Smart grid hits snag over powerline standard News & Analysis 11/30/2009 7 comments The U.S. government is grappling with one of the first big snags in the wake of awarding $4 billion in grants to build a smart electric grid—how to find a standard that would let consumer appliances plug into an intelligent power network.
ARM, Aricent jump on Android bandwagon News & Analysis 11/17/2009 Post a comment In separate moves, ARM Ltd. has launched a new Web site and contract design company Aricent Inc. has announced a new development team both dedicated to helping engineers design systems with Google Android in further indications of the intense interest in Android and the challenges using it.
AMD, Asian packager license Irish micro-cooler News & Analysis 11/16/2009 Post a comment Researchers at the Stokes Institute in the University of Limerick have announced two licensing agreements that could see 'micro-cooler' technology used in computers and mobile phones; with AMD and Asian Vital Components.
AMD tops, Intel dominates Top500 list News & Analysis 11/16/2009 Post a comment Advanced Micro Devices powers the world's three largest supercomputers according to the lasted version of the Top500 list, but archrival Intel Corp. still dominates the list with processors now in 80 percent of the systems.
Eight innovations from Productronica News & Analysis 11/13/2009 Post a comment After four rather quiet days, the world's largest trade fair focusing on electronics production ended Friday (November 13) with a weak summary: The 28.000 visitors registered at the Productronica fairground in Munich were significantly less than the past event in pre-crisis year 2007. Nevertheless, there were some remarkable innovations to see at the exhibition.
AXIe standard brings scalability to instrumentation Product News 11/10/2009 Post a comment Aiming at higher performance per volume unit and better scalability for test and instrumentation applications, a group of equipment vendors has launched Advanced TCA Extensions for Instrumentation and Test (AXIe) as an open industry standard.
PCs for harsh logistics environments Design How-To 11/10/2009 Post a comment High demands are made on computers used in the transport and logistics sector due to the harsh environmental and operating conditions. In order to meet these challenges and to be able to react flexibly to changing customer requirements, DLoG uses congatec AG’s embedded computer modules for its current MPC 6 and IPC 7 product range.
Designer debuts OMAP boards for Android News & Analysis 11/5/2009 Post a comment Contract design company Moto Development Group (San Francisco) has announced a family of three reference platforms for the Google Android operating system aimed at giving OEMs a leg up on hardware engineering based on Moto's enhancements to the Texas Instruments Beagle board.
Startup turns SD cards into game cartridges News & Analysis 11/3/2009 Post a comment Startup FXI Technologies AS hopes to bring the Nintendo game cartridge into the cellphone era with a vengeance when it releases in early 2011 mobile games packaged with their own acceleration hardware on microSD cards.
3Leaf links 32 AMD chips in one server News & Analysis 11/3/2009 Post a comment Startup 3Leaf Systems has released an ASIC that can link 32 Opteron processors into a single server and is working on a version that could do the same for 64 Intel Nehalem processors.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.