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posted in January 2010
LSI, Seagate team up for solid-state storage
News & Analysis  
1/28/2010   Post a comment
LSI Corp. (Milpitas, Calif.) and Seagate Technology Inc. (Scotts Valley, Calif.) are going to work together on PCI-based solid-state storage for data centers.
Electric vehicles earn cash for owners
News & Analysis  
1/26/2010   Post a comment
Delaware becomes the first state to integrate electric vehicles into smart grid.
ZigBee Retail Services standard to focus on the retail experience
News & Analysis  
1/26/2010   Post a comment
The ZigBee Alliance has started the development of ZigBee Retail Services, a new standard focusing on the retail experience from point-of-manufacture to point-of-sale.
Java Essentials for Embedded Networked Devices - Part 1: Windows and Linux set up
Design How-To  
1/25/2010   Post a comment
Part 1 of an excerpt from the book "Designing Embedded Internet Devices" (2003) discusses how to obtain and set up Java for both Windows and Linux personal computers.
VC investment fell in 2009, Q4 signals change
News & Analysis  
1/25/2010   Post a comment
Venture capitalists invested $17.7 billion in 2,795 deals in 2009, marking the lowest level of dollar investment since 1997, according to the MoneyTree Report by PricewaterhouseCoopers and the National Venture Capital Association (NVCA), based on data from Thomson Reuters.
Some tips for charging from USB sources (Part 2 of 2)
Design How-To  
1/25/2010   Post a comment
Understand the subtleties of using the ubiquitous USB port as a charging and power source
MODULES - COM Express Module features integrated graphics and memory controller
News & Analysis  
1/23/2010   Post a comment
ADLINK'S Express-CB COM Express Moduleboasts direct CPU-to-memory interface and Intel HD Graphics.
BOARDS - Ultra-low-power STX SoM speeds customization and time-to-market
News & Analysis  
1/21/2010   Post a comment
The STX88831 STX system-on-module (SoM) from Axiomtek integrates a high-performance, low-power 1.6 GHz Intel Atom processor N270 with Intel 945GSE and ICH7M chipsets, delivering best performance-per-watt for communication, healthcare, automation, and transportation applications.
BOARDS - ETX Module features small size, low power
News & Analysis  
1/20/2010   Post a comment
WIN Enterprises' ETX module MB-80200 boasts small size and low power consumption. It has two Pineview processors and fanless operation.
NEWS - First JEDEC-compatible memory buffer creates a new class of load-reduced DIMMs
News & Analysis  
1/20/2010   Post a comment
The first JEDEC-compatible memory buffer from Inphi Corporation creates a new class of load-reduced DIMMs, enabling servers and workstations to operate at higher speeds and support more memory modules.
Intel, Carnegie Mellon develop RF-heated solder
News & Analysis  
1/20/2010   1 comment
Carnegie Mellon University and Intel Corp. have said they will unveil a new class of materials called solder magnetic nanocomposites that, because they can be RF-heated, could improve electronics packaging.
BOARDS - Intel Core i7 based VPX blade doubles computing power with half the heat
News & Analysis  
1/19/2010   Post a comment
Kontron's HPEC 6U VPX computer blade, the VX6060, doubles parallel data and signal processing and reduces heat in rugged applications.
Rise of the Embedded Internet
Design How-To  
1/19/2010   Post a comment
This Intel white paper looks at how breakthroughs in computing performance per watt, along with advances in wired and wireless broadband connectivity, will enable the development of billions of new intelligent embedded devices - the embedded Internet.
CASE STUDY: Flying Safely with 10 Gigabit-Ethernet
News & Analysis  
1/18/2010   Post a comment
How the German Air Navigation Services are securing the capacity of future networks.
Some tips for charging from USB sources (Part 1 of 2)
Design How-To  
1/18/2010   Post a comment
Understand the subtleties of using the ubiquitous USB port as a charging and power source
CES slideshow: Smartbooks, 3-D TVs, connected cars were winners
News & Analysis  
1/13/2010   Post a comment
Last but not least, our slideshow from CES 2010.
3-D TV: The EE Times guide to the shifting landscape
News & Analysis  
1/13/2010   1 comment
With one eye the consumer electronics industry sees 3-D TV as an opportunity to revive sagging revenues, and with the other it sees a complex set of unresolved technical issues.
What was hot, cold and in between at CES
News & Analysis  
1/12/2010   9 comments
Here's our take on what was hot and what was not at CES. If you attended, or have strong opinions based on what you have been reading, we invite you to chime in with your own picks and pans.
What was hot, cold and in between at CES
News & Analysis  
1/12/2010   10 comments
Here's our take on what was hot and what was not at CES. If you attended, or have strong opinions based on what you have been reading, we invite you to chime in with your own picks and pans.
Easing the challenge of RF design (Part 2 of 2)
Design How-To  
1/11/2010   Post a comment
Designing in a wireless link need not be a nightmare--if you follow some simple guidelines
LCD control development platform targets human-machine interfaces
Product News  
1/11/2010   Post a comment
NEC Electronics Europe launches the 78K0R development kit designed specifically for the evaluation of the company's 16-bit 78K0R/Lx3 microcontroller.
COM Express module equipped with Intel's latest graphics core
Product News  
1/8/2010   Post a comment
ADLINK's latest Computer-on-Module (COM), the Express-MV, is based on Intel's Core2 Duo processor and GS45 chipset with Graphics Media Accelerator (GMA) 4500MHD, and is well suited for power sensitive applications.
CES: Industry chief Shapiro says, 'Innovate or die!'
News & Analysis  
1/8/2010   1 comment
Consumer Electronics Ass'n CEO Gary Shapiro, addressing the Consumer Electronics Show, condemns government bailouts, advocating innovation as a survival strategy and warning against an "entitlement society."
Virtex-6 FPGA based XMC card target image processing applications
Product News  
1/7/2010   Post a comment
COTS board supplier Alpha Data has announced its first Virtex-6 FPGA based platform aimed at demanding digital signal processing applications.
U.S. awards $47 million for R&D on IT energy savings
News & Analysis  
1/6/2010   Post a comment
The Energy Department will fund 14 projects across the U.S. to develop technologies for improving energy efficiency in data centers and telecommunications networks.
CES: Show exposes incomplete 3-D TV products
News & Analysis  
1/6/2010   1 comment
What's required to make a TV capable of displaying 3-D content? Mitsubishi says it has the answer.
AMC module optimised for test equipment
News & Analysis  
1/6/2010   Post a comment
CommAgility launched the AMC-3D74, an advanced mezzanine card module that includes a front panel mounted Serial RapidIO interface, and provides a cost-effective, high performance solution for test equipment and general purpose DSP processing applications.


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Max Maxfield

March 28 is Arduino Day -- Break Out the Party Hats!
Max Maxfield
7 comments
Well, here's a bit of a conundrum. I just received an email from my chum David Ashton who hails from the "Unfinished Continent" Down Under. David's message was short and sweet; all he said ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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