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Content tagged with Advanced Technology
posted in November 2013
On Space, Gravity & Gratitude
Blog  
11/27/2013   20 comments
The movie Gravity is a decent two-hour diversion for the holidays, but there are more delightful distractions that are more science and less fiction.
3D Stacks Need Lower Costs, Broader Backing
Blog  
11/26/2013   13 comments
A recent gathering at Georgia Tech showed the emerging technology for 3D chip stacking needs to come down in costs and get broader backing from designers and managers.
IBM Wins Gordon Bell Prize
News & Analysis  
11/25/2013   5 comments
World's most complex simulation of cloud cavitation collapse was awarded the prestigious Gordon Bell prize at Supercomputer 2013 (SC13, Nov. 17-22, Denver).
5 MEMS Chips Debut at MEMS Exec Congress
News & Analysis  
11/18/2013   4 comments
New micro-electro-mechanical system (MEMS) chips were announced at the recent MEMS Executive Congress (Napa, Calif., Nov. 7-9).
Invisibility Cloak Comes to Life
News & Analysis  
11/15/2013   30 comments
A new kind of invisibility cloak has been created by University of Toronto researchers using signal-canceling radar instead of metamaterials.
MEMS Market to Top $22 billion by 2018
News & Analysis  
11/8/2013   5 comments
The market for micro-electromechanical system chips will grow from $12 billion today to over $22 billion by 2018, led by new types of MEMS chips and Chinese OEMs.
Apple, Samsung, Foundries Key to 3D ICs
News & Analysis  
11/8/2013   21 comments
The Apple A7 in the iPhone 5s is a "poor man's 3D IC" said one veteran at a panel discussion that shed light on the state and future of chip stacks.
Korea Drives High-End, Low-End Memory at ISSCC
News & Analysis  
11/5/2013   3 comments
Samsung will demo its first mobile DDR4 chips while SK Hynix discloses its High-Bandwidth Memory stack at ISSCC.
Graphene Laser to Probe Superconductivity
News & Analysis  
11/4/2013   6 comments
Max Planck Institute researchers are working on a terahertz laser that could be useful in researching high-temperature superconductors.
Motion Processing for Android KitKat
News & Analysis  
11/1/2013   14 comments
Invensense has enhanced the digital motion processor (DMP) in its new MPU-6515 to handle new contextual awareness functions in Android 4.4 "KitKat" operating system.


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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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