IEDM: I've got an app for that Blog 11/30/2011 2 comments Anyone that has attended a big technical conference, such as the International Electron Devices Meeting, which opens on Monday Dec. 5, in Washington DC, knows that selecting which papers to attend can be a difficult process.
Samsung preps 8-Gbit phase-change memory Research 11/29/2011 24 comments Samsung Electronics Co. Ltd. is set to re-ignite debate about whether phase-change memory is commercially viable with the presentation of an 8-Gbit, 20-nm phase-change random access memory at the 2012 International Solid-State Circuits Conference.
MEMS enters world of precision archery News & Analysis 11/28/2011 9 comments If you like to go bow shooting, now you can do so with a high-tech measurement system that uses a MEMS as part of an arrow-mounted device which provides detailed information about arrow speed, flight dynamics and bow performance.
Intro to biomechatronics, Part 2 Design How-To 11/27/2011 6 comments This 600page book aims to provide fundamentals of electronic and mechanical components required to assist or replace limbs, senses, and even organs damaged by trauma, birth defects, or disease.
Intro to biomechatronics, Part 1 Design How-To 11/25/2011 7 comments This 600page book aims to provide fundamentals of electronic and mechanical components required to assist or replace limbs, senses, and even organs damaged by trauma, birth defects, or disease.
Argonne National Lab still on the GPU fence News & Analysis 11/22/2011 2 comments Using GPUs in supercomputers can make things more complicated for the researchers simply trying to run their code, according to Argonne National Labs’ (ANL) deputy division director Susan Coghlan.
Highlights from Supercomputing 2011 News & Analysis 11/18/2011 7 comments Supercomputing 2011 which took place over this past week, in Seattle, was the 24th conference of its kind devoted to high performance computing, networking, storage and analysis. Attendance at this year’s show was in excess of 11,300 people, more than the 10,500 people who made it to last year’s conference in New Orleans.
Intel Xeon E5s take 10 systems on Top500 News & Analysis 11/18/2011 Post a comment Though the TOP500 saw no changes in its top 10 supercomputers this week, Intel still managed to dominate the list, powering some 85 percent of all new entries with 223 systems choosing the Intel Xeon 5600 series and 10 systems running on the firm’s Xeon E5 processors.
SerDes chip enables integration of multiple video streams Design How-To 11/18/2011 2 comments In a parking assist system example, single twisted-pair communication and an interface chipset provide a bidirectional control channel with a minimum latency and general purpose I/O functionality, enabling seamless frame-synchronous processing of individual video data streams.
Researchers enhance battery electrode specs News & Analysis 11/17/2011 3 comments A team of Northwestern University researchers has created an anode electrode for lithium-ion batteries that allows the batteries to hold a charge up to 10 times greater than using current technology.
MEMS startup raises $75 million with IPO News & Analysis 11/17/2011 5 comments InvenSense Inc. (Sunnyvale, Calif.), a provider of MEMS gyroscopes, priced its intial public offering of 10 million shares at $7.50. The stock began trading on the New York Stock Exchange on Tuesday (Nov. 16) and closed the day at $8.90.
Inside updates anti-counterfeit NFC chip Product News 11/14/2011 2 comments Inside Secure SA, a fabless supplier of near field communication (NFC) chips, has announced it is sampling the VaultIC150, an NFC-based security IC designed for embedding into consumer or luxury products that are targeted by counterfeiters and cloners.
Combine power feed and data link via cable for remote peripherals Design How-To 11/10/2011 6 comments It is possible to combine power distribution and high-speed data transmission by sharing a shielded twisted pair cable. A power feed network is necessary at both ends for power injection and extraction. By properly designing this network, and managing power supply switching noise, performance degradation is minimized.
'Black silicon' startup gets Navy contract News & Analysis 11/9/2011 4 comments SiOnyx, the Harvard University spinout developing a patented process known as "black silicon," has been awarded a $3 million multiphase contract from the U.S. Dept. of Defense to develop next-generation sensing technologies for detecting laser light in targeting systems.
U.S. solar cell maker halts production News & Analysis 11/9/2011 3 comments Energy Conversion Devices, a Michigan-based supplier of solar laminates and systems, announced it suspended all manufacturing operations as an inventory control measure and said it would furlough about 400 workers in Michigan, Mexico and Ontario, Canada.
Defense firm offers manycore runtime support News & Analysis 11/9/2011 Post a comment ET International Inc., a spin-off from the University of Delaware in 2000 that has performed computing research for the Department of Defense, has announced that its SWift Adaptive Runtime Machine provides a commercial implementation of the ParalleX parallel execution model, a message-driven split-transaction computing model.
Opinion: Assembling Economic Growth Engineering Pop Culture! 11/9/2011 4 comments Steve Brennen looks at how technology impacts economic growth and calls for a pro-business environment. He foresees some good decades ahead for us...
Pixtronix, CMI make 5-inch MEMS display News & Analysis 11/8/2011 1 comment Pixtronix Inc., a developer and licensor of display technologies, and Chimei Innolux Corp. (CMI), a leading TFT-LCD manufacturer, have announced the successful joint development of 5-inch diagonal MEMS display prototypes.
MEMS foundry licenses TSV tech to prototyper News & Analysis 11/7/2011 6 comments MEMS foundry Silex Microsystems AS has said it has licensed its Sil-Via technology for through silicon vias (TSVs) to Nanoshift LLC for use in the early development of complex MEMS products.
Quantenna gets backing from Telefonica News & Analysis 11/7/2011 Post a comment Fabless communications chip company Quantenna Communications Inc. has said telecommunications operator Telefonica is making an equity investment in the company as part of a strategic partnership.
Printed electronics lights up beer bottle News & Analysis 11/7/2011 4 comments PragmatIC Printing Ltd, a pioneer of printed electronics, has worked with Innovia Films Ltd., a manufacturer of specialist films, to create prototypes of interactive bottle labels.
Energy harvesting memory provides voltage Product News 11/7/2011 6 comments STMicroelectronics NV, Europe's largest chip company, has introduced a 16-kbit memory that can also harvest enough energy to enable small electronic items using it to become battery-free electronic applications.
ST LIS3DSH sensor Product News 11/3/2011 Post a comment STMicroelectronics is touting its latest sensor as the industry's first three-axis high-resolution accelerometer with two embedded finite-state machines.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.