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posted in November 2009
Smart grid hits snag over powerline standard
News & Analysis  
11/30/2009   7 comments
The U.S. government is grappling with one of the first big snags in the wake of awarding $4 billion in grants to build a smart electric grid—how to find a standard that would let consumer appliances plug into an intelligent power network.
The Chinese PCB market to decrease nearly 20 percent in 2009
News & Analysis  
11/23/2009   Post a comment
Frost & Sullivan forecasts that the Chinese market demands for PCB products reach RMB97.2 billion with the decrease of 18.2 percent in 2009, but the market is expected to rebound gradually in 2010.
Ten technologies, seven predictions lead weekly story ranking
11/20/2009   Post a comment
Here are the top five online stories for the week beginning Sunday, Nov. 15, as ranked by EE Times readers, up to and including Friday, Nov. 20. The ranking is based on the number of reader "views" or "hits" on a particular article.
Ten emerging technologies to watch in 2010
11/18/2009   6 comments
EE Times has compiled a list of emerging technologies that we think will be worth watching out for in 2010.
ARM, Aricent jump on Android bandwagon
News & Analysis  
11/17/2009   Post a comment
In separate moves, ARM Ltd. has launched a new Web site and contract design company Aricent Inc. has announced a new development team both dedicated to helping engineers design systems with Google Android in further indications of the intense interest in Android and the challenges using it.
NETWORKING - Small fanless network appliance boasts 6 network ports and 1.6GHz processor
News & Analysis  
11/16/2009   Post a comment
Lanner Electronics' FW-7530 is a small fanless network appliance with six network ports and 1.6GHz processor, touted as an economic solution for low-level network apps.
AMD, Asian packager license Irish micro-cooler
News & Analysis  
11/16/2009   Post a comment
Researchers at the Stokes Institute in the University of Limerick have announced two licensing agreements that could see 'micro-cooler' technology used in computers and mobile phones; with AMD and Asian Vital Components.
AMD tops, Intel dominates Top500 list
News & Analysis  
11/16/2009   Post a comment
Advanced Micro Devices powers the world's three largest supercomputers according to the lasted version of the Top500 list, but archrival Intel Corp. still dominates the list with processors now in 80 percent of the systems.
Eight innovations from Productronica
News & Analysis  
11/13/2009   Post a comment
After four rather quiet days, the world's largest trade fair focusing on electronics production ended Friday (November 13) with a weak summary: The 28.000 visitors registered at the Productronica fairground in Munich were significantly less than the past event in pre-crisis year 2007. Nevertheless, there were some remarkable innovations to see at the exhibition.
Join the conversation. NXP trading chip sales for royalties?
11/12/2009   1 comment
NXP BV continues to trade on its technology and the latest decision to license its Mifare technology to STMicroelectronics is as intriguing as any of the recent business moves that have gone before.
AXIe standard brings scalability to instrumentation
Product News  
11/10/2009   Post a comment
Aiming at higher performance per volume unit and better scalability for test and instrumentation applications, a group of equipment vendors has launched Advanced TCA Extensions for Instrumentation and Test (AXIe) as an open industry standard.
PCs for harsh logistics environments
Design How-To  
11/10/2009   Post a comment
High demands are made on computers used in the transport and logistics sector due to the harsh environmental and operating conditions. In order to meet these challenges and to be able to react flexibly to changing customer requirements, DLoG uses congatec AG’s embedded computer modules for its current MPC 6 and IPC 7 product range.
Creative Tech's survival hinges on China, ZiiLABS' SoC
News & Analysis  
11/9/2009   Post a comment
Creative Technology is betting its survival on two things: a new system-on-chip combined with its system module called Zii Platform; and a new business model targeting a growing number of no brand name Chinese OEMs.
Graphics processing: When DIY just doesn't make sense
Design How-To  
11/5/2009   Post a comment
High-end displays are gaining ground, and designers are urged to develop more advanced graphics processing. To lower the cost of ownership, ARM suggests licensing of an integrated GPU solution that includes software and hardware.
Designer debuts OMAP boards for Android
News & Analysis  
11/5/2009   Post a comment
Contract design company Moto Development Group (San Francisco) has announced a family of three reference platforms for the Google Android operating system aimed at giving OEMs a leg up on hardware engineering based on Moto's enhancements to the Texas Instruments Beagle board.
BOARDS - FPGA-based card provides high-speed I/O on AdvancedMC module
Product News  
11/3/2009   Post a comment
CommAgility's AMC-V5-10G targets high-end wireless and data processing applications with 10G Ethernet/CPRI interfaces
Startup turns SD cards into game cartridges
News & Analysis  
11/3/2009   Post a comment
Startup FXI Technologies AS hopes to bring the Nintendo game cartridge into the cellphone era with a vengeance when it releases in early 2011 mobile games packaged with their own acceleration hardware on microSD cards.
3Leaf links 32 AMD chips in one server
News & Analysis  
11/3/2009   Post a comment
Startup 3Leaf Systems has released an ASIC that can link 32 Opteron processors into a single server and is working on a version that could do the same for 64 Intel Nehalem processors. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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