IBM's Watson goes to college News & Analysis 1/31/2013 4 comments A general-purpose version of the IBM Watson supercomputer that won on the game show Jeopardy will be installed at Rensselaer Polytechnic Institute.
Intel's 450-mm wafer spend starts in 2013 Design How-To 1/24/2013 6 comments Intel has set a capital expenditure budget of $2 billion in 2013 related to the construction of the company's first development facility for 450-mm diameter wafers. The core capex was maintained at about $11 billion.
Imprint litho firm claims 450-mm first News & Analysis 1/18/2013 8 comments An imprint lithography machine from Texas-based Molecular Imprints has been used for full patterning of 450-mm diameter wafers. The company claims the machine could shorten the transition to 450-mm wafer processing by two years.
London Calling: A northern light startup Blog 1/3/2013 3 comments The far north has the aurora borealis and, in the winter, a need for controllable lighting. So it should be no surprise that a Finnish cluster of expertise is developing around the topic of solid-state illumination.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.