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posted in December 2011
Kyocera offers lifetime LCD supply
News & Analysis  
12/30/2011   9 comments
A lifetime supply of liquid-crystal displays is being guaranteed to original equipment manufacturers by Kyocera, which recently extended its acquisition of LCD and touchscreen suppliers by purchasing Optrex.
Top 10 automotive electronics stories of 2011
Design How-To  
12/23/2011   3 comments
The top stories of the year underscore the great interest Automotive Designline readers have in hybrid and electric vehicles.
Lead-free auto power MOSFETs come in standard TO packages
Product News  
12/22/2011   2 comments
Diffusion-soldering die-attach approach permits producing lead-free packages.
Self-healing system repairs broken wires, traces
12/22/2011   13 comments
A team of University of Illinois engineers has developed a self-healing system that restores electrical conductivity to a cracked circuit. Liquid metal contained in microcapsules, released by the damage, fills in the gap in the circuit, restoring electrical flow.
Space firsts, lasts in 2011
News & Analysis  
12/21/2011   9 comments
We reprise space firsts and lasts of 2011, a year during which planetary exploration thrived and the work-horse space shuttle flew its last mission to the International Space Station.
Imec is collaborating with Flamac on novel PV materials
News & Analysis  
12/21/2011   Post a comment
Research center Imec is collaborating with Flamac to develop novel materials as an alternative for the standard solar cells made of copper indium gallium and selenium (CIGS).
SerDes technology allows single wire pair control channel
Design How-To  
12/19/2011   6 comments
Unique SerDes application permits encrypted HD video/audio with full-duplex bi-directional control over a single wire pair interface.
Five announce flash memory security initiative
News & Analysis  
12/19/2011   3 comments
Panasonic, Samsung, SanDisk, Sony and Toshiba have reached an agreement in principle to collaborate on a content protection technology for flash memory cards such as SD Cards and for other flash-based storage options.
The FCC’s best-kept secret on medical wireless frequencies
Design How-To  
12/19/2011   Post a comment
Ultrawideband frequencies offer a treasure trove of many gigahertz of available FCC spectrum
Now that they have our attention!
Automotive DesignLine Blog  
12/16/2011   65 comments
NTSB's recommended banning of cell phone use in cars has certainly focused debate about distracted driving causes. (And listen here to a discussion with the chairman of the board.)
Rare earths rising for next five years
News & Analysis  
12/16/2011   6 comments
Despite China's virtual corner on the market of rare earths, demand is skyrocketing along with investments in new mines worldwide that has some pundits talking of a "rare earth bubble."
Balance hybrid/EV battery packs to extend operational lifetime: Pt. 2—Algorithm and lab tests
Design How-To  
12/16/2011   1 comment
Charge imbalance can reduce a battery pack’s total capacity and potentially damage the pack. Imbalance prevents batteries from tracking from the charged state to the discharged state and if not closely monitored can cause batteries to be overcharged or over-discharged—which will permanently damage the cells.
Optimize SDR performance
Design How-To  
12/15/2011   2 comments
Hands-on example using AWR Visual System Simulator: This article explains the attributes of SDR, the design challenges, and it includes hands-on examples of how AWR’s Visual System Simulator (VSS) software for system simulation of RF end-to-end architecture design can be used to address these challenges.
ST creates early-stage VC fund
News & Analysis  
12/15/2011   7 comments
STMicroelectronics NV, Europe's leading chip company, has announced the launch of ST New Ventures, a corporate venture capital fund. However, the announcement did not indicate how much money the organization will have at its disposal.
ST claims world first contactless wafer test
News & Analysis  
12/15/2011   9 comments
European chip company STMicroelectronics NV has said it has produced the first wafer on which the die were fully tested wirelessly and without the use of contact probes.
Report: Apple ups ante with Israel R&D center
News & Analysis  
12/15/2011   4 comments
Apple has employed a veteran technologist to help it set up an R&D center in Israel, according to a Globes report.
Rambus, ITRI to collaborate on 3-D packaging
News & Analysis  
12/15/2011   Post a comment
Rambus said it is engaging Taiwan's Industrial Technology Research Institute on the development of interconnect and 3-D packaging technologies.
Flexible substrates harness carbon
News & Analysis  
12/14/2011   1 comment
Carbon nanotube ink outperforms organic alternatives for future flexible electronics printed with ink jets, according to the U.S. Department of Energy's Lawrence Berkeley National Laboratory.
Top 10 articles in Smart Energy for 2011
Design How-To  
12/13/2011   1 comment
What were the important topics within the Smart Energy technical community in 2011? An analysis of what happened with solar power startup Solyndra was the clear winner, followed by articles on LEDs and smart meters.
Broadcom launches connected-car Ethernet portfolio
Product News  
12/12/2011   1 comment
Portfolio designed specifically for automotive to cut connectivity cost and cabling weight.
Researchers: Carbon better than copper for TSVs
News & Analysis  
12/12/2011   6 comments
Three-dimensional chip stacks are better connected with through-silicon-vias filled with carbon nanotubes instead of copper, according to researchers at Chalmers University of Technology in Gothenburg, Sweden.
Processors enable global software defined radio platforms
Design How-To  
12/12/2011   1 comment
Moving radio functions from hardware into software opens up cost benefits for global car production. Secondly, it affords producers flexibility when making decisions about future innovations in the pipeline—such as car-to-X. But what is needed is the right mix of specialized and flexible function blocks.
Top "Medical Designline" articles for 2011 (Part 2 of 2)
Design How-To  
12/11/2011   Post a comment
See what your fellow engineers were reading this past year
Conferences and exhibitions for 2012
12/11/2011   12 comments
Here is a list of events for 2012 compiled on the basis of only one per month.
EU backs ST-Ericsson to deliver augmented reality
12/11/2011   1 comment
Metaio, STMicroelectronics and ST-Ericsson are amongst the companies that are collaborating in a European Union funded project to develop augmented reality systems and applications.
LED driver ICs feature diagnostics and protection features
Product News  
12/9/2011   1 comment
AEC-Q100 Grade 0 qualified devices can drive upwards of 15 LEDs at 1A or higher.
Balance hybrid/EV battery packs to extend operational lifetime: Pt. 1—Hardware and strategy
Design How-To  
12/9/2011   2 comments
Charge imbalance can reduce a battery pack’s total capacity and potentially damage the pack. Imbalance prevents batteries from tracking from the charged state to the discharged state and if not closely monitored can cause batteries to be overcharged or over-discharged—which will permanently damage the cells.
IEDM compendium
12/8/2011   Post a comment
Herewith is a compendium of stories from EE Times covering the International Electron Dervices Meeting which took place Dec. 5 to 7 in Washington DC.
IEDM: IMEC reports 10-nm RRAM cell
12/8/2011   3 comments
European research institute IMEC has reported a Resistive RAM memory cell that measures 10-nm by 10-nm at the International Electron Devices Meeting. The organization claims this is the smallest such cell and that it shows the potential to replace NAND flash memory.
Qualcomm MEMS display drives Kyobo e-reader
News & Analysis  
12/7/2011   2 comments
An e-reader from Kyobo Book Centre, Korea's largest book seller, is the first e-reader to use the Mirasol MEMS-based display technology from Qualcomm MEMS Technologies Inc.
IEDM: SuVolta transistor operates down to 0.4-V
12/7/2011   6 comments
Startup SuVolta Inc. has announced that its novel transistor technology, dubbed PowerShrink, operates down to 0.425-V, approximately 300-mV below conventional processes. PowerShrink is based on a deeply depleted channel (DDC) transistor manufactured in epitixially grown doped silicon on the surface of a conventional bulk CMOS wafer.
IEDM: Sony game exec lays out chip needs
News & Analysis  
12/6/2011   3 comments
The CTO of Sony Computer Entertainment told chip makers he needs better image and motion sensor technologies in order to achieve the "ultimate immersive system."
Hot topics in Smart Energy for 2011 – Part 1
Design How-To  
12/6/2011   Post a comment
What were the important topics within the Smart Energy technical community in 2011? Judging by traffic to this site’s top articles, they were a varied lot, ranging from LED lighting to the smart grid to new approaches to power conversion efficiency.
IEDM: UCB reports printed MEMS switches
12/6/2011   Post a comment
A team of researchers from the University of California Berkeley has a paper at the International Electron Devices Meeting that describes how to use an inkjet printer to print microelectromechanical system switches and proposes their use for flexible display active-matrix backplanes.
EE Times' 20 hot technologies for 2012
12/6/2011   57 comments
What follows is a list of 20 technologies EE Times editors think can bring big changes, and that we will be tracking in 2012.
EE Times' 20 hot technologies for 2012
12/6/2011   57 comments
What follows is a list of 20 technologies EE Times editors think can bring big changes, and that we will be tracking in 2012.
EE Times' 20 hot technologies for 2012
12/6/2011   57 comments
What follows is a list of 20 technologies EE Times editors think can bring big changes, and that we will be tracking in 2012.
Infrared emitters offer high current drives with low thermal resistivity
Product News  
12/5/2011   1 comment
Compact package also features high radiant intensity and optical power.
Component integration paces EV, hybrid power electronics efficiency
Design How-To  
12/5/2011   1 comment
To achieve maximum power density, electric losses and thermal resistances must be kept to a minimum—thus maximum component integration is required.
Defining the 4G PHY architecture design challenges
Design How-To  
12/5/2011   2 comments
As with most emerging technologies, design challenges for LTE-A abound, particularly when it comes to the physical layer (PHY) architecture development. Addressing these challenges remains critical to the successful development and deployment of LTE-A designs.
Bluetooth low energy technology makes new medical applications possible
Design How-To  
12/2/2011   2 comments
Bluetooth low energy technology could help solve one of the toughest problems facing portable medical devices.
Shunt charger ICs harvest energy, protect batteries
Design How-To  
12/2/2011   Post a comment
Energy harvesting ICs can convert a transducer's output into an electric current for a battery charger. Here are application options for a charger IC designed for embedded automotive applications.
BMW, Toyota to team up on green technology
News & Analysis  
12/2/2011   7 comments
Carmakers BMW and Toyota have signed a medium to long-term agreement to jointly conduct R&D activities targeting an environmental-friendly automotive technologies. BMW will also sell fuel efficient diesel engines to Toyota Motor Europe.
Integrated transceivers save space in LIN, CAN applications
Product News  
12/1/2011   Post a comment
Automotive-qualified compact integrated circuits also target cost in vehicle comfort and convenience, and industrial designs.
NASA supercomputer searches for sister planets
News & Analysis  
12/1/2011   7 comments
NASA’s Kepler program has been scouring the skies with the aim of exploring the structure and diversity of planetary systems and search for other life-supporting planets in our galaxy.
LEDs tailor automotive lighting, improve safety
Design How-To  
12/1/2011   5 comments
Lighting used to be purely functional but has evolved into an element of design: Every vehicle can be given an individual appearance thanks to characteristic lighting.

As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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