IBM reports progress on quantum computing News & Analysis 2/28/2012 12 comments The last major engineering hurdle to quantum computers—millisecond coherence times—has been surmounted by researchers at IBM Research, making commercialization of the technology possible "within our lifetimes," according to Matthias Steffen, manager of IBM's Experimental Quantum Computing group.
AUTOSAR timing models minimize ECU risks Design How-To 2/27/2012 Post a comment Timing models are ideal development artifacts for the exchange between different development groups and along the supply chain. The presented methodology minimizes integration risks for ECU projects from the very beginning and constantly keeps real-time capabilities in focus.
LED drivers provide control, circuit-protection design options Design How-To 2/27/2012 1 comment While the basic operating requirement for an LED driver is to supply a constant current for consistent lighting, automotive uses have stringent guidelines regarding temperature and humidity, voltage, ability to withstand harsh chemicals, electromagnetic interference and compatibility, as well as circuit protection.
APIC announces Ge laser, photonic IC to follow Research 2/23/2012 2 comments Research and military supply company APIC Corp., working with scientists at Massachusetts Institute of Technology and Stanford University, has succeeded in getting germanium to act as a laser and claimed this will open up a path to practical photonic circuits.
Analyst: Mobile MEMS market rising to $6bn in 2016 News & Analysis 2/22/2012 1 comment The annual revenues generated by MEMS components used in mobile consumer equipment, including sensors, audio, displays and RF, will exceed $6 billion in 2016, according to analysis company Juniper Research Ltd. The equipment includes phones, computers and e-readers.
MEMS actuators fight robot tug-of-war Research 2/22/2012 2 comments YouTube has a video that shows the results of a number of "tug-of-war" matches between MEMS electrothermal actuators belonging to Hong Kong University of Science and Technology and Kyoto University.
Job ad discloses SanDisk resistive RAM program News & Analysis 2/20/2012 16 comments Flash memory vendor SanDisk is looking for a director of processing engineering management for a 3-D resistive RAM team based in Milpitas. A job ad for the position was posted in SanDisk's website dated Feb. 15, 2012.
High-concentration space travel Design How-To 2/20/2012 Post a comment On October 20, 2011, a Russian Soyuz-ST carrier rocket launched its first satellite from the Galileo satellite network into orbit from the Kourou Space Center in French Guiana. The necessary thrust was provided by an Evonik specialty: PROPULSE, a highly concentrated hydrogen peroxide.
MRAM startup raises $36 million VC fund News & Analysis 2/15/2012 3 comments Spin Transfer Technologies Inc., a startup pursing the development of a type of magnetic random access memory, has raised $36 million in a series A funding round led by Allied Minds Inc. and Invesco Asset Management.
Energy Conversion Devices files for bankruptcy News & Analysis 2/14/2012 12 comments Solar equipment maker Energy Conversion Devices said it filed for Chapter 11 bankruptcy protection and announced plans to sale several assets, including its wholly owned subsidiary United Solar Ovonic and its minority stake in Ovonyx.
Memristor brouhaha redux Social Mania 2/14/2012 14 comments A battle of mathematical papers has broken out at arXiv.org on the topic of the memristor, which may be part of the future of non-volatile memory devices.
IMEC announces directed self-assembly process line Research 2/10/2012 8 comments European research institute IMEC has co-developed a directed self-assembly manufacturing process to improve both optical and extreme ultraviolet lithography and installed a 300-mm compatible manufacturing line within its pilot fab at its headquarters in Leuven, Belgium.
Software tools ease AUTOSAR compliance Design How-To 2/9/2012 Post a comment The AUTOSAR initiative is tackling the industry-wide constraints of complexity, competition, and cost. AUTOSAR provides incentives for manufacturers to replace their proprietary software/hardware interfaces with standardized ones linked to an independent architectural layer.
Common Platform group to discuss 14-nm at forum News & Analysis 2/9/2012 3 comments IBM, Samsung Electronics Co. Ltd. and Globalfoundries Inc., three companies at the heart of the Common Platform Alliance, will discuss next-generation semiconductor manufacturing process technologies at 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.
Cree claims LED price-performance breakthrough News & Analysis 2/7/2012 25 comments Claiming a breakthrough in light-emitting diode technology, Cree announced a new product that the company claims delivers twice the lumens per dollar of conventional LEDs and features the highest performance in the industry.
The end users speak Blog 2/7/2012 Post a comment End users will sound off at the Ethernet Alliance's next Technology Exploration Forum in Santa Clara, Calif., on Feb. 16.
Intel terahertz supplier secures $5.5 million in funds News & Analysis 2/6/2012 1 comment TeraView Ltd. (Cambridge, England), a startup company founded in 2001 to develop terahertz systems for imaging and spectroscopy, has announced it has secured $5.5 million of investment from a consortium of U.S., Asian and European institutional and corporate investors.
CNSE receives federal grants for nanotechnologies News & Analysis 2/2/2012 1 comment Federal funding of more than $5 million is being given to the College of Nanoscale Science and Engineering (CNSE) of the University at Albany for a host of nanotechnology-enabled education and research programs.
TSMC plans 3-D IC assembly launch early in 2013 News & Analysis 2/2/2012 7 comments Leading IC foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to announce 3-D IC assembly service as a general offering at the beginning of 2013, according to Maria Marced, president of TSMC Europe.
Qualcomm, Ericsson demo LTE-to-3G handover News & Analysis 2/2/2012 4 comments Mobile communications company Qualcomm Inc. has announced that, working with Ericsson AB, it has completed a voice call handover from an LTE mobile network to a WCDMA network using Single Radio Voice Call Continuity (SRVCC) technology.
Viewpoint: 'The R&D credit doesn't work' Blog 2/2/2012 60 comments The R&D tax credit does not increase U.S. R&D expenditures, and the $10 billion we spend each year on the credit is mostly a financial transfer from the government to large multinational corporations with no benefit to U.S. taxpayers.
CEA-Leti opens 3-D IC packaging service News & Analysis 2/1/2012 Post a comment French research institute CEA-Leti has announced the launch of a 3-D packaging platform and service that provides industrial and academic partners with what it describes as a "mature" process for the production of 3-D interconnected products and projects.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.