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posted in November 2000
LSI Logic inks foundry, marketing alliance with Mobility Electronics
News & Analysis  
11/30/2000   Post a comment
MILPITAS, Calif. -- LSI Logic Corp. here today announced a major foundry and marketing alliance with Mobility Electronics Inc., a Scottsdale, Ariz.-based supplier of chips for high-speed connectivity and docking applications for PCs. Under the terms, LSI Logic will license Mobility Electronics' Split Bridge chip technology, which provides high-speed connectivity between PCs and other products. In addition, LSI Logic will manufacture, market and sell the Split Bridge chips to its customers. The
'Positive' outlook for Radstone
News & Analysis  
11/30/2000   Post a comment
Beeson Gregory, the investment bank, has put out a buy note on Radstone Technology, saying its stock could climb by 50% on the back of comparisons with competitors and strong market potential.
Design Choices for Teledatacom Systems
Design How-To  
11/9/2000   Post a comment
With integration, consolidation, and networking of information (voice, video, and data) gaining momentum, engineers face new complexities and uncertainties. Artesyn Technologies' Jeff Durst will help you learn to deal with the new technology by defining and explaining the various types of nodes for the teledatacom infrastructure—as well as the protocols that will get data from node to node.


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