Digital power control delivers efficiency in high-power applications Design How-To 10/29/2008 1 comment The emphasis is firmly on increasing power density while maintaining tight regulation with the least possible conversion loss -- objectives that traditional dc-dc converters using analog control loops have generally found to be mutually exclusive but that digital-control platforms can meet.
Embedded controller speeds up data exchange Product News 10/28/2008 Post a comment Siemens Industry Automation is announcing the modular SIMATIC S7-mEC embedded controller with preinstalled runtime visualization software. In addition, the EM PC and EM PCI-104 expansion modules for additional hardware functionalities are now also available.
Cisco engineer lobbies for blade-server beater News & Analysis 10/23/2008 Post a comment A senior engineer from Cisco Systems is trying to rally support for an expanded Advanced TCA design for the data center, going head-to-head with the blade servers of top computer makers such as IBM and Hewlett-Packard at a time of expanding interest in dense, modular systems to serve users ranging from Google to the U.S. Navy.
Smart sensor company continues recruitment drive Product News 10/23/2008 Post a comment Intelligent sensor developer, DeepStream Technologies Ltd., (Bangor, Wales) aims to hire an additional 70 engineers and support staff to take the number of people it employs to 150 within two years. The company had announced a plan to go from 72 staff to about 100 in March 2008.
Energy efficiency goal turns car's electronics inside out Special Report 10/17/2008 Post a comment The current challenge number one in the German, and perhaps in the global automotive industry is how to reduce energy consumption. Electronic controls and semiconductors have a key function in this game in particular when it comes to innovative drive concepts.
Philips shows magic wands and electric dresses News & Analysis 10/16/2008 3 comments A tour of Philips Research showed a host of projects ranging from novel remote controls and 3DTVs to wearable electronics and intelligent buildings, all in progress under a new corporate philosophy of open innovation.
Silicon ink targets RFIDs News & Analysis 10/16/2008 Post a comment Printing thin-film circuits on flexible substrates may be ready for prime time with the introduction of what is claimed as the first commercial application of silicon ink.
Tiny IPv6 stack for unlimited device to web connections Product News 10/15/2008 Post a comment Atmel, Cisco and the Swedish Institute of Computer Science (SICS) announced the availability of uIPv6, one of the world's smallest open-source, IPv6-ready protocol stack, which could enable every device, no matter how limited by power or memory to have an Internet Protocol address.
Conductive adhesive could replace solder Product News 10/14/2008 Post a comment Researchers have invented a dry adhesive that they propose using instead of soldering--not only to assemble components on circuit boards, but potentially also patterned onto chips themselves to connect together individual transistors.
PC/104 adopts PCI Express Design How-To 10/13/2008 Post a comment The PC/104 bus is an ISA-compatible, 3.550-inch x 3.775-inch, stackable board-level architecture that evolved from the MiniModule mezzanine bus fielded by Ampro Computer in 1987 and was standardized under the auspices of the PC/104 Consortium in 1992. It grew over time into a family of architectures, with the advent of PC/104-Plus (ISA bus and PCI bus) in 1997 and PCI-104 (PCI only) in 2003. The latest incarnation of the form factor adds PCI Express (PCIe) to the mix, in three different specific
Cassini probe buzzes Saturn moon News & Analysis 10/10/2008 Post a comment NASA's Cassini spacecraft orbiting Saturn made its closest fly-by of the moon Enceladus. Analyzing molecules being ejected from geysers on the moon's surface, Cassini will provide scientists with data on whether water is present on the satellite.
Motorola backs Kineto's $15 million funding round News & Analysis 10/7/2008 Post a comment Wireless access specialist Kineto Wireless, Inc., has raised an additional $15.5 million in funding, including a strategic investment from Motorola as part of a broader commercial relationship with the company's Home & Networks Mobility business.
XMC/PMC module enables high-speed sensor I/O for real-time DSP systems Product News 10/5/2008 Post a comment The popularity of high-speed serial interconnects in embedded real-time DSP systems and the effectiveness of FPGAs to interface to sensor I/O makes VMETRO's XMC-FPGA05F well-suited for demanding real-time applications such as remote sensor interfaces, data recorders, and embedded real-time distributed computing
DLNA 1.5 certified STB reference design Product News 10/3/2008 Post a comment Oregan Networks' new reference design meets Digital Living Network Alliance (DLNA) 1.5 expanded guidelines, supporting High Definition WMV-9 and mobile H.264 video codecs, along with other baseline media format requirements.
MEN nach EN 9100 zertifiziert News & Analysis 10/2/2008 Post a comment Nach einer intensiven Vorbereitungsphase erfolgte im September 2008 die offizielle Zertifizierung der MEN Mikro Elektronik gemäß EN 9100 als anerkannter Zulieferer für die Luft- und Raumfahrtbranche.
Foxconn sues Molex over DisplayPort rights News & Analysis 10/1/2008 Post a comment Foxconn, the world's largest contract electronics manufacturer, has filed a lawsuit against connectors specialist Molex, Inc. in the U.S. District Court for the Northern District of Illinois alleging a range of business torts and anti-competitive behavior.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.