Graphene bandgap opened by vapor News & Analysis 10/29/2010 10 comments Tuning a semiconductor bandgap in sheets of pure carbon called graphene can be done using water vapor during fabrication, according to researchers from Rensselaer Polytechnic Institute.
Design implications of Energy Efficient Ethernet (EEE) Design How-To 10/28/2010 Post a comment
On September 30th, the IEEE ratified IEEE Std. 802.3az-2010, specifying the technology and requirements for the development of Energy Efficient Ethernet (EEE) components and systems. This paper outlines the basic premise and features of the amendment and how it can impact your next design.
Diagram generation tools modernize automotive electrical design Design How-To 10/28/2010 Post a comment Automated wiring and component diagram generation decreases design engineers "drafting" tasks, while synchronizing and updating process documentation for increased productivity. Automation brings consistency and standardization, while modern tools permit customization for proprietary purposes.
IBM, European researchers seek CMOS successor News & Analysis 10/27/2010 6 comments IBM Research Zurich, Infineon Technologies and Globalfoundries have joined forces with a half dozen European universities and research centers on a mission to cut the power consumption of electronic devices by10-fold and reduce standby power to zero.
Electronically 'stoking' a Corvette Blog 10/25/2010 2 comments If you missed the QNX Corvette at Convergence 2010, you can still see its reconfigurable digital instrument cluster and versatile application platform HMI at the ARM Technology Conference in November.
Scenes from USA tech fest News & Analysis 10/25/2010 8 comments Photos from the USA Science & Engineering Festival, a two-day event held on the National Mall that drew tens of thousands of participants.
PCM Scalability:The Myth (Part 2) Design How-To 10/24/2010 2 comments Ron Neale expands on some of the points he made in his earlier feature and addresses some of the comments from EETimes’ expert readers that were generated as a result of the first article.
IMEC sets up R&D center in Taiwan News & Analysis 10/20/2010 2 comments European research institute IMEC signed a co-funding contract with the Taiwanese Ministry of Economic Affairs to establish an R&D facility, the IMEC Taiwan Innovation Centre.
CEL ZigBee module ranges 2.5 miles Product News 10/20/2010 Post a comment Designed for ZigBee Pro applications, the module runs the full ZigBee Pro software stack and Smart Energy profile, making it well suited for applications such as smart meters, smart grid, building automation, remote control, and HVAC.
Xtrinsic sensors trigger satellite airbags News & Analysis 10/19/2010 2 comments Claiming to shrink the size, increase the reliability and lower the cost of satellite airbag sensors, Freescale Semiconductor unveiled smart Xtrinsic airbag accelerometers at the Convergence 2010 automotive tradeshow in Detroit.
France's CNRS offers nano-memory IP News & Analysis 10/19/2010 3 comments France's Centre National de la Recherche Scientifique (CNRS) has done preliminary work on several nanoelectronic memory technologies that it now wishes to progress further through licensing agreements.
Chevy Volt flap: What's the big deal? Automotive DesignLine Blog 10/18/2010 41 comments Some fans of electric cars and hybrids, and a few folks in the press, are getting all in a knot about Chevy actually having a "direct link" from the gas engine to the wheels in its Volt "range-assisted" electric car. Well maybe its just good engineering.
Peregrine_RF front end adapts for increased mobile data demand Design How-To 10/18/2010 5 comments The industry is predicting that data volumes could reach 2.7 exabytes per year in 2010 and that volume could increase to between 20 and 90 exabytes in 2015. This expansion is driven by the consumer’s rapid adoption of smartphone and other datacentric terminals, such as datacards, e-readers, and laptops. In order to support this type of data explosion, operators will need to take a multi-pronged approach: redefining how we think of the RF front end.
Triple-mode graphene transistors go analog News & Analysis 10/15/2010 18 comments Rice University researchers have demonstrated analog graphene transistors that can amplify like p-type and n-type silicon transistors, and also exploit the ambipolar ability of graphene in a novel frequency-multiplication mode.
GlobalFoundries, SVTC team for MEMS foundry News & Analysis 10/13/2010 13 comments GlobalFoundries Inc. has announced a technology development partnership with SVTC Technologies LLC that it says will help make it a leading foundry manufacturer of microelectromechanical systems (MEMS).
Catania solar 'fab' appoints chairman and CEO News & Analysis 10/13/2010 Post a comment Enel Green Power, Sharp and STMicroelectronics, the three companies turning a former ST wafer fab shell into Italy’s biggest photovoltaic panel factory, have announced the appointment of the chairman and CEO for their joint venture.
ST's Carmelo Papa appointed chairman of EPoSS News & Analysis 10/11/2010 Post a comment Carmelo Papa, executive vice president and general manager of the industrial and multisegment business within STMicroelectronics, has been appointed chairman of a European think-tank for smart system integration.
Design opportunities abound in renewable energy for military SmartEnergy Designline Blog 10/6/2010 Post a comment Yesterday’s article in the New York Times about the U.S. military’s need to move away from fossil fuel reminded me of an interesting email exchange I had recently with Terry Bollinger, a technology analyst at MITRE Corp., concerning the military’s interest in renewable energy.
Graphene research wins Nobel prize for physics News & Analysis 10/5/2010 31 comments Andre Geim and Konstantin Novoselov, two researchers who began their academic careers in Russia, have been awarded the 2010 Nobel prize for physics "for groundbreaking experiments regarding the two-dimensional material graphene."
Swarm intelligence controls robotic planes News & Analysis 10/4/2010 22 comments The Swiss Federal Institute of Technology has devised a new strategy for coordinated flight of unmanned aerial vehicles using coordinated communications to allow a single operator to control an entire swarm of ultra-cheap robotic planes.
T&M gets dedicated designline Test & Measurement Designline Blogs 10/4/2010 1 comment Welcome to the Test & Measurement Designline, the latest addition to the EE Times Group's 'heads down' communities designed to help engineers tackle practical, technical and software challenges to bring product specification to reality.
All sorts of *Stuff* (good and bad) Blog 10/1/2010 3 comments Here are a bunch of items that recently caught my eye, from computer worms to a new way to tie your shoelaces to Mark Twain to nanotechnology to ... the mind boggles!
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.