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Content tagged with Advanced Technology
posted in February 2012
IBM reports progress on quantum computing
News & Analysis  
2/28/2012   12 comments
The last major engineering hurdle to quantum computers—millisecond coherence times—has been surmounted by researchers at IBM Research, making commercialization of the technology possible "within our lifetimes," according to Matthias Steffen, manager of IBM's Experimental Quantum Computing group.
ISS Europe 2012 ponders 450mm wafer fab challenges
News & Analysis  
2/28/2012   Post a comment
The quest for expanding semiconductor manufacturing to 450mm wafers in Europe has taken large chip companies by storm and placed them squarely in the eye of it.
AUTOSAR timing models minimize ECU risks
Design How-To  
2/27/2012   Post a comment
Timing models are ideal development artifacts for the exchange between different development groups and along the supply chain. The presented methodology minimizes integration risks for ECU projects from the very beginning and constantly keeps real-time capabilities in focus.
LED drivers provide control, circuit-protection design options
Design How-To  
2/27/2012   1 comment
While the basic operating requirement for an LED driver is to supply a constant current for consistent lighting, automotive uses have stringent guidelines regarding temperature and humidity, voltage, ability to withstand harsh chemicals, electromagnetic interference and compatibility, as well as circuit protection.
Leverage commercial off-the-shelf tools to create verifiable hardware and software solutions
Design How-To  
2/24/2012   Post a comment
FPGAs can help designers reduce their time to market while providing flexibility and verifiable designs.
ISO 26262 cuts electronics complexity risks: Pt. 1- Requirements and assessment flow
Design How-To  
2/23/2012   2 comments
Future development and integration of automotive safety functions will strengthen the need to have safe system development processes and to provide evidence that all reasonable safety objectives are satisfied. ISO 26262 provides guidance to reduce these risks to a tolerable level by providing feasible requirements and processes.
APIC announces Ge laser, photonic IC to follow
2/23/2012   2 comments
Research and military supply company APIC Corp., working with scientists at Massachusetts Institute of Technology and Stanford University, has succeeded in getting germanium to act as a laser and claimed this will open up a path to practical photonic circuits.
Analyst: Mobile MEMS market rising to $6bn in 2016
News & Analysis  
2/22/2012   1 comment
The annual revenues generated by MEMS components used in mobile consumer equipment, including sensors, audio, displays and RF, will exceed $6 billion in 2016, according to analysis company Juniper Research Ltd. The equipment includes phones, computers and e-readers.
MEMS actuators fight robot tug-of-war
2/22/2012   2 comments
YouTube has a video that shows the results of a number of "tug-of-war" matches between MEMS electrothermal actuators belonging to Hong Kong University of Science and Technology and Kyoto University.
ISSCC: SanDisk set to show highest density NAND flash
2/22/2012   2 comments
SanDisk Corp. is expected to report one of the highlights of the International Solid-State Circuits Conference, being held in San Francisco, when it provides details of a NAND flash memory implemented in 19-nm CMOS.
AMD first to count on Cyclos low-power clock IP
News & Analysis  
2/21/2012   11 comments
Advanced Micro Devices Inc. has achieved the first commercial implementation of resonant clock mesh technology licensed from startup company Cyclos Semiconductor Inc.
Job ad discloses SanDisk resistive RAM program
News & Analysis  
2/20/2012   16 comments
Flash memory vendor SanDisk is looking for a director of processing engineering management for a 3-D resistive RAM team based in Milpitas. A job ad for the position was posted in SanDisk's website dated Feb. 15, 2012.
High-concentration space travel
Design How-To  
2/20/2012   Post a comment
On October 20, 2011, a Russian Soyuz-ST carrier rocket launched its first satellite from the Galileo satellite network into orbit from the Kourou Space Center in French Guiana. The necessary thrust was provided by an Evonik specialty: PROPULSE, a highly concentrated hydrogen peroxide.
Remember 'If Microsoft made cars…' jokes?
Automotive DesignLine Blog  
2/16/2012   15 comments
For a split second on a recent test drive, I felt they had.
Analog Devices ADMP504 MEMS microphone
Product News  
2/16/2012   1 comment
Delivering a SNR of 65-dBA, or 29-dBA EIN, Analog Devices' latest device provides the same SNR performance as an array of two individual 62-dB SNR microphones.
Optocouplers safeguard battery systems from transients, shorts, and other faults
Design How-To  
2/16/2012   Post a comment
Optical isolators are the defacto standard to provide high electrical isolation and noise immunity, while consuming little power compared with transformer coupling isolation.
Top ten microphotographs go from bizarre to beautiful
The Engineering Life - Around the Web  
2/16/2012   Post a comment
A competition for microphotographs has produced some of the strangest and most beautiful sights in semiconductors and life sciences.
Konica Minolta makes MEMS inkjet for printed electronics
Product News  
2/15/2012   2 comments
Konica Minolta IJ Technologies Inc. has announced that is has developed a silicon MEMS-based inkjet printhead for printed electronics applications. It is due to begin sampling in the second quarter of 2012.
MRAM startup raises $36 million VC fund
News & Analysis  
2/15/2012   3 comments
Spin Transfer Technologies Inc., a startup pursing the development of a type of magnetic random access memory, has raised $36 million in a series A funding round led by Allied Minds Inc. and Invesco Asset Management.
SiC diodes improve efficiency and cut costs
Product News  
2/14/2012   2 comments
Designated the C3Dxx170H Series, the SiC Schottky diodes are rated for 10A/1700V and 25A/1700V.
Energy Conversion Devices files for bankruptcy
News & Analysis  
2/14/2012   12 comments
Solar equipment maker Energy Conversion Devices said it filed for Chapter 11 bankruptcy protection and announced plans to sale several assets, including its wholly owned subsidiary United Solar Ovonic and its minority stake in Ovonyx.
TEL joins CEA-Leti programs on DSA, maskless litho
2/14/2012   Post a comment
Tokyo Electron Ltd., a supplier of IC and display production equipment, has joined two collaborative lithography research projects being organized by French research institute CEA-Leti.
Memristor brouhaha redux
Social Mania  
2/14/2012   14 comments
A battle of mathematical papers has broken out at on the topic of the memristor, which may be part of the future of non-volatile memory devices.
Compact gate drive IC simplifies hybrid, EV power train design
Product News  
2/10/2012   Post a comment
High output current drives inverter stage IGBTs and MOSFETs.
European research project to boost solar cell efficiency
News & Analysis  
2/10/2012   Post a comment
A three-year European research project aims to push solar-cell efficiency towards 25 percent and reduce power conversion losses by 20 percent.
Medical device safety system design: a systematic approach
Design How-To  
2/10/2012   Post a comment
The design of a safety system should be addressed as an integral part of the overall system architecture.
IMEC announces directed self-assembly process line
2/10/2012   8 comments
European research institute IMEC has co-developed a directed self-assembly manufacturing process to improve both optical and extreme ultraviolet lithography and installed a 300-mm compatible manufacturing line within its pilot fab at its headquarters in Leuven, Belgium.
Software tools ease AUTOSAR compliance
Design How-To  
2/9/2012   Post a comment
The AUTOSAR initiative is tackling the industry-wide constraints of complexity, competition, and cost. AUTOSAR provides incentives for manufacturers to replace their proprietary software/hardware interfaces with standardized ones linked to an independent architectural layer.
Common Platform group to discuss 14-nm at forum
News & Analysis  
2/9/2012   3 comments
IBM, Samsung Electronics Co. Ltd. and Globalfoundries Inc., three companies at the heart of the Common Platform Alliance, will discuss next-generation semiconductor manufacturing process technologies at 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.
CNSE and partners share research results at SPIE
News & Analysis  
2/9/2012   Post a comment
More than 60 scientific and technical papers detail results from research by CNSE scientists and industry partners at next week's SPIE Advanced Lithography 2012 conference.
Silicon Valley back on track
News & Analysis  
2/8/2012   16 comments
Silicon Valley is making an impressive recovery, according to the newly released 2012 edition of the Silicon Valley Index.
STMicroelectronics Unveils World's First 3-Axis Gyroscope for Automotive Applications
Product News  
2/8/2012   Post a comment
STMicroelectronics Unveils World's First 3-Axis Gyroscope for Automotive Applications
Cree claims LED price-performance breakthrough
News & Analysis  
2/7/2012   25 comments
Claiming a breakthrough in light-emitting diode technology, Cree announced a new product that the company claims delivers twice the lumens per dollar of conventional LEDs and features the highest performance in the industry.
Researchers develop novel form of hafnium oxide
2/7/2012   3 comments
A research team working under Andrew Flewitt at the Department of Engineering at the University of Cambridge has developed a novel form of hafnium oxide with a dielectric constant higher than 30.
The end users speak
2/7/2012   Post a comment
End users will sound off at the Ethernet Alliance's next Technology Exploration Forum in Santa Clara, Calif., on Feb. 16.
Intel terahertz supplier secures $5.5 million in funds
News & Analysis  
2/6/2012   1 comment
TeraView Ltd. (Cambridge, England), a startup company founded in 2001 to develop terahertz systems for imaging and spectroscopy, has announced it has secured $5.5 million of investment from a consortium of U.S., Asian and European institutional and corporate investors.
New H-PSOF power-electronics packaging touts high-current capability and high efficiency
Product News  
2/2/2012   Post a comment
Automotive power transistors for hybrid and electric vehicles are first available products.
U.K. to spend $120 million on graphene institute
2/2/2012   2 comments
The U.K. government has said it will spend £70 million (about $120 million) to fund a national institute of graphene research and commercialisation activities, in Manchester, England.
ST STCF04 LED flash/torch controller
Product News  
2/2/2012   Post a comment
ST's supercapacitor LED flash/torch controller upgrades conventional camera module architecture to deliver floodlight-strength flash power.
CNSE receives federal grants for nanotechnologies
News & Analysis  
2/2/2012   1 comment
Federal funding of more than $5 million is being given to the College of Nanoscale Science and Engineering (CNSE) of the University at Albany for a host of nanotechnology-enabled education and research programs.
TSMC plans 3-D IC assembly launch early in 2013
News & Analysis  
2/2/2012   7 comments
Leading IC foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to announce 3-D IC assembly service as a general offering at the beginning of 2013, according to Maria Marced, president of TSMC Europe.
Qualcomm, Ericsson demo LTE-to-3G handover
News & Analysis  
2/2/2012   4 comments
Mobile communications company Qualcomm Inc. has announced that, working with Ericsson AB, it has completed a voice call handover from an LTE mobile network to a WCDMA network using Single Radio Voice Call Continuity (SRVCC) technology.
Viewpoint: 'The R&D credit doesn't work'
2/2/2012   60 comments
The R&D tax credit does not increase U.S. R&D expenditures, and the $10 billion we spend each year on the credit is mostly a financial transfer from the government to large multinational corporations with no benefit to U.S. taxpayers.
CEA-Leti opens 3-D IC packaging service
News & Analysis  
2/1/2012   Post a comment
French research institute CEA-Leti has announced the launch of a 3-D packaging platform and service that provides industrial and academic partners with what it describes as a "mature" process for the production of 3-D interconnected products and projects. Parts Search

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