IBM's Watson goes to college News & Analysis 1/31/2013 4 comments A general-purpose version of the IBM Watson supercomputer that won on the game show Jeopardy will be installed at Rensselaer Polytechnic Institute.
Intel's 450-mm wafer spend starts in 2013 Design How-To 1/24/2013 6 comments Intel has set a capital expenditure budget of $2 billion in 2013 related to the construction of the company's first development facility for 450-mm diameter wafers. The core capex was maintained at about $11 billion.
Imprint litho firm claims 450-mm first News & Analysis 1/18/2013 8 comments An imprint lithography machine from Texas-based Molecular Imprints has been used for full patterning of 450-mm diameter wafers. The company claims the machine could shorten the transition to 450-mm wafer processing by two years.
London Calling: A northern light startup Blog 1/3/2013 3 comments The far north has the aurora borealis and, in the winter, a need for controllable lighting. So it should be no surprise that a Finnish cluster of expertise is developing around the topic of solid-state illumination.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.