NXP gears up for GaN production Design How-To 5/31/2013 2 comments The U.K. government is to provide 20 percent of the budget to support the creation of 100 power semiconductor jobs at NXP's Hazel Grove wafer fab in England.
Intel invests in Irish R&D News & Analysis 5/28/2013 10 comments Intel is investing $1.5 million in the Tyndall National Institute at University College Cork to help collaboration in R&D in photonics, microsystems and nanoelectronics.
Europe backs FDSOI wafer fabs News & Analysis 5/21/2013 3 comments A $465 million collaborative R&D project is set to support pilot lines in Dresden and Grenoble for production of fully depleted silicon on insulator manufacturing process.
ST to deny rivals FDSOI access News & Analysis 5/20/2013 Post a comment In an interview Jean-Marc Chery, ST's CTO (shown), said his company could install its FDSOI process in multiple foundries but for now has an agreement in place that will deny certain companies access to the process.
Intel, Qualcomm pioneer MEMS performance standard Design How-To 5/3/2013 3 comments "Under MIG's guidance and through the tireless leadership of Intel and Qualcomm Technologies, the sensor industry has acknowledged an important product specification issue," said MEMS Industry Group Executive Director Karen Lightman.
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.