Globalfoundries in multi-year contract with Cadence News & Analysis 8/31/2009 Post a comment Foundry services provider Globalfoundries has signed a multi-year technology contract with semiconductor design software vendor Cadence Design Systems. The deployment covers large parts of the design chain including verification and manufacturing.
IBM visualizes single molecule structure News & Analysis 8/27/2009 Post a comment Scientists at IBMs Zurich laboratory have succeeded to visualize the structure of an individual molecule using non-contact atomic force microscopy (AFM). The move is a further step to a still very distant future: Molecular electronics.
Startup rewrites NXP’s legacy in 3D passive integration News & Analysis 8/27/2009 Post a comment Economic crises can have positive as well as negative impacts. Thus, if NXP had not divested its wireless business and decided to sell its integrated passives device unit near Caen, Normandy (France), Ipdia would not have emerged with an ambition to deliver next-generation 3D-SiP modules for various applications, including advanced LED modules.
Dresden is like Silicon Valley: hungry talent & excellent education News & Analysis 8/27/2009 1 comment How comes that the Dresden area is the most remarkable center for start-up activities in Germany? The answer is that in the town, all ingredients necessary such as excellent mathematical education and a generation of engineers with great ideas meet. The ignition spark, however, has been imported from the U.S. – in person of Gerhard Fettweis, professor at the Dresden Technical University. In the interview Fettweis explains what are the essentials for start-up friendly environments and which techn
Arasan adds MIPI to IP stable Product News 8/27/2009 Post a comment Arasan Chip Systems, Inc. has released its MIPI (Mobile Industry Processor Interface) High Speed Synchronous Interface (HSI) controller IP and software stack.
Making bare essentials work Blog 8/25/2009 Post a comment Startup siXis Inc. claims mounting bare die on a wafer-scale silicon circuit board essentially eliminates the power-hungry soldered interconnections between packages.
Carbon nanotube interconnect startup raises $4.1 million News & Analysis 8/25/2009 Post a comment Surrey NanoSystems Ltd. (Newhaven, England) has raised £2.5 million (about $4.1 million) in second round venture capital to help it develop a silicon-friendly, low-temperature carbon nanotube growth process. Surrey NanoSystems believes CNTs can be used as semiconductor interconnect.
Simplifying design of industrial process-control systems with PLC evaluation boards (Part 1 of 2) Design How-To 8/24/2009 1 comment
PLC evaluation board applications for industrial process-control systems are diverse, ranging from simple traffic control to complex electrical power grids, from environmental control systems to oil-refinery process control. This two-part series looks at using a PLC evaluation board to simplify design, with a practical example application outlined including schematics and tutorial on using the system.
Silicon circuit board seeks to replace ASICs News & Analysis 8/24/2009 Post a comment You may be able to kiss that printed-circuit board good-bye soon, instead mounting bare die on a wafer-scale silicon circuit board that essentially eliminates the power-hungry soldered interconnections between packages.
Omnivision licenses Slovenian IP cores News & Analysis 8/20/2009 Post a comment Omnivision Technologies Inc. (Sunnyvale, Calif.), a fabless developer and vendor of CMOS image sensors, has licensed semiconductor intellectual property from Beyond Semiconductor (Ljubljana, Slovenia).
Tower, Jazz team with SVTC on MEMS for aerospace, defense News & Analysis 8/20/2009 Post a comment Tower Semiconductor Ltd. (Migdal Haemek, Israel) and its U.S. subsidiary Jazz Semiconductor Inc. (Newport Beach, Calif.) have announced an agreement signed with SVTC Technologies LLC to provide SVTC's aerospace and defense customers with access to Jazz process technologies and manufacturing facilities.
TSMC on equipment spending spree News & Analysis 8/17/2009 Post a comment TSMC is on a buying spree, spending more than $250 million on semiconductor capital equipment in recent weeks, according to regulatory filings made by the silicon foundry giant.
IBM harnesses DNA to pattern nanoscale circuits News & Analysis 8/17/2009 Post a comment IBM Corp. researchers say they have harnessed DNA to position nanoscale components like carbon nanotubes and silicon nanowires into circuits 10 times smaller than can be achieved with current lithographic techniques.
Robotics quest part 2: the wisdom of the audience Industrial Control DesignLine Blog 8/12/2009 1 comment Last week, I discussed my quest for a robotics project for my nephew, hopefully something that we could both be involved in. I have compiled some of the responses to my original question and am going to share some of these nuggets of information.
Chip gear sales propel Applied above expectations News & Analysis 8/11/2009 Post a comment Applied Materials exceeded analyst expectations for sales and earnings for the quarter ended July 26, as a sequential increase in semiconductor equipment revenue offset declines in sales of gear used in the production of solar panels and displays.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.