Thin Film, PARC tip printed CMOS memory News & Analysis 10/21/2011 7 comments Long-time plastic memory research company Thin Film Electronics ASA and Palo Alto Research Center (PARC) have said they have produced a working prototype of a printed ferroelectric polymer non-volatile memory that is addressed with p- and n-type organic circuits, the equivalent of CMOS circuitry.
TECH TRENDS: Front-end voice activation improves auto safety Design How-To 10/20/2011 7 comments The real problem for drivers is distractions, and the desire for additional productivity or entertainment that creates them. Distractions can be reduced through voice user interfaces to control the car without looking at buttons, and without having to touch them. Front-end voice activation is the next step in improving user interfaces.
Infineon to make power ICs on 300-mm wafers News & Analysis 10/12/2011 6 comments Infineon Technologies AG has succeeded in making power MOSFETs on thinned 300-mm wafers and is planning to invest 250 million euro (about $340 million) to set up manufacturing in Dresden, Germany.
AMD, Nvidia to power 10-petaflop Titan News & Analysis 10/12/2011 4 comments Cray will use Opteron processors from AMD and Tesla graphics processors from Nivida to build a supercomputer with a peak speed between 10 and 20 petaflops, according to the U.S. Dept. of Energy's Oak Ridge National Laboratories.
Amazing MEMS, now with TSV Blog 10/11/2011 Post a comment MEMS has come a long way from those tiny switches, and today STMicroelectronics says MEMS and TSV can be used together for even higher densities…
IMEC plans 450-mm wafer fab module for 2015 News & Analysis 10/11/2011 1 comment European nanoelectronics research institute IMEC sees 2015 as about the time when the first extreme ultra-violet lithography system able to run 450-mm diameter wafers will be available and hence as the time it will need to have a dedicated 450-mm wafer clean room available.
R&D group begins TSV chip pilot production News & Analysis 10/11/2011 2 comments All Silicon System Integration Dresden, a microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3-D semiconductor devices with through-silicon-vias, according to one of its suppliers.
Plessey samples electric potential sensor Product News 10/10/2011 6 comments Plessey Semiconductors is now able to sample an electric potential sensor that detects changes in electric field, in contact, at a distance, through clothing and even through walls.
IEF: Group behavior is the design, says ASV News & Analysis 10/9/2011 Post a comment While experts often extrapolate current growth figures and developments to paint futures abundant in technology Professor Alberto Sangiovanni-Vincentelli, of the University of California, Berkeley electronic engineering and computer science department, has cautioned that we must also look at the design challenges that will enable or prevent us getting there.
IEF: Japan can rise again, says exec News & Analysis 10/8/2011 9 comments The Japanese semiconductor industry, which has been in decline for more than 20 years, needs to select key technology areas and refocus to rise again, Junshi Yamaguchi, former chairman of chip company Renesas Electronics Corp., told the International Electronics Forum, being organized here.
HP, Hynix to launch memristor memory 2013 News & Analysis 10/6/2011 38 comments The 'memristor' two-terminal non-volatile memory technology, in development at Hewlett Packard Co. since 2008, is on track to be in the market and taking share from flash memory within 18 months, according to Stan Williams, senior fellow at HP Labs.
IEF: Europe still has 450-mm wafer role News & Analysis 10/6/2011 Post a comment Despite the fact that chip manufacturers have come together in a project led by Intel Corp. in the Global 450 Consortium that will be based in up-state New York state, Europe has role to play, according to Luc Van den Hove. CEO of research institute IMEC (Leuven, Belgium).
Crocus signs IBM as MRAM partner News & Analysis 10/5/2011 1 comment Crocus Technology Inc. and IBM Corp. have signed patent license agreements and will develop semiconductor technology that combines Crocus's thermally-assisted magnetic logic unit MRAM technology with IBM's magneto-resistive MRAM non-volatile memory technology and processing capabilities.
Power IC pioneer to get U.S. tech medal News & Analysis 10/4/2011 1 comment B. Jayant Baliga, an engineering professor at North Carolina State University and a pioneer in the development of power semiconductors, was one of five inventors named last week by U.S. President Barack Obama to be a recipient of the 2010 National Medal of Technology and Innovation.
SuVolta to discuss low-power at ARM TechCon News & Analysis 10/4/2011 1 comment Scott Thompson, chief technology officer of startup SuVolta Inc., will provide an overview of advanced transistor technologies at the ARM TechCon, which takes place Oct. 25 to 27 at the Santa Clara Convention Center in Silicon Valley.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.