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Content tagged with Advanced Technology
posted in October 2009
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Counterpoint: Synergies could trigger a Synopsys-ARM merger
News & Analysis  
10/13/2009   8 comments
Semiconductor intellectual property (IP) is a way for chip makers to share the cost of developing standard designs so that they can invest more in the differentiating features of their chips. For ARM to be controlled by any one of its customers or even a small group of its customers would break the IP business model.
Ultra-low-power capacitive sensor and touch sensing software suite
Product News  
10/12/2009   Post a comment
Freescale expands its intelligent touch sensing offering with the MPR121 ultra-low-power capacitive sensor and a touch sensing software suite compatible with more than 300 of the company 8-bit MCUs.
ARC, Virage Logic "a done deal" says CFO
News & Analysis  
10/12/2009   Post a comment
Shares in ARC International plc (St Albans, England), the specialist licensor of configurable processor cores, are set to be delisted from the London Stock Exchange early next month, following Virage
IBM claiming ultra-fast optical comms with carbon chips
News & Analysis  
10/12/2009   Post a comment
IBM Corp. researchers have demonstrated that graphene, an atoms-thin layer of crystalline carbon, acts as a receiver of optical signals.
Analysis: The awful cost of a departing CEO's silence
News & Analysis  
10/12/2009   3 comments
The global economic downturn wreaked havoc on electronic industry sales in the last year but it has also become clear that some executives were either unsuited for the roles they were asked to fill or simply failed to perform at the superstar level required by their oversized compensation packages.
G24 ships solar cells for 'electronic bags'
News & Analysis  
10/12/2009   Post a comment
G24 Innovations Ltd. (Cardiff, Wales), a pioneer of dye-sensitized thin-film solar cells, has made its first commercial shipment of photovoltaic modules. They have been sent to consumer bag manufacturer, Mascotte Industrial Associates Ltd. (Hong Kong). Mascotte will include the photovoltaic panel in a range of bags and backpacks.
Will Tessera's 'smart module' gamble pay off?
News & Analysis  
10/12/2009   Post a comment
With little or no fanfare, Tessera Technologies Inc. has accomplished a rare feat: It is one of the few intellectual-property (IP) chip companies that is making money.
Insolvent Qimonda launches IP licensing group
Product News  
10/12/2009   Post a comment
Insolvent memory chip manufacturer Qimonda has established a company dedicated to the company's semiconductor license business. On the block is what insolvency administrator Michal Jaff calls one of the world's largest semiconductor-related patent portfolios.
Using a design-to-test capability for LTE MIMO (Part 2 of 2)
Design How-To  
10/12/2009   Post a comment
System-level simulation helps engineers gain valuable insight into the design sensitivities of Long Term Evolution (LTE) Multiple-Input Multiple-Output (MIMO) systems
One time programmable 2.4GHz SoCs target low-cost market
Product News  
10/12/2009   Post a comment
The Nordic Semiconductor nRF24LE1 OTP and nRF24LU1+ OTP target the most fiercely price sensitive consumer segments of the ultra-low power wireless market that do not require flash memory.
Analyst: IC design outsourcing decline set to continue
News & Analysis  
10/12/2009   Post a comment
Chip design outsourcing growth fell to 6.5 percent last year, down from nearly 34 percent the year earlier, and the number of chip design starts are expected to fall another 18 percent this year, analysts at Gartner have warned.
NXP to transfer CMOS IP, staff to Virage Logic
News & Analysis  
10/12/2009   1 comment
Dutch chip company NXP BV (Eindhoven, The Netherlands) has agreed to transfer part of its advanced CMOS intellectual property (IP) rights, 160 staff and certain engineering equipment to Virage Logic Corp. (Fremont, Calif.).
PCB layout and routing solution offers enhanced editing functionality
Product News  
10/12/2009   1 comment
Zuken launched version 12 of its PCB layout, placement and routing solution CR-5000 Board Designer. The new version has been developed with enhanced editing functionality, collaboration, and verification capabilities.
NAND Flash competition fueled by advanced lithography technology
News & Analysis  
10/12/2009   1 comment
NAND Flash memory is the most competitive market in the semiconductor industry.
New OSRAM Stack DRAGON doubles IR LED power in a compact package
Product News  
10/9/2009   Post a comment
The new infrared Platinum Stack DRAGON from OSRAM Opto Semiconductors provides high optical output from a small surface area, creating an ideal high-radiance solution for automotive, industrial and consumer applications where space is limited.
10Gbit/s wireless components fall in place
Product News  
10/9/2009   Post a comment
Researchers at the Dresden Technical University have achieved data transmission at a speed of 10 Gbit/s aiming at wireless personal networks (PAN).
Zumtobel, Fraunhofer launch OLED lighting JV
Product News  
10/9/2009   Post a comment
Lighting technology group Zumtobel (Dornbirn, Austria) and the Dresden (Germany) based Fraunhofer Institute for Photonic Microsystems (IPMS) plan to launch a joint venture dedicated to the commercial production of OLED-based illuminants.
NASA prepares to bomb the moon
News & Analysis  
10/8/2009   2 comments
A Web site will stream live telescope images of the impact of a NASA lunar probe searching for water.
Audio preamplifier chipset allows designers to tradeoff power vs. dynamic range
Product News  
10/8/2009   Post a comment
THAT has introduced a high-performance digitally programmable microphone preamplifier chipset that it says enables much greater flexibility with up to 130dB dynamic range when operating from ±17V supplies, compared to competing single-chip implementations that operate from only ± 5V supplies.
Video: Startup packs dialysis into wearable device
News & Analysis  
10/8/2009   Post a comment
Dutch startup Nanodialysis hopes to use nanoparticles and electronics to create a wearable dialysis system, eliminating routine trips to the hospital for patients with renal failure.
Ramtron samples RF-enabled wireless memory
Product News  
10/7/2009   Post a comment
Ramtron has begun beta sampling its first MaxArias wireless memory product to customers across several industries.
AM/FM antenna ICs deliver a variety of integrated features
Product News  
10/7/2009   Post a comment
An active antenna IC designed for AM/FM car antenna applications, the ATR4252 from Atmel Corporation is a highly integrated device that offers a host of features including automatic gain control (AGC), supply voltage regulator with overvoltage protection and an antenna sensor.
Taoglas : SMT GPS antennas resist reflow soldering
Product News  
10/7/2009   Post a comment
Taoglas has launched the SGP series of surface mount (SMT) GPS antenna products guaranteed to pass final device product certification for reflow solder profile tests, device environmental tests (temperature, humidity etc) and mechanical testing (shock, vibration etc.) for machine-to-machine (M2M) telematics devices.
Audium : Audio amplifier is more efficient than Class D
Product News  
10/7/2009   Post a comment
Audium Semiconductor has launched an audio power amplifier IC which, at normal listening levels, is claimed to be 20 times more efficient than competing devices, such as Class D amplifiers, without compromising audio quality.
Using a design-to-test capability for LTE MIMO (Part 1 of 2)
Design How-To  
10/7/2009   Post a comment
System-level simulation helps engineers gain valuable insight into the design sensitivities of System-level simulation helps engineers gain valuable insight into the design sensitivities of Long Term Evolution (LTE) Multiple-Input Multiple-Output (MIMO) systems
Commentary: Can Russia develop a nanotech industry?
News & Analysis  
10/7/2009   2 comments
Russia's president Dmitry Medvedev wants Russia to move full speed ahead in developing a nanotechnology industry to weed the country from its dependency on profits from its vast oil and gas natural resources.
Improve UMTS and HSDPA Coverage 5-Fold with Inward-Facing Cells in a Simulcast Architecture
Design How-To  
10/7/2009   Post a comment
Wireless service providers must find ways to optimize high performance UMTS/HSDPA broadband service to maximize both ROI and the quality of service. Success will require new architecture thinking beyond traditional macro cell and micro cell coverage.
Plastic Logic eBook reader to target business users
Product News  
10/6/2009   Post a comment
Plastic Logic will roll out an e-book reader based on its proprietary backplane technology at next year's Consumer Electronics Show in Las Vegas. In contrast to competing devices from Amazon and Sony, the Plastic Logic reader will focus on business users' needs.Plastic Logic will roll out an e-book reader based on its proprietary backplane technology at next year's Consumer Electronics Show in Las Vegas. In contrast to competing devices from Amazon and Sony, the Plastic Logic reader will focus o
Video: Plugging into the neuron
News & Analysis  
10/6/2009   2 comments
Researchers at IMEC are growing neurons on a novel silicon device, burrowing deeper into the mysteries of the human brain in efforts that aim to bring nanoscale electronics to bear on neural science.
TAOS, Inc. joins LCD TV Association to support industry energy conservation initiatives
Product News  
10/6/2009   Post a comment
Texas Advanced Optoelectronic Solutions, Inc announced the company has joined the LCD TV Association.
The benefits of innovative collaboration
Blog  
10/6/2009   Post a comment
IMEC's latest industrial affiliation program aimed at fabless and fablite companies is a welcome program for both IP and EDA vendors.
IMEC launches integrated solutions for technology exploration
News & Analysis  
10/6/2009   Post a comment
IMEC launched the industrial affiliation program (IIAP) INSITE or Integrated Solutions for Technology Exploration, aimed at fabless and fablite companies.
Watertight, low-power micro-actuator probes brain, in-vivo
News & Analysis  
10/6/2009   Post a comment
Using the principal of hydrophobia, scientists at IMEC have overcome the problem of making their ultra-low-power 'inch-worm' micro-actuator watertight, thereby opening up a wide range of in-vivo biomedical applications, including recording the activity of individual neurons in the brain.
SiBeam readies 2nd gen Wireless HD chip
Product News  
10/6/2009   Post a comment
SiBeam, a pioneer in 60GHz chips for wireless video networking, is demonstrating its second generation chipsets based on the WirelessHD specification at this week's CEATEC Japan exhibition.
Fastboot technology for ultra small Intel Atom processor designs
Design How-To  
10/5/2009   3 comments
With automotive head units increasingly being implemented as an integrated computing device, boot times are becoming a critical factor. While x86-based computers are known for their long start-up times, there are techniques to drastically speed up this process.
Book Excerpt--RF Front-End: World Class Designs (Part 7 of 7)
Design How-To  
10/5/2009   Post a comment
Learn about RF/IF circuits from Chapter 9 of this recently published book, presented here in serial form
Best practices interoperability guide approved for IP verification
News & Analysis  
10/5/2009   Post a comment
Accellera announced it has approved the Accellera Verification Intellectual Property (VIP) Best Practices Interoperability Guide, a document resulting from the work of its VIP Technical Subcommittee (TSC), which was formed in May 2008.
ASIC North enters analog IP market
News & Analysis  
10/3/2009   Post a comment
Design service company ASIC North, Inc. has entered the analog intellectual property market by offering IP for analog-to-digital converters.
Quantum dots mapped at atomic scale
News & Analysis  
10/2/2009   1 comment
Atomic-scale mapping of quantum dots could break the bottleneck to self-assembly of chips based on quantum-dot arrays, say the University of Michigan researchers who developed the mapping technique.
Nanotubes grown as metals, semiconductors
News & Analysis  
10/2/2009   Post a comment
Researchers have learned how to control the formation of carbon nanotubes so that they have either metallic or semiconducting properties.
IMEC tapes out Etna 3-D stacking chip
News & Analysis  
10/1/2009   Post a comment
The IMEC research center (Leuven, Belgium) and its 3-D integration partners have taped-out Etna, a 3-D chip that integrates a standard DRAM chip on top of a logic IC. The 3-D stack consists of a 25-micron thick logic die on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps.
Researchers integrate fuel cells on chip level
Product News  
10/1/2009   Post a comment
A research group of the Freiburg university (Germany) and semiconductor vendor Micronas AG has integrated a fuel cell array on a chip. The device could power autonomous microsystems, also known as 'Smart dust'.
Altair offers 4G LTE baseband chip
Product News  
10/1/2009   Post a comment
Altair Semiconductor Ltd. (Hod Hasharon, Israel), a 4G communications chip company, has announced the commercial availability of its LTE baseband chip, the FourGee-3100.
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