ASML Buys Hermes for $3.1B News & Analysis 6/16/2016 1 comment ASML will spend $3.1 billion to buy Hermes Microvision for its e-beam tools that support the roll out of extreme ultraviolet lithography.
Cavium Buys QLogic for $1B News & Analysis 6/15/2016 3 comments Cavium will expand from a range of security, comms and server processors and switches into storage and networking with the acquisition for $1 billion of Qlogic.
Printed Memory to Secure IoT News & Analysis 6/13/2016 1 comment In the Internet of Things era, there are still scenarios where a low-cost, unconnected memory might make more sense than a connected device.
FD SOI Benefits Rise at 14nm Blog 6/13/2016 13 comments Consultant Handel Jones makes the case that companies should move rapidly to 14nm fully depleted silicon-on-insulator (FD SOI) to use the benefits this technology.
17 Views from Imec Tech Forum Slideshow 5/27/2016 5 comments The annual Imec Technology Forum provided insights on the silicon road map including the outlook for EUV and FinFETs as well as an update on the Internet of Things.
Accelerators Unite ARM, IBM, X86 News & Analysis 5/23/2016 2 comments Seven chip companies will define a cache-coherent interface between accelerators and server processors spanning ARM, IBM Power and x86 architectures.
Google’s TPU Hit a Tight Sked News & Analysis 5/19/2016 6 comments Norman Jouppi, a veteran processor and server engineering manager, shares some of the story behind Google’s custom accelerator for machine learning.
Google Designing AI Processors News & Analysis 5/18/2016 23 comments Google has developed and is running in its data centers a custom accelerator for artificial intelligence its calls a tensor processing unit.
MEMS Broadens Its Horizons Blog 5/17/2016 Post a comment The continued steady growth in the MEMS market overall masks wide variation across the industry’s changing sectors, according to speakers presenting at SEMICON West in July.
Lam, KLA Deal Faces DoJ Scrutiny News & Analysis 5/15/2016 Post a comment Analysts are divided on whether a U.S. request for more information on the proposed $10.6 billion deal to combine Lam Research and KLA-Tencor spells the beginning of the end for the merger.
ePaper Makes Inroads into Smart Packaging Blog 5/6/2016 Post a comment To combat high implementation costs, E Ink has integrated an ePaper display with an RFID system, which can be used to monitor the condition of environmentally-sensitive products such as blood, vaccines and biomedical drugs.
Ams Breaks Ground on N.Y. Fab News & Analysis 4/20/2016 1 comment AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
Intel Reorg Shows Clouds Ahead News & Analysis 4/20/2016 11 comments Intel's $1.2 billion plan to cut 12,000 employees amid an accelerating PC decline got a mixed reception from market watchers noting issues in memory, IoT and data center markets.
Data Centers Hit the Accelerator News & Analysis 4/15/2016 12 comments Engineers need to re-invent the server to better handle emerging jobs such as machine learning, said an executive with Microsoft’s cloud computing group.
FD-SOI Expands, But Is It Disruptive? News & Analysis 4/14/2016 5 comments The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
5G Work Starts in Earnest News & Analysis 4/13/2016 1 comment This week engineers started hearing proposals on everything from radio access technologies to network architectures for 5G cellular standards expected before 2020.
10nm DDR4 DRAM Could Defy Moore News & Analysis 4/7/2016 5 comments Samsung said it has overcome scaling challenges to address scaling challenges that were previously thought to mean the end of Moore's Law.
Intel Disrupts Client Management News & Analysis 4/4/2016 5 comments Two, possibly three, top managers have left Intel in the aftershock of Intel’s CEO hiring a Qualcomm executive as his number two in client systems.
EDA Group Broadens Mission News & Analysis 3/31/2016 10 comments The EDA Consortium renamed itself the Electronic System Design Alliance, taking on a broader role including semiconductor IP, embedded software and advanced packaging.
Flash Rides HPE’s Memory Bus News & Analysis 3/29/2016 2 comments Hewlett Packard Enterprise is shipping NVDIMM-N modules, the first in a new line of persistent memory cards analysts say will bolster servers.
Silicon Lacks Clear Metrics News & Analysis 3/24/2016 17 comments With no absolute way to compare process technologies, analysts differ over whether Intel, Samsung or TSMC provides better foundry nodes.
Panel Ponders MEMS Roadmaps, a Moore's Law of MEMS News & Analysis 3/16/2016 Post a comment Could oversupply be coming to MEMS? A panel at the MEMS & Sensors Technical Congress held in Munich, Germany, this month was asked to find solutions to challenges to the growth of the MEMS industry over the next decade but raised more questions than answers.
TSMC Details Silicon Road Map News & Analysis 3/16/2016 22 comments TSMC described its 7nm plans, likely the last stop for FinFETs, as well as its progress on 16 and 10nm nodes, and gave a glimpse at the unknown beyond it for semiconductors.
Facebook Likes Intel's 3D XPoint Slideshow 3/10/2016 7 comments Facebook endorsed Intel’s 3D XPoint memories and got Google to join its Open Compute Project at its annual event that included new processors from Intel and networking code from Microsoft.
3D Printing Will Rock Manufacturing Blog 3/7/2016 10 comments A world full of 3D printers that can make almost anything probably will be an almost inconceivably complex place, where products and blueprints are designed, customized, made and sold by an uncountable number of companies and home printers offering a dizzying array of products.
Broadcom Identifies $300M Cuts News & Analysis 3/3/2016 13 comments A month after Avago closed the $37 billion deal to acquire Broadcom it created as many as 24 new divisions and announced plans to discontinue $300 million non-core businesses.
Chip Makers Need New Business Models Blog 3/2/2016 12 comments The semiconductor industry needs to consider new business models based on open source hardware, re-programmable silicon and Features-as-a-Service to drive its next phase of growth.
10 Views of Security at RSA Slideshow 3/2/2016 2 comments The U.S. attorney general, head of the NSA and president of Microsoft were among those commenting on the Apple-FBI case and the future of cryptography at the RSA Conference.
Cisco Rolls 16nm ASICs News & Analysis 3/1/2016 2 comments Cisco rolled its first 16nm ASICs for new data center switches that leapfrog capabilities of Broadcom's chips.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.