Advanced motherboards support long-life embedded apps Product News 10/16/2007 Post a comment RadiSys has expanded its Endura portfolio with the introduction of three advanced motherboards based on Intel's Q35 Express chipset. These boards target long-life embedded applications including medical ultrasound, industrial automation and video surveillance.
Broadcom readies HSUPA chip for 3G handsets Product News 10/15/2007 Post a comment Broadcom Corporation has started sampling to selected customers a single-chip HSPA (high-speed packet access) processor that integrates all the key 3G cellular and mobile technologies in a low power, single 65-nm CMOS die.
ZigBee PRO standard gets the all clear News & Analysis 10/12/2007 Post a comment The ZigBee Alliance has approved the ZigBee PRO profile stack that adds advanced features and greater flexibility to the original specification, particularly related to ease-of-use and support for larger networks.
N. American PCB shipments decline by 10 percent News & Analysis 10/9/2007 Post a comment IPC -- Association Connecting Electronics Industries has released the August findings from its monthly North American PCB Statistical Program, which reveals that shipments for rigid PCB and flexible circuits are down by more than 10 percent.
TriQuint touts green credentials with basestation PA Product News 10/4/2007 Post a comment RF front-end specialist and foundry services provider Triquint Semiconductor has started sampling high-voltage gallium arsenide (GaAs) power amplifier transistors it claims substantially increase the efficiency of 3G cellular base stations, leading to meaningful energy savings.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.