ReRAM Is Memory Focus at IEDM Blog 9/30/2013 29 comments Advanced memory research is focused on ReRAM, MRAM, and vertically stacked memory, to judge from the advance program of the International Electron Devices Meeting 2013. However, there is at least one NAND paper due to be presented that could grab attention.
IEDM Set to Stage FinFET vs. FDSOI News & Analysis 9/27/2013 28 comments The leading-edge of semiconductor technology becomes more complex, and IEDM is there to bear witness -- and stage FinFET versus FDSOI, the battle for sub-20nm semiconductors.
Freescale, Micron Extend Memory Research News & Analysis 9/24/2013 2 comments Freescale Semiconductor and Micron Technology have extended separate memory research partnerships in attempts to add to their capabilities at the leading-edge of chip production and find technology that can scale beyond the limits of NAND flash memory.
HP's Loss Is Europe's Gain Blog 9/23/2013 5 comments Mike Lynch, the co-founder of a software company sold to Hewlett-Packard for $11 billion, has co-founded a venture capital company.
New York Plans $45 Billion Fab Campus News & Analysis 9/20/2013 23 comments The College of Nanoscale Science and Engineering is filing plans to develop an upstate New York site that could accommodate up to three 450mm wafer fabs at an estimated cost of up to $45 billion.
Superconducting Quantum Computer Beckons News & Analysis 9/20/2013 11 comments Lawrence Berkeley National Laboratory (Berkeley Lab) has reported the first demonstration of high-temperature superconductivity in the surface of a topological insulator--a promising material for quantum computers whose bulk properties are that of an insulator, but whose surface is a conductor.
IMEC Process Supports Germanium-Tin Transistors News & Analysis 9/18/2013 2 comments A Belgo-Japanese research team has developed an improved process for the integration of germanium-tin MOSFETs on silicon substrates. This opens up the possibility of strained GeSn pMOSFETs at sub-10 nm geometries.
Plastic Memory Firm Plans Pilot Line News & Analysis 9/17/2013 5 comments Thin Film, a developer of organic ferroelectric nonvolatile memory technology, has ordered equipment for a pilot production line in Linkoping, Sweden, and announced a plan to raise about US$23 million via the sale of shares.
Dialog's CEO Lays Ambitious Plans Blog 9/12/2013 Post a comment From domestic lighting control to wireless charging, CEO Jalal Bagherli sees nothing but opportunity for Dialog Semiconductor, one of Europe's leading fabless chip companies.
Nanotubes Boost E-Nose Sensitivity News & Analysis 9/5/2013 4 comments Researchers can identify any chemical substance by its spectrum using an inexpensive, repeatable technique in which specially grown nanotubes serve as sensors.
AMS Builds 3D Chip-Stacking Line News & Analysis 9/5/2013 2 comments Analog and sensor IC company AMS has invested more than about $33 million to create production capacity for analog 3D ICs at its wafer fab in Austria.
Sand 9 MEMS Cracks Cellphone Market News & Analysis 9/3/2013 8 comments Sand 9 has finally achieved the holy grail of micro-electromechanical systems (MEMS) compatibility with billions of cellphones as well as the emerging Internet of Things.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.