Big score for TriQuint GaN program RF & Microwave Designline Blog 11/30/2010 4 comments I just heard from TriQuint that they scored a $17.5M GaN manufacturing development contract form the US Air Force Research Laboratory.
NIST aims quartz microbalance at nanotech News & Analysis 11/29/2010 4 comments Using a new twist on the traditional thermogravimetric analysis technique, the National Institute of Standards and Technology demonstrated a new method for taking Nanoscale measurements of the purity of carbon-nanotubes, coated-nanoparticles and surface features on thin films.
Wireless for medical applications Design How-To 11/29/2010 3 comments Providing better healthcare, for more patients, at lower cost is an ongoing mission. It sounds simple, but as we’re all well aware, it’s a daunting task.
CTO confirms IBM's PCM expectations News & Analysis 11/29/2010 17 comments Jai Menon, an IBM Fellow and chief technology officer with IBM's systems and technology group, has confirmed that IBM believes that phase-change memory (PCM), a non-volatile technology, could scale beyond where flash memory can go and could be of use in server computers in three to five years.
Establishing industry endurance standards for solid-state storage Design How-To 11/27/2010 6 comments While HDDs use standard methods for determining overall reliability ratings based on mean time between failure (MTBF) or annualized failure rates (AFR), SSDs are just now establishing a standardization process. Testing with a validated format is critical for any OEM provider of enterprise servers or client-based systems that will integrate SSDs.
Toshiba to source rare-earths from Mongolia News & Analysis 11/26/2010 17 comments Toshiba Corp. has signed a memorandum of understanding with Mongolia's MNFCC LLC agreeing to discussions on cooperation in the development of Mongolia's mineral resources, including uranium, rare earth and rare metals products.
Automotive MEMS sales rebound, says iSuppli News & Analysis 11/24/2010 6 comments Driven by the sharp rebound in the automotive production and inventory rebuilding, the market for automotive microelectromechanical system (MEMS) sensors will grow to record size in 2010, according to market research firm iSuppli.
NAND, PCM vie for ISSCC attention Research 11/22/2010 1 comment Multiple non-volatile memory technologies will be represented at next year's International Solid-State Circuits Conference, due to take place in San Francisco, California, Feb. 20 to 24, 2011.
Validate electronics robustness: Part 2—Find the worst case Design How-To 11/19/2010 8 comments Ensuring that today’s complex electronic systems meet specific quality, robustness, lifespan, and safety goals requires validating that the system implementation matches the specification. An important step in verification is to gain an accurate understanding of the system’s worst-case behavior.
Sandia upgrades supercomputer benchmarks News & Analysis 11/19/2010 4 comments Sandia National Labs has teamed with Intel, IBM, AMD and others on a new graphics-oriented supercomputer benchmark that concentrates on performance when analyzing large-scale but sparse data sets.
Startup touts benefits of chaotic logic News & Analysis 11/17/2010 35 comments The chaos that results from non-linear mathematics could have a part to play in semiconductor logic, according to researchers drawn from universities in the United States and India, and a startup company called ChaoLogix.
ATIC cash draws chip research to Abu Dhabi Research 11/15/2010 2 comments The Semiconductor Research Corp. (SRC) has announced it is extending its university research partnership to serve the needs of technology ecosystem in Abu Dhabi. Under the agreement SRC member companies will conduct research in Abu Dhabi, sponsored by the Advanced Technology Investment Company (ATIC).
MIPI M-PHY takes center stage Design How-To 11/14/2010 Post a comment The curtain is up and the M-PHY specification is taking center stage, positioned to handle the many different roles required for a faster, more reliable, physical interface layer (PHY Layer) on mobile devices.
Program aims to make the connected home a reality RF & Microwave Designline Blog 11/12/2010 5 comments With more broadband penetration in homes and new home and building automation enabling technologies such as ZigBee and low-power IP being embedded into products, broadband service providers are looking to enter the security, monitoring and automation (SMA) market this year.
Omron crafts MEMS for mobile News & Analysis 11/12/2010 3 comments Omron is expanding from its traditional medical and industrial markets for MEMS chips into mobile consumer devices and green energy.
Algorithm pioneer wins Kyoto Prize News & Analysis 11/12/2010 11 comments Algorithm pioneer Laszlo Lovasz, whose mathematical methods have enabled myriad breakthroughs in information technology—from RSA encryption to 4G channel capacity—has received the Kyoto Prize, a $550,000 award that some believe rivals the Nobel Prize in international stature.
Kinect's BOM roughly $56, teardown finds News & Analysis 11/11/2010 26 comments Microsoft's Kinect motion-gaming add on for its Xbox 360 gaming platform carries a bill-of-materials of roughly $56, according to a teardown analysis performed by UBM TechInsights.
Silicon 60 successes: CMOS, software and a sales proposition News & Analysis 11/9/2010 3 comments An analysis of the more than 250 startups to make the EE Times 60 Emerging Startups list over the past six years reveals that the keys to success have been a clear sales proposition and that the industry's fundamentals still boil down to CMOS and software.
Electronica: CEO panel basks in upbeat mood News & Analysis 11/9/2010 Post a comment In the traditional CEO panel on the opening day of the Electronica exhibition, the participants were unanimous that the semiconductor industry handled the economic crisis of 2008-2009 well, and that the industry is now set fair for return to "normal" growth.
Freescale rolls with automotive safety News & Analysis 11/8/2010 3 comments Freescale Semiconductor unveiled new automotive sensor chips to meet consumer demand for increased safety and growing government regulations for better electronic stability and collision at Electronica 2010.
Unification in the RF front-end : the new MIPI standard Design How-To 11/8/2010 4 comments MIPI RFFE is the specification of a bus interface specifically tailored for the needs of current and future mobile wireless systems to control the slave devices in an RF front-end. This article gives an overview of MIPI RFFE Version 1.0 and discusses the desires and rationale behind the development of RFFE, including a survey of existing alternatives.
HP pursues 'sensing-as-a-service' News & Analysis 11/5/2010 10 comments An HP business strategist outlined the company's championing of sensing-as-a-service, a play on software as a service, which bundles its wireless MEMS sensors with the data processing expertise to interpret the raw data feeds.
Next-gen power electronics spur energy efficiency Design How-To 11/5/2010 Post a comment Over the last 30 years, it is estimated power semiconductors have helped improve efficiency of cars by 40%. Now with government green-energy and CO2 reduction plans, the power semiconductor industry is expected to contribute further improvements in energy efficiency. Here are the options.
VTI champions MEMS timing chips News & Analysis 11/4/2010 Post a comment VTI Technologies, the leader in combo micro-electro-mechanical system (MEM) chips, has entered the consumer market for gyroscopes and silicon-MEMS oscillators.
Startup opens retina implant fab News & Analysis 11/4/2010 11 comments Retina Implant AG, a developer of electronic sub-retinal implants for the visually impaired, has opened a manufacturing plant to meet anticipated demand for its devices.
Is IBM serious about phase-change memory for servers? News & Analysis 11/3/2010 26 comments IBM is looking forward to improving its server computers within a few years through the use of phase-change memory, according to two separate reports that reference different senior executives with the company. This is despite review papers and discussion within a patent application that seems to acknowledge problems with the scaling of PCM.