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posted in July 2012
FinFETs-on-SOI can double battery life, says GSS
News & Analysis  
7/27/2012   12 comments
Fully depleted FinFET style transistors made on SOI wafers are likely to allow about one-third the leakage current of FinFETs made on bulk silicon according to TCAD simulations performed by Gold Standard Simulations.
Researchers claim smallest semiconductor laser
News & Analysis  
7/27/2012   7 comments
Physicists at the University of Texas-Austin say they have developed the world's smallest semiconductor laser in collaboration with colleagues in Taiwan and China.
European TSV summit planned
News & Analysis  
7/26/2012   2 comments
SEMI, the international trade association that represents the interests of semiconductor equipment and materials companies, is planning for a summit meeting on 3-D packaging and through silicon via to be held in Grenoble, France, on January 22 and 23, 2013.
HiWave tips glasses frames that provide audio
News & Analysis  
7/26/2012   3 comments
Next generation headsets and glasses frames will be able to deliver audio in a compact way without using ear buds or sticking things in the ear canal, according to HiWave.
NASA preps spacecraft for risky Mars landing attempt
News & Analysis  
7/26/2012   9 comments
NASA has repositioned its Mars Odyssey spacecraft to relay the results of next month's risky landing attempt by the Curiosity rover. Meanwhile, mission managers declined to gauge the odds for a successful landing.
Qualcomm, Renault team on wireless electric vehicle charging
News & Analysis  
7/24/2012   16 comments
Qualcomm has announced it has agreed to apply its wireless electric vehicle charging technology to Renault vehicles as part of an upcoming trial to take place in London in 2012.
ST trims losses, cuts capex
News & Analysis  
7/24/2012   3 comments
A combination of continued losses and renewed market softness for Europe's leading chip company STMicroelectronics NV has led the company to make a 25 percent cut in its capital expenditure budget for 2012.
Driving ST's auto IC strategy: Manufacturing line can't stop
News & Analysis  
7/23/2012   3 comments
STMicroelectronics is factoring the diverging nature of automotive components and design demands in emerging markets against the imperative of car makers to keep their manufacturing lines moving at all times.
TSMC tops pure-play MEMS foundry ranking from IHS
News & Analysis  
7/23/2012   3 comments
Taiwan Semiconductor Manufacturing Co. Ltd. was the largest pure-play foundry for microelectromechanical systems devices in 2011, according to market analysis firm IHS iSuppli.
Directed self assembly made to work on the square
7/22/2012   2 comments
Directed self assembly of nanometer-scale structures is a promising method of lithography of the future but it has suffered to date from only allowing the creation of a few arbitrary shapes. Now researchers at Massachusetts Institute of Technology have reported on how to create rectangular structures, with potential application for integrated circuits.
ASML says fast EUV machines coming by 2016
News & Analysis  
7/18/2012   26 comments
Eric Meurice, CEO of lithography equipment supplier ASML Holding NV (Veldhoven, The Netherlands), has provided background on the roll out of its next generation extreme ultra violet lithography machines and the throughputs customers can expect.
New Energy Symposium attracts investment seekers
News & Analysis  
7/18/2012   1 comment
Fifteen “clean tech” companies, more than half of which are located in New York state, are competing for investment funds at the seventh annual New Energy Symposium at the New York Academy of Sciences this week.
6-axis MEMS chip gets motion engine
News & Analysis  
7/17/2012   3 comments
STMicroelectronics has shrunk its 6-axis accelerometer-gyroscope combo chip while adding a smart motion processing chip.
Student proposes C60-based molecular transistor
7/17/2012   2 comments
Elad Mentovich, a Ph.D. student at Tel Aviv University, has made a vertical transistor based on a single carbon-60 molecule that he reckons could be the basis for both a logic transistor and a memory element.
NYC to London on a 4,000 mph vacuum train
The Engineering Life - Around the Web  
7/16/2012   62 comments
Supersonic transport, like retired turbojet Concorde, can officially be considered old-school. Especially now that engineers have figured out a way to shuttle people across the Atlantic at hypersonic speeds of over 2,500 mph. Through vacuum suction tubes.
Maxim sensor strategy targets analog integration
News & Analysis  
7/16/2012   3 comments
Maxim Integrated Products is attempting to take analog integration to a new level by combining up to seven sensors in a tiny optical package.
IC supplier, customer cooperation methodologies drive up electronics system quality
Design How-To  
7/13/2012   1 comment
Although IC manufacturers have been extremely successful in reducing defects, on the other hand a significant part of the quality drive for printed-circuit-board module makers is stemming from reducing electrical over-stress (EOS), electrostatic discharge (ESD), and cases of no-trouble-found (NTF). Solution of these problems requires the involvement of the PCB module maker and the automotive manufacturer as well.
Six-axis MEMS sets new size/power low
News & Analysis  
7/12/2012   2 comments
Invensense says its latest six-axis MEMS combo chip combining a three-axis accelerometer and three-axis gyroscope sets a new low in size and power.
Thin Film printed electronics selected for smart packaging
News & Analysis  
7/11/2012   6 comments
Bemis Company Inc. (Neenah, Wisc.), a producer of films and packaging for the food and healthcare industries, is working with printed electronics pioneer Thin Film Electronics ASA (Oslo, Norway) to develop a flexible sensing film that can wirelessly communicate data.
Intel keynoter: Power consumption hurdles litter path to exascale computing
News & Analysis  
7/11/2012   8 comments
Thanks to parallelism and technology scaling, exascale computing will become a reality before the decade is out, but it won't live up to its full potential unless fundamental power consumption barriers are overcome, according to Intel Fellow Shekhar Borkar.
Smallest six-axis gyroscope/accelerometer cuts size by 45%
Product News  
7/11/2012   Post a comment
The MPU-6500, a second-generation 6-axis MotionTracking device by InvenSense is the world’s smallest 6-axis device.
MIT develops tri-source energy harvest control IC
7/10/2012   4 comments
Researchers at MIT have developed the control circuitry for an energy harvesting platform that can work with light, heat and vibration sources.
Flemish government promises IMEC cash for 450-mm fab
News & Analysis  
7/9/2012   1 comment
The Flemish Minister of Innovation, Ingrid Lieten, has made a commitment to invest in the building of clean room facilities for 450-mm diameter wafer processing at the pilot wafer fab of IMEC in Leuven, Belgium.
Printed electronics startup gains security foil licensee
News & Analysis  
7/9/2012   1 comment
PragmatIC Printing Ltd. (Cambridge, England), a developer of printed electronic technology, has announced it has licensed Illinois Tool Works Inc., an $18 billion diversified industrial manufacturer, to use its printed electronics technology. ITW is also set to collaborate with PragmatIC's pilot production program, known as P4.
Tools expand for sensor fusion hubs
News & Analysis  
7/6/2012   1 comment
An expanding suite of tools for fusing the outputs from MEMS chips is designed to enable designers to develop sensor fusion algorithms.
Advanced switches customize, optimize automotive HMIs
Design How-To  
7/6/2012   Post a comment
Known in the industry as “haptics,” the touch, feel, and sound of a switch’s actuation are paramount to a user’s experience and impression of a particular vehicle. Automotive design engineers want user interfaces to respond and provide feedback in specific ways that are unique to their vehicle.
Teardown: Inside Google's Nexus 7 tablet
News & Analysis  
7/5/2012   33 comments
Our partners at UBM TechInsights take the measure of Google's Nexus 7 tablet and found a few new chip vendors not normally found in high-end consumer devices.
Russian component market to grow 9.5% in 2012, says study
News & Analysis  
7/5/2012   1 comment
The Russian electronics component market is set to grow by 9.5 percent in 2012 to reach an annual size of about $2.6 billion, according to a report prepared by the Association of Suppliers of Electronic Components.
Nuclear fusion research aids EUV source breakthrough
7/5/2012   12 comments
A University of Washington laboratory that has been working for more than a decade on nuclear fusion as a source of energy, thinks it has leapfrogged ahead of companies trying to create a viable light source for extreme ultraviolet lithography.
MEMS market to show 13% CAGR to 2017, says Yole
News & Analysis  
7/4/2012   1 comment
The worldwide market for microelectromechanical systems components will be worth about $11.5 billion in 2012, an increase of about 12.7 percent compared with the size of the market in 2011, according to market research firm Yole Developpement.
.Advantech aims boards at the Internet of Things
News & Analysis  
7/4/2012   1 comment
Board-level and embedded PC company Advantech is aiming to dominate the Internet of Things with embedded devices and management software in a shift of strategy.
ST supports study lab in northeast China
7/4/2012   4 comments
STMicroelectronics and Harbin Institute of Technology in northeastern China have announced the opening of a joint laboratory with the aim of supporting the study, research and development of applications in medical electronics, power management and multimedia convergence.
A Hitchcockian nightmare: Europe falling off a cliff
7/4/2012   33 comments
Europe's monetary and debt woes are now clearly having an effect on its ability to do business – which is a yet more frightening prospect, than the crisis we are already living with.
Advanced capacitors ensure long-term control-circuit stability
Design How-To  
7/2/2012   Post a comment
Tantalum and niobium-oxide technology meet industry needs for rugged capacitors that maintain high-performance standards under electrical and mechanical stresses. Technical improvements have been made that strengthen the structure of the capacitor and give it more robust performance in a variety of uses. And application guidelines aid design engineers.
Agilent debuts PA module design for next release of Advanced Design System
Product News  
7/2/2012   Post a comment
Agilent Technologies Inc. announced new capabilities for RF power amplifier design in the next major release of Agilent's Advanced Design System.
Terahertz emitter harnesses 45-nm CMOS
News & Analysis  
7/2/2012   3 comments
Texas Instrument has demonstrated a terahertz-range emitter which could be a step toward creating silicon-based terahertz-range emitters and detectors that could downsize millimeter-wavelength devices for a wide variety of applications beyond airport security including safer medical and dental imaging along with a whole array of industrial and environmental applications aimed at detecting hazardous substances.
Researchers try vacuum transistors at low voltage
7/2/2012   12 comments
Researchers at the University of Pittsburgh have come up with a device structure that allows a switch back to vacuum, in contrast to the solid-state, as the medium for electron transport in transistors.
China, U.S. lead innovation, Europe nowhere, says survey
News & Analysis  
7/2/2012   55 comments
China and the United States are the two countries most likely to come up with "disruptive technology breakthroughs" with a global impact in the next two to four years, according to a survey conducted by auditor and consultancy KPMG.

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