Renesas rolls dual-type power MOSFET Product News 7/31/2008 Post a comment Designed to make DC/DC converters more efficient for laptop PCs and communication devices, Renesas' latest power MOSFET boasts a chip mounting area that is half the size of existing dual-package power MOSFET configurations.
Audio connectors shrink in size Product News 7/31/2008 1 comment ITT Interconnect Solutions has developed a miniature audio connector series, aimed at higher quality compact audio applications in video, broadcast and recording.
MIT claims 24/7 solar power Design How-To 7/31/2008 3 comments Researchers at the Massachusetts Institute of Technology have combined a liquid catalyst with photovoltaic cells to achieve what they claim is a solar energy system that could generate electricity around the clock.
Digital Potentiometers feature 1 percent accuracy Product News 7/31/2008 Post a comment Analog Devices introduced the digital potentiometer (digiPot) AD529x family with the industry's best resistor tolerance of just 1 percent, allowing designers of industrial and instrumentation equipment to meet tighter resistor matching requirements for improved system accuracy.
Tutorial: Radio Basics for UHF RFID--Part VII Design How-To 7/31/2008 Post a comment Here is Part VII of Chapter 3--Radio Basics For UHF RFID--from The RF in RFID: Passive UHF RFID in Practice. Written for the electrical engineer but not the RFID expert, Dr. Dobkin explains what to expect, develop, and use while implementing an RFID system.
Reduce EMI in Class D Audio Applications Design How-To 7/30/2008 1 comment Class D amplifiers are the audio amplifier of choice for portable and power sensitive applications. Improvements to audio quality and EMI performance, have simplified designing with Class D amplifiers. Here is how to achieve shorter design cycles, lower system size and cost, and longer battery life in portables.
Microscope-on-a-chip debuts Product News 7/29/2008 Post a comment Today's bulky, expensive microscopes could be come smaller and cheaper after researchers found a way to combine pinhole optics, microfluidics and a charge-coupled device to assemble a working microscope on a single chip.
Calculate your individual ecological footprint Industrial Control DesignLine Blog 7/29/2008 Post a comment EBV has launched the ecological footprint calculator Now, users can calculate their own annual greenhouse gas emissions (their ecological footprint) by entering details of their household and travel activities.
Lasers need lenses no more News & Analysis 7/29/2008 1 comment Researchers have demonstrated a plasmonic collimator that utilizes grooves etched directly into the semiconductor laser facet. The technique could eliminate costly, bulky lenses.
Virtuelle Instrumente in der Praxis - VIP 2008 News & Analysis 7/29/2008 Post a comment National Instruments 13th annual customer and technology conference "Virtuelle Instrumente in der Praxis - VIP 2008" will take place on 8th and 9th of October in the Veranstaltungsforum in Fuerstenfeldbruck near Munich, Germany.
8th International Congress MID 2008 News & Analysis 7/29/2008 Post a comment On 24th and 25th of September, the 8th International Congress MID 2008 takes place at the congress center of Fuerth. This worldwide leading event about MID technology presents an international accepted forum that enables intensive exchange of experiences in the field of molded interconnect devices.
Intersil acquires D2Audio Product News 7/28/2008 Post a comment Analog-chip maker Intersil Corp. has signed a definitive agreement to acquire D2Audio Corp., a supplier of digital audio power amplifiers.
Troubleshooting antenna and feeder problems Design How-To 7/28/2008 2 comments The antenna and feeder are probably the least reliable part of any radio system. Measuring the return loss using a dual directional coupler can assist in tuning and checking the antenna. This article explains what is involved in making measurements with a dual directional coupler, and what else to look out for.
DSP-based audio post processing enhances audio quality Design How-To 7/28/2008 5 comments Supporting multiple compression formats in audio players is no longer a differentiation but rather a compulsory feature. The real value add today comes in quality enhancements that increase listening pleasure. Post-processing effects ranging from equalizers to cross-fade functions to virtual surround determine winners in the competitive portable audio space.
Research institute creates ultra-fast 3D circuit News & Analysis 7/28/2008 Post a comment The Berlin-based Ferdinand Braun Institute for Ultra-High Frequencies (FBH) has developed a semiconductor process that enables transistors switching at frequencies of well beyond 200 GHz. The process has another capability which could be of interest to the semiconductor industry: It enables chip designers to create three-dimensional integrated circuits.
Portable medical apps challenge low-power quest Design How-To 7/28/2008 Post a comment The demands for extended battery life, sufficient computational capability and a flexible man-machine interface (MMI) require the use of a DSP subsystem that is high-performance (both in terms of computation and signal conversion capabilities), ultra-low-power and flexible.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.