker, has made a strategic investment of undisclosed size in Mocana, a provider of mobile and smart device security.
UK plans for white-space radio by 2013 News & Analysis 9/1/2011 1 comment Ofcom, the U.K. government's communications regulator, has issued a statement that white-space radio could be used for a mix of rural broadband, Wi-Fi services and machine-to-machine communications and that the technology could be launched in 2013.
Analyst sees firm July, raises chip forecast News & Analysis 9/1/2011 2 comments The three-month average of global chip sales for July is going to be reported as $24.8 billion, up compared with a figure of $24.68 billion reported for June by World Semiconductor Trade Statistics organization, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.