Intel commits $200 million to Obama startup plan News & Analysis 1/31/2011 8 comments Intel Corp. has joined President Obama's Startup America campaign to strengthen entrepreneurship in the United States and, through Intel Capital, has pledged to invest an additional $200 million in U.S. technology companies and joined the campaign's board of advisors.
Europe awards contract to assess 450-mm pilot line News & Analysis 1/27/2011 Post a comment Two consultancy firms with expertise in the semiconductor industry – Future Horizons Ltd. and Decision SA – have been awarded a one-year joint contract to assess the benefits of a 450-mm semiconductor prototyping line being located in Europe.
Tech's turn on top Automotive DesignLine Blog 1/27/2011 6 comments Technology grabbed the majority of time in President Obama's State of the Union speech. But where do we go from here?
GaN depo process said to make brighter LEDs News & Analysis 1/26/2011 5 comments Researchers from North Carolina State University have developed a gallium nitride deposition process said to result in 1,000 times fewer defects, thereby boosting the output of light-emitting diodes as well as other GaN devices such as power transistors.
MEMS-based tracking tags to bring biobanking to mass market News & Analysis 1/24/2011 Post a comment STMicroelectronics and Bluechiip are to cooperate to bring Bluechiip's patented tracking tag concept into mass production for healthcare and a wide range of other applications including biobanking - the identification, tracking, retrieving, monitoring and storing of human biospecimens.
R&D contractor raises $6 million Research 1/21/2011 3 comments Presto Engineering Inc., a company which has pioneered contract R&D services for semiconductor companies, has said it has received $6 million in funding to support. The funding round was led by CM-CIC Capital Prive and included existing investor Masseran Gestion.
Thin Film designs addressable plastic memory Research 1/21/2011 1 comment Thin Film Electronics ASA has announced it has designed a 128-bit thin film addressable memory in a printable plastic material in collaboration with the Palo Alto Research Center of Xerox (PARC).
Oxford forms 10 billion qubits in silicon Research 1/21/2011 4 comments Scientists from Oxford University have generated 10 billion bits of quantum entanglement in silicon for the first time. The achievement is a significant step towards a quantum computer, according to the research team.
'Universal' memory aims to replace flash/DRAM News & Analysis 1/21/2011 24 comments A single "universal" memory technology that combines the speed of DRAM with the non-volatility and density of flash memory was recently invented at North Carolina State University, according to researchers.
UMC adds CMOS-MEMS sensors to foundry model News & Analysis 1/20/2011 1 comment Foundry chipmaker United Microelectronics Corp. has started producing microelectromechanical systems (MEMS) sensor products for customers and has volume production scheduled for later this year. The achievement follows three years of MEMS technology development. UMC said.
Brightest nanoparticles shun quantum News & Analysis 1/19/2011 23 comments Researchers who claim to have developed the brightest nanoparticles say they have potential applications in medicine, biology, material science, and environmental protection.
Plastic Logic to get $700 million in Russian deal News & Analysis 1/18/2011 8 comments Plastic Logic, a struggling venture capital backed company, which specializes in organic electronics, is set to receive $700 million in deal backed by Rusnano, the technology investment arm of the Russian state.
Startup develops printable, low-cost solar cell News & Analysis 1/18/2011 6 comments Oxford Photovoltaics Ltd., a company recently spun out from the University of Oxford has developed a solar cell technology that is manufactured from low-cost, abundant, non-toxic and non-corrosive materials and can be scaled to any volume.
What's after NAND? Blog 1/18/2011 5 comments Seems to me that everyone is speculating on the future of NAND flash these days, and how it will affect the existing storage market.
Software defined radio: defining the challenges Design How-To 1/18/2011 10 comments Software defined radio (SDR) has become a hot topic in the industry and is seen as a solution for many of the development problems for new radio platforms. But what is really meant by software defined radio?
CEA-Leti ramps up 300-mm 3-D fab News & Analysis 1/17/2011 4 comments France's CEA-Leti research center in Grenoble has begun to ramp up production on its 300-mm wafer fabrication facility dedicated to 3D-integration applications.
Solid-state quantum memory unveiled News & Analysis 1/14/2011 12 comments Broadband quantum networks inched closer to reality when researchers demonstrated the ability to transfer quantum-bits from entangled photons to solid-state crystalline memory devices.
Microfluidic pumps focus liquid lens News & Analysis 1/13/2011 5 comments Rensselaer Polytechnic Institute has shown a liquid lens with a focal length that can be electrically adjusted with tiny microfluidic pistons with no moving parts, a breakthrough it says could boost all types of precision imaging applications.
Optical control of graphene supports sensors Research 1/11/2011 1 comment The team of scientists has published research showing how light can be used to control the electrical properties of graphene and is claiming the move marks progress in the development of graphene devices.
An EE Times CES compendium News & Analysis 1/10/2011 4 comments Herewith is a compendium of EE Times coverage of and from the Consumer Electronics Show, held in Las Vegas, Jan. 6 to 9.
Nissan Chemical joins Sematech’s resist center News & Analysis 1/10/2011 Post a comment Nissan Chemical Industries, Ltd., has joined Sematech’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to collaborate on advanced adhesion enhancing materials in extreme ultraviolet lithography for 22nm chips.
UT printed electronics has build-up research News & Analysis 1/10/2011 Post a comment The University of Texas at El Paso wants to become a center for research in printing electronics using a bottom-up additive approach. The center is being funded by the Texas Emerging Technology Fund, Lockheed Martin and the University of Texas System for an initial total $9 million.
U.S. needs converged R&D play in life sciences News & Analysis 1/4/2011 4 comments The United States should capitalize on the trend of convergence of life, physical, and engineering sciences to foster the innovation necessary to meet the growing demand for accessible, affordable health care.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments