Thin Film offers passive plastic NVM News & Analysis 6/30/2011 2 comments Printed plastic memory pioneer Thin Film Electronics ASA has announced the development of a passive array nonvolatile printable plastic memory that is describes as being suitable for secure documents.
Researchers look at typing as power source Research 6/29/2011 17 comments Researchers in Australia have been looking at whether typing could be used to recharge electronic equipment. If their findings can be scaled up then chargers could be relegated to emergency use only.
Energy efficiency may require 'cool factor' News & Analysis 6/28/2011 27 comments The Smart Energy Panel at the Freescale Technology Forum addressed the issue of smarter energy efficiency by asking its panelists to expound on the question: What is the biggest hurdle to action?
Nanoelectronics body doubles 2011 funds to $250-million Research 6/28/2011 9 comments The ENIAC Joint Undertaking, a European public-private partnership for the funding of nanoelectronics research in Europe, has said the amount of money available through the latest call for proposals includes grants totaling 175 million euro (about $250 million) an increase of 100 percent on 2010.
PLX, Avago demo PCI Express over fiber News & Analysis 6/21/2011 Post a comment Chip makers PLX Technology and Avago Technologies announced a collaboration using optics to demonstrate PCI Express extending beyond its dominant role within the box to a cabled box-to-box solution.
Sensors: More than MEMS Blog 6/21/2011 2 comments The fact that I spend too much time focusing on consumer electronics was brought home to me vividly by a visit to the recent Sensors Expo 2011 in Chicago. Far from the niche show that I expected, it was swamped by over 4,000 attendees checking out 140 exhibiting companies, making navigating the aisles a good application for GPS, LIDAR, a 3-axis accelerometer and a collision-avoidance system.
ECU architecture ensures failure safety Design How-To 6/17/2011 3 comments The complexity of automotive mechatronic systems makes it impossible to fully determine all potential failure modes or to test all possible behavior. The challenge is to architect control units in a way that dangerous failures are prevented or at least sufficiently controlled.
Why AMD is opening up Fusion... Blog 6/16/2011 6 comments The transition to many-core processing is going be accompanied by a step up in abstraction. As CPU and GPU become the new chip building blocks AMD is trying to take the higher ground with is Fusion System Architecture.
AMD-authored OpenCL textbook due in August Research 6/15/2011 1 comment Advanced Micro Devices Inc. has collaborated with Northeastern University on the preparation of a book entitled Heterogeneous Computing with OpenCL that is due to be published by Morgan Kaufmann in August 2011.
'Bit-Reshaper' corrects FlexRay timing errors Design How-To 6/10/2011 1 comment EMI susceptibility and signal quality issues with complex topologies have prevented a breakthrough of the FlexRay automotive data bus. But here's how to correct bit timing mismatches and significantly improve overall signal quality in FlexRay networks.
Tech Trends: Customer engagement puts the Digital Consumer in the driver's seat Design How-To 6/10/2011 Post a comment Digital Consumer is armed with many brand and product choices. While various industries have adapted their customer engagement strategies to engage the Digital Consumer, the automotive customer journey remains a path of multiple years, players, and disjointed interactions. But, in fact, the vehicle just might be the most important digital consumer domain.
Kovio raises $15 million for printed NFC News & Analysis 6/9/2011 2 comments Kovio, a private company developing manufacturing technology that combines graphics printing with silicon-based circuitry, has raised $15 million to pursue NFC applications in a round of funding led by Tyco Retail Solutions.
Intel tips second university research center News & Analysis 6/7/2011 7 comments The second Intel Science and Technology Center—part of a commitment by the company to pump $100 million into U.S. university research over the next five years—will focus on secure computing and will be hosted at the University of California-Berkeley in collaboration with several other universities, Intel said.
Pick the best Engineering Investigations piece Engineering Investigations 6/1/2011 6 comments We've been around the world, drunk Calvados in exotic locations, waded knee-deep in exploding mice, ground our teeth at management ineptitude and learned the value of teamwork. Now, it's time to help determine the best of the latest Engineering Investigations blog submissions!
Rusnano draws MEMS firm to Russia News & Analysis 6/1/2011 3 comments Rusnano, the Russian government investment fund for nanotechnologies, has said it is investing $15 million into a $22 million project with MEMS-based timing company SiTime Corp. under which the company will open up a development center in Russia.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.