Multiphase boost converter eases 12V battery 'cranking deep' Design How-To 4/29/2011 4 comments Auto start-stop systems offer improved fuel efficiency and emissions, but vehicle electronics need to be protected from cranking transients. A multiphase boost converter is ideal for this function and can also simplify supplying power audio components in the infotainment system as well as isolating regenerative braking energy storage.
Tools spur ECU CAN/LIN communications Design How-To 4/22/2011 Post a comment With the increasing use of in-vehicle networks, the development of automotive electronic control units must not only consider the software requirement, but also the implementation of the embedded software via a data bus such as CAN or LIN.
Broadcom joins GreenTouch comms consortium News & Analysis 4/21/2011 2 comments Fabless chip company Broadcom Corp. has said it has joined GreenTouch, a global industry consortium formed by Alcatel-Lucent Bell Labs that is focused on improving the energy efficiency of IT and communications networks.
China develops phase-change RAM Research 4/20/2011 18 comments The Shanghai Institute of Microsystem and Information Technology at the Chinese Academy of Sciences – working with foundry chipmaker SMIC and Microchip Technology – has announced it has developed phase-change random access memory (PCRAM) that is based on Chinese intellectual property, according to a Xinhua report.
Quantum dots enable plasmonic semiconductors News & Analysis 4/19/2011 2 comments Plasmonics merges with quantum dot semiconductors that couple electronics and photonics to speed up electronic interconnects, create a new generation of super-efficient LEDs, supersensitive chemical and biological detectors as well as metamaterials that can bend light around object to create invisibility cloaks.
Power Line Communication integrates electric vehicles with the Smart Grid Design How-To 4/15/2011 6 comments A compatible charging infrastructure and communication between an EV and any potential "charging spot" is required for easy and practical use. The established Power Line Communication (PLC) standard in the Smart Power Grid offers a robust and long term available setup—and the prospect of grid stabilization (charging back to the grid).
ISPD reveals 3-D, maskless-lithography trends News & Analysis 4/13/2011 7 comments Next generation trends in the physical fabrication of semiconductors, including 3-D and maskless lithography, were recently laid out at this year's 20th annual International Symposium on Physical Design in Santa Barbara, Calif.
Cadence IP targets DDR4 in SoCs Product News 4/13/2011 Post a comment Earlier this week, Cadence announced some new intellectual property (IP) that aims to streamline the incorporation of DDR4 memory into system on chip (SoC) designs. I spoke with Neil Hand, group director of marketing for SSD realization group, at length about the announcement.
Growth seen for CPU cores in 'smart' systems News & Analysis 4/13/2011 2 comments A new report by IDC's semiconductor research team predicts that "smart systems"—those with programmable processor cores, high-level operating systems and Internet connectivity—will consume more than 12.5 billion processor cores representing more than $100 billion in revenue by 2015, more than double the number of cores that shipped in 2010.
Top 50 contract manufacturers ranked News & Analysis 4/12/2011 4 comments Manufacturing Market Insider, a paid-for newsletter focused on contract manufacturing, has ranked the top 50 electronics manufacturing services based on 2010 revenue in its March edition.
Kilopass tests antifuse on TSMC's 28-nm CMOS Research 4/6/2011 4 comments Claiming that test chip results have proved the scalability of its two-transistor antifuse memory element, Kilopass Technology Inc. has announced it is working with Taiwan Semiconductor Manufacturing Co. Ltd. on the 28-nm CMOS node.
Fuel-cell-on-a-chip demonstrated News & Analysis 4/5/2011 13 comments Fuel cells on-a-chip could replace small batteries, according to Harvard University researchers who showed a wafer containing 145 solid-oxide fuel cells.
IBM uses chip engineering to beat MRSA Research 4/5/2011 1 comment IBM Corp. and the Institute of Bioengineering and Nanotechnology in Singapore have shown that nanometer-scale polymeric chemicals can seek out and destroy antibiotic-resistant bacteria and infectious diseases such as Methicillin-resistant Staphylococcus aureus (MRSA).
E-field sensing startup raises $4 million News & Analysis 4/4/2011 3 comments Ident Technology AG, a developer of proximity sensing and gesture recognition ICs, has received 2.9 million euro (about $4.1 million) to fund the development of its GestIC three-dimensional (3-D) gesture control chip using a fabless semiconductor business model.
Globalfoundries joins IMEC's CMOS club News & Analysis 4/4/2011 1 comment Abu Dhabi owned foundry chipmaker Globalfoundries Inc. has signed a "strategic, long-term" partnership with European research institute IMEC on sub-22nm CMOS scaling and GaN-on-Si technology.
Atomic superconductor one-ups squid News & Analysis 4/1/2011 6 comments Circulating ultra-cold atoms around a ring exhibits superfluidity—the atomic version of superconductivity—potentially enabling sensors capable of tracking rotational motion in gyroscopes of unparalleled accuracy, according to the National Institute of Standards and Technology and Technology.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.