SofCheck preps ParaSail parallel language Research 7/28/2011 10 comments SofCheck Inc., best known as a vendor of software analysis and verification technology and Ada Compilers, is working on a parallel programming language called ParaSail that has been presented at two learned conferences recently.
IEEE publishes 'white space' WRAN standard Research 7/27/2011 6 comments The Institute of Electrical and Electronics Engineers (IEEE) has published the 802.22 standard for Wireless Regional Area Networks (WRANs). The standard covers broadband wireless access at up to 22-Mbps per channel over distances up to 100 kilometers from a transmitter without interfering with terrestrial television broadcasts that use the same part of the spectrum.
ADI invests $70 million in Irish R&D Research 7/27/2011 Post a comment The Industrial Development Agency of Ireland (IDA Ireland) has announced that chip company Analog Devices Inc. is embarking on a 50 million euro (about $70 million) R&D investment program at its Raheen campus near Limerick.
STMicroelectronics collaborates with Soundchip to bring HD-PA to market News & Analysis 7/27/2011 Post a comment STMicroelectronics is to collaborate with Soundchip SA, a Swiss-based electro-acoustics consultancy and originator of the High Definition Personal Audio (HD-PA) Standard, to bring HD-PA to market by applying their respective strengths in audio system and semiconductor technology, product design and industrialization methods, audio software and sales and marketing.
Intel SoCs aided by interconnect, IP library News & Analysis 7/26/2011 3 comments Intel now has the tools in place – in particular an on-chip interconnect fabric, an extensive IP library and software – to make a success of its system-on-chip engineering effort, according to Bill Leszinske, an executive with Intel's Atom processor SoC development group.
Chips in Space: The building of an amateur satellite Blog 7/25/2011 23 comments Over the next several weeks, this limited-series guest blog will relate the story of how my colleagues and I came to build an amateur satellite, the challenges we ran into while doing so and, hopefully, its successful deployment from the International Space Station at roughly the end of July or Early August.
MediaTek goes to startup for wireless charging News & Analysis 7/20/2011 5 comments Fabless communications chip company MediaTek Inc. has entered into technology transfer and licensing agreement with WiTricity Corp., a spin off from the Massachusetts Institute of Technology, on wireless charging.
Ferroelectrics fabbed on plastic News & Analysis 7/19/2011 7 comments Ferroelectric memories, energy harvesting arrays, sensors and actuators could soon be fabricated on plastic substrates, according to researchers at the Georgia Institute of Technology, who recently demonstrated a new low-temperature process using an atomic-force microscope.
Maxim pays $130 million for MEMS firm News & Analysis 7/18/2011 4 comments Maxim Integrated Products Inc. has said it has acquired fabless MEMS firm SensorDynamics AG for $130 million. With the acquisition of the company Maxim takes on about $34 million of debt.
SpiNNaker ARM chip slide show Research 7/14/2011 9 comments A selection of photographs of the 18-core ARM processor developed at the University of Manchester for the purpose of simulating the human brain.
Hynix, Toshiba team up on MRAM News & Analysis 7/13/2011 13 comments Hynix Semiconductor Inc. and Toshiba Corp. have agreed to develop spin-transfer torque magnetoresistance RAMs together with both saying that the technology is an important next-generation non-volatile memory.
Globalfoundries engages startup for R&D News & Analysis 7/12/2011 Post a comment Globalfoundries will collaborate with startup Intermolecular on semiconductor process technology R&D under the terms of a multi-year collaborative development program and IP licensing agreement.
Printed non-volatile rewritable ferro-electric memories Design How-To 7/11/2011 2 comments Printed electronics has recently moved from a focus on the production of individual components towards the design and initial commercialization of integrated systems. To create such systems, the use of non-volatile random access memory is often essential.
Sicily 'fab' PV plant is its own first customer News & Analysis 7/8/2011 2 comments A building in Catania, Sicily, that was originally constructed by STMicroelectronics to be a 300-mm wafer fab, has been inaugurated as a manufacturing site for photovoltaic panels. And the plant is going to be its own first customer with plans to site a 1-megawatt solar energy farm on the roof of the building that was formerly known as M6.
Baolab MEMS-in-CMOS heads for the compass market News & Analysis 7/4/2011 2 comments Baolab Microsystems SL (Barcelona, Spain) a startup pioneering the creation of microelectromechancial systems (MEMS) within the back-end-of-line structure of CMOS wafers, has completed its first product design, a magnetic compass sensor.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.