FinFETs-on-SOI can double battery life, says GSS News & Analysis 7/27/2012 12 comments Fully depleted FinFET style transistors made on SOI wafers are likely to allow about one-third the leakage current of FinFETs made on bulk silicon according to TCAD simulations performed by Gold Standard Simulations.
European TSV summit planned News & Analysis 7/26/2012 2 comments SEMI, the international trade association that represents the interests of semiconductor equipment and materials companies, is planning for a summit meeting on 3-D packaging and through silicon via to be held in Grenoble, France, on January 22 and 23, 2013.
ST trims losses, cuts capex News & Analysis 7/24/2012 3 comments A combination of continued losses and renewed market softness for Europe's leading chip company STMicroelectronics NV has led the company to make a 25 percent cut in its capital expenditure budget for 2012.
Directed self assembly made to work on the square Research 7/22/2012 2 comments Directed self assembly of nanometer-scale structures is a promising method of lithography of the future but it has suffered to date from only allowing the creation of a few arbitrary shapes. Now researchers at Massachusetts Institute of Technology have reported on how to create rectangular structures, with potential application for integrated circuits.
ASML says fast EUV machines coming by 2016 News & Analysis 7/18/2012 26 comments Eric Meurice, CEO of lithography equipment supplier ASML Holding NV (Veldhoven, The Netherlands), has provided background on the roll out of its next generation extreme ultra violet lithography machines and the throughputs customers can expect.
New Energy Symposium attracts investment seekers News & Analysis 7/18/2012 1 comment Fifteen “clean tech” companies, more than half of which are located in New York state, are competing for investment funds at the seventh annual New Energy Symposium at the New York Academy of Sciences this week.
Student proposes C60-based molecular transistor Research 7/17/2012 2 comments Elad Mentovich, a Ph.D. student at Tel Aviv University, has made a vertical transistor based on a single carbon-60 molecule that he reckons could be the basis for both a logic transistor and a memory element.
NYC to London on a 4,000 mph vacuum train The Engineering Life - Around the Web 7/16/2012 62 comments Supersonic transport, like retired turbojet Concorde, can officially be considered old-school. Especially now that engineers have figured out a way to shuttle people across the Atlantic at hypersonic speeds of over 2,500 mph. Through vacuum suction tubes.
IC supplier, customer cooperation methodologies drive up electronics system quality Design How-To 7/13/2012 1 comment Although IC manufacturers have been extremely successful in reducing defects, on the other hand a significant part of the quality drive for printed-circuit-board module makers is stemming from reducing electrical over-stress (EOS), electrostatic discharge (ESD), and cases of no-trouble-found (NTF). Solution of these problems requires the involvement of the PCB module maker and the automotive manufacturer as well.
Thin Film printed electronics selected for smart packaging News & Analysis 7/11/2012 6 comments Bemis Company Inc. (Neenah, Wisc.), a producer of films and packaging for the food and healthcare industries, is working with printed electronics pioneer Thin Film Electronics ASA (Oslo, Norway) to develop a flexible sensing film that can wirelessly communicate data.
Printed electronics startup gains security foil licensee News & Analysis 7/9/2012 1 comment PragmatIC Printing Ltd. (Cambridge, England), a developer of printed electronic technology, has announced it has licensed Illinois Tool Works Inc., an $18 billion diversified industrial manufacturer, to use its printed electronics technology. ITW is also set to collaborate with PragmatIC's pilot production program, known as P4.
Advanced switches customize, optimize automotive HMIs Design How-To 7/6/2012 Post a comment Known in the industry as “haptics,” the touch, feel, and sound of a switch’s actuation are paramount to a user’s experience and impression of a particular vehicle. Automotive design engineers want user interfaces to respond and provide feedback in specific ways that are unique to their vehicle.
Nuclear fusion research aids EUV source breakthrough Research 7/5/2012 12 comments A University of Washington laboratory that has been working for more than a decade on nuclear fusion as a source of energy, thinks it has leapfrogged ahead of companies trying to create a viable light source for extreme ultraviolet lithography.
MEMS market to show 13% CAGR to 2017, says Yole News & Analysis 7/4/2012 1 comment The worldwide market for microelectromechanical systems components will be worth about $11.5 billion in 2012, an increase of about 12.7 percent compared with the size of the market in 2011, according to market research firm Yole Developpement.
ST supports study lab in northeast China Research 7/4/2012 4 comments STMicroelectronics and Harbin Institute of Technology in northeastern China have announced the opening of a joint laboratory with the aim of supporting the study, research and development of applications in medical electronics, power management and multimedia convergence.
Advanced capacitors ensure long-term control-circuit stability Design How-To 7/2/2012 Post a comment Tantalum and niobium-oxide technology meet industry needs for rugged capacitors that maintain high-performance standards under electrical and mechanical stresses. Technical improvements have been made that strengthen the structure of the capacitor and give it more robust performance in a variety of uses. And application guidelines aid design engineers.
Terahertz emitter harnesses 45-nm CMOS News & Analysis 7/2/2012 3 comments Texas Instrument has demonstrated a terahertz-range emitter which could be a step toward creating silicon-based terahertz-range emitters and detectors that could downsize millimeter-wavelength devices for a wide variety of applications beyond airport security including safer medical and dental imaging along with a whole array of industrial and environmental applications aimed at detecting hazardous substances.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments