NXP gears up for GaN production Design How-To 5/31/2013 2 comments The U.K. government is to provide 20 percent of the budget to support the creation of 100 power semiconductor jobs at NXP's Hazel Grove wafer fab in England.
Intel invests in Irish R&D News & Analysis 5/28/2013 10 comments Intel is investing $1.5 million in the Tyndall National Institute at University College Cork to help collaboration in R&D in photonics, microsystems and nanoelectronics.
Europe backs FDSOI wafer fabs News & Analysis 5/21/2013 3 comments A $465 million collaborative R&D project is set to support pilot lines in Dresden and Grenoble for production of fully depleted silicon on insulator manufacturing process.
ST to deny rivals FDSOI access News & Analysis 5/20/2013 Post a comment In an interview Jean-Marc Chery, ST's CTO (shown), said his company could install its FDSOI process in multiple foundries but for now has an agreement in place that will deny certain companies access to the process.
Intel, Qualcomm pioneer MEMS performance standard Design How-To 5/3/2013 3 comments "Under MIG's guidance and through the tireless leadership of Intel and Qualcomm Technologies, the sensor industry has acknowledged an important product specification issue," said MEMS Industry Group Executive Director Karen Lightman.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.