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Content tagged with Advanced Technology
posted in October 2011
Alternator-regulator IC boosts charging system efficiency, control
Design How-To  
10/31/2011   Post a comment
To improve fuel efficiency start with the charging system—and a key element is a new alternator-regulator IC.
Power supply design impregnated into textiles
Research  
10/30/2011   6 comments
Scientists in the US have taken the first steps towards designing a flexible and lightweight fabric that can act as a power supply for smart garments.
MEMS technology to improve quality of life for the aging
Design How-To  
10/28/2011   1 comment
MEMS sensors can help make healthcare technology sensitive to patients’ needs and abilities, significantly enhancing the user experience
Back EMF method detects stepper motor stall: Pt. 1—The basics
Design How-To  
10/27/2011   9 comments
Technique takes advantage of constant motor parameters and overcomes limitations of traditional stall detection methods of current and duty-cycle sensing.
MEMS microphone smoothes the way to natural voice control in smart consumer devices
Product News  
10/26/2011   1 comment
STMicroelectronic's MP34DT01 employs a patent-pending technology that allows designers to place the microphone membrane closer to the acoustic port hole on the top of the package with a substantial increase in performance and no penalty in size.
Distributed power management cuts wiring weight
Design How-To  
10/24/2011   1 comment
Robust power line communication and distributed computing combine for an economical physical architecture.
Harvesting boost charger features efficiency, low quiescent current, and superior cold-start capability
Product News  
10/24/2011   Post a comment
TI bq25504 draws 330 nA quiescent, has 330-mV cold-start to harvest from solar, piezo, EM, thermal sources; manages extraction, storage, disbursement
EV, hybrid repair jitters
Blog  
10/21/2011   17 comments
Survey shows technicians want better tools and information.
Thin Film, PARC tip printed CMOS memory
News & Analysis  
10/21/2011   7 comments
Long-time plastic memory research company Thin Film Electronics ASA and Palo Alto Research Center (PARC) have said they have produced a working prototype of a printed ferroelectric polymer non-volatile memory that is addressed with p- and n-type organic circuits, the equivalent of CMOS circuitry.
FPGAs for meeting size, reliability, security goals in medical devices
Design How-To  
10/21/2011   1 comment
Understand how FPGAs can help meet performance and market mandates
Color sensor IC maintains consistent LED display lighting
Design How-To  
10/20/2011   2 comments
LED light change with temperature, loss of strength over time, and age-related darkening of lenses can all be offset with sensors and intelligent lighting control.
TECH TRENDS: Front-end voice activation improves auto safety
Design How-To  
10/20/2011   7 comments
The real problem for drivers is distractions, and the desire for additional productivity or entertainment that creates them. Distractions can be reduced through voice user interfaces to control the car without looking at buttons, and without having to touch them. Front-end voice activation is the next step in improving user interfaces.
Researchers use glass to imprint lab-on-chip sensors
News & Analysis  
10/19/2011   1 comment
A glass stamp approach similar to nanoimprint lithography and using glass instead of polymer may help researchers clear a large hurdle in scaling up lab-on-a-chip manufacturing.
Tools ensure AUTOSAR data integrity
Design How-To  
10/14/2011   Post a comment
The challenge is to realize consistent data exchange between tools without loss of design information.
Murata to buy MEMS firm for $260 million
News & Analysis  
10/14/2011   4 comments
Japanese passives to power supplies giant Murata has agreed to buy VTI Technologies Oy of Finland for 20 billion yen (about 190 million euro or $260 million) in cash.
Simulations tackle EMI in hybrid and electric vehicles
Design How-To  
10/13/2011   3 comments
Electric propulsion brings with it high voltages which challenge vehicle electrical/electronic architectures.
SoC conference tackles some meaty issues
Blog  
10/12/2011   Post a comment
The SoCconference on November 2nd and 3rd has topics of interest to anyone developing complex systems-on-chip, including some interesting keynotes…
Nobel laureates traced to NSF research grants
News & Analysis  
10/12/2011   3 comments
The National Science Foundation has traced the results of the work by 2011 Nobel Laureates in Physics and Economics to grants the government agency awarded to them early in their research.
Infineon to make power ICs on 300-mm wafers
News & Analysis  
10/12/2011   6 comments
Infineon Technologies AG has succeeded in making power MOSFETs on thinned 300-mm wafers and is planning to invest 250 million euro (about $340 million) to set up manufacturing in Dresden, Germany.
AMD, Nvidia to power 10-petaflop Titan
News & Analysis  
10/12/2011   4 comments
Cray will use Opteron processors from AMD and Tesla graphics processors from Nivida to build a supercomputer with a peak speed between 10 and 20 petaflops, according to the U.S. Dept. of Energy's Oak Ridge National Laboratories.
Amazing MEMS, now with TSV
Blog  
10/11/2011   Post a comment
MEMS has come a long way from those tiny switches, and today STMicroelectronics says MEMS and TSV can be used together for even higher densities…
Imec integrates poly-SiGe piezoresistive pressure senso
News & Analysis  
10/11/2011   Post a comment
Researchers at European consortium Imec have fabricated an integrated poly-silicon germanium-based piezoresistive pressure sensor directly above a 0.13 µm copper-backend CMOS-processed substrate.
IMEC plans 450-mm wafer fab module for 2015
News & Analysis  
10/11/2011   1 comment
European nanoelectronics research institute IMEC sees 2015 as about the time when the first extreme ultra-violet lithography system able to run 450-mm diameter wafers will be available and hence as the time it will need to have a dedicated 450-mm wafer clean room available.
R&D group begins TSV chip pilot production
News & Analysis  
10/11/2011   2 comments
All Silicon System Integration Dresden, a microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM Institute, has begun pilot-line production of 3-D semiconductor devices with through-silicon-vias, according to one of its suppliers.
Plessey samples electric potential sensor
Product News  
10/10/2011   6 comments
Plessey Semiconductors is now able to sample an electric potential sensor that detects changes in electric field, in contact, at a distance, through clothing and even through walls.
Energy Harvesting for Autonomous Systems (Part 5 of 5)
Design How-To  
10/9/2011   1 comment
Understand some of the critical issues associated with this topic of great interest
IEF: Group behavior is the design, says ASV
News & Analysis  
10/9/2011   Post a comment
While experts often extrapolate current growth figures and developments to paint futures abundant in technology Professor Alberto Sangiovanni-Vincentelli, of the University of California, Berkeley electronic engineering and computer science department, has cautioned that we must also look at the design challenges that will enable or prevent us getting there.
IEF: Japan can rise again, says exec
News & Analysis  
10/8/2011   9 comments
The Japanese semiconductor industry, which has been in decline for more than 20 years, needs to select key technology areas and refocus to rise again, Junshi Yamaguchi, former chairman of chip company Renesas Electronics Corp., told the International Electronics Forum, being organized here.
Multisensory Medical Training for unlimited, no-risk practice and training
Design How-To  
10/7/2011   Post a comment
Sight, sound, and touch-enabled simulators help device makers deliver unlimited practice and no-risk training on complex, costly devices and procedures.
TECH TRENDS: When is a hybrid not a hybrid?
Design How-To  
10/7/2011   7 comments
Buick's 2012 LaCrosse comes standard with a hybrid electric power train, but the company just calls it "electric assist" for its luxury car buyers.
HP, Hynix to launch memristor memory 2013
News & Analysis  
10/6/2011   38 comments
The 'memristor' two-terminal non-volatile memory technology, in development at Hewlett Packard Co. since 2008, is on track to be in the market and taking share from flash memory within 18 months, according to Stan Williams, senior fellow at HP Labs.
Energy Harvesting for Autonomous Systems (Part 4 of 5)
Design How-To  
10/6/2011   Post a comment
Understand some of the critical issues associated with this topic of great interest
IEF: Europe still has 450-mm wafer role
News & Analysis  
10/6/2011   Post a comment
Despite the fact that chip manufacturers have come together in a project led by Intel Corp. in the Global 450 Consortium that will be based in up-state New York state, Europe has role to play, according to Luc Van den Hove. CEO of research institute IMEC (Leuven, Belgium).
This conference is where the truly “cool” people are found
News & Analysis  
10/6/2011   5 comments
For those who believe in the therapeutic power of copper for thermal ailments, the Cooling Zone Summit was the place to be
Crocus signs IBM as MRAM partner
News & Analysis  
10/5/2011   1 comment
Crocus Technology Inc. and IBM Corp. have signed patent license agreements and will develop semiconductor technology that combines Crocus's thermally-assisted magnetic logic unit MRAM technology with IBM's magneto-resistive MRAM non-volatile memory technology and processing capabilities.
Power IC pioneer to get U.S. tech medal
News & Analysis  
10/4/2011   1 comment
B. Jayant Baliga, an engineering professor at North Carolina State University and a pioneer in the development of power semiconductors, was one of five inventors named last week by U.S. President Barack Obama to be a recipient of the 2010 National Medal of Technology and Innovation.
SuVolta to discuss low-power at ARM TechCon
News & Analysis  
10/4/2011   1 comment
Scott Thompson, chief technology officer of startup SuVolta Inc., will provide an overview of advanced transistor technologies at the ARM TechCon, which takes place Oct. 25 to 27 at the Santa Clara Convention Center in Silicon Valley.
Energy Harvesting for Autonomous Systems (Part 3 of 5)
Design How-To  
10/2/2011   Post a comment
Understand some of the critical issues associated with this topic of great interest


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Max Maxfield

Aging Brass: Cow Poop vs. Horse Doo-Doo
Max Maxfield
8 comments
As you may recall, one of the things I want to do with the brass panels I'm using in my Inamorata Prognostication Engine is to make them look really old. Since everything is being mounted ...

EDN Staff

11 Summer Vacation Spots for Engineers
EDN Staff
11 comments
This collection of places from technology history, museums, and modern marvels is a roadmap for an engineering adventure that will take you around the world. Here are just a few spots ...

Glen Chenier

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Glen Chenier
11 comments
- An analog engineer and a digital engineer join forces, use their respective skills, and pull a few bunnies out of a hat to troubleshoot a system with which they are completely ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
45 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

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