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posted in November 2000
LSI Logic inks foundry, marketing alliance with Mobility Electronics
News & Analysis  
11/30/2000   Post a comment
MILPITAS, Calif. -- LSI Logic Corp. here today announced a major foundry and marketing alliance with Mobility Electronics Inc., a Scottsdale, Ariz.-based supplier of chips for high-speed connectivity and docking applications for PCs. Under the terms, LSI Logic will license Mobility Electronics' Split Bridge chip technology, which provides high-speed connectivity between PCs and other products. In addition, LSI Logic will manufacture, market and sell the Split Bridge chips to its customers. The
'Positive' outlook for Radstone
News & Analysis  
11/30/2000   Post a comment
Beeson Gregory, the investment bank, has put out a buy note on Radstone Technology, saying its stock could climb by 50% on the back of comparisons with competitors and strong market potential.
Design Choices for Teledatacom Systems
Design How-To  
11/9/2000   Post a comment
With integration, consolidation, and networking of information (voice, video, and data) gaining momentum, engineers face new complexities and uncertainties. Artesyn Technologies' Jeff Durst will help you learn to deal with the new technology by defining and explaining the various types of nodes for the teledatacom infrastructure—as well as the protocols that will get data from node to node.


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Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
2 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Max Maxfield

Awesome 3D Electronic Sculptures
Max Maxfield
13 comments
I recently received an email from someone we'll call Martin (because that's his name). Martin's message was short and sweet. In its entirety it read: "You need to see this!"

Rajaram Regupathy, Cypress Semiconductor

Add USB Battery Charging Protocols to an Android-Based Design
Rajaram Regupathy, Cypress Semiconductor
Post a comment
Editorial Note: Excerpted from Unboxing Android: A hands on approach with real world examples, by Rajaram Regupathy, the author takes you through the process incorporating effective power ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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