VC investment fell in 2009, Q4 signals change News & Analysis 1/25/2010 Post a comment Venture capitalists invested $17.7 billion in 2,795 deals in 2009, marking the lowest level of dollar investment since 1997, according to the MoneyTree Report by PricewaterhouseCoopers and the National Venture Capital Association (NVCA), based on data from Thomson Reuters.
Intel, Carnegie Mellon develop RF-heated solder News & Analysis 1/20/2010 1 comment Carnegie Mellon University and Intel Corp. have said they will unveil a new class of materials called solder magnetic nanocomposites that, because they can be RF-heated, could improve electronics packaging.
Rise of the Embedded Internet Design How-To 1/19/2010 Post a comment This Intel white paper looks at how breakthroughs in computing performance per watt, along with advances in wired and wireless broadband connectivity, will enable the development of billions of new intelligent embedded devices - the embedded Internet.
What was hot, cold and in between at CES News & Analysis 1/12/2010 9 comments Here's our take on what was hot and what was not at CES. If you attended, or have strong opinions based on what you have been reading, we invite you to chime in with your own picks and pans.
What was hot, cold and in between at CES News & Analysis 1/12/2010 10 comments Here's our take on what was hot and what was not at CES. If you attended, or have strong opinions based on what you have been reading, we invite you to chime in with your own picks and pans.
AMC module optimised for test equipment News & Analysis 1/6/2010 Post a comment CommAgility launched the AMC-3D74, an advanced mezzanine card module that includes a front panel mounted Serial RapidIO interface, and provides a cost-effective, high performance solution for test equipment and general purpose DSP processing applications.