Top 10 shifts in chips, comms News & Analysis 12/17/2012 4 comments It was a down year for semiconductors that saw shifting fortunes for many chip and comms companies as growth fled to the extremes of mobile and cloud.
Dublin Calling: Intel Labs drives Digital Europe Blog 12/17/2012 Post a comment Intel's network of research labs in Europe now embraces more than 4,000 R&D professionals and has more than quadrupled in size since its formation in January 2009. The question that remains is: where is the return on investment for Intel and the benefit for Europe?
Meeting Zuckerberg and Mr. EUV Blog 12/13/2012 3 comments I learned a little something in brief encounters this week with Facebook’s Mark Zuckerberg and the man I think of as Mr. EUV—two very unique men in black.
IBM details 3-D server chip stacks News & Analysis 12/12/2012 4 comments IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
Lessons Learned: Developing a production-quality USB stack Design How-To 12/5/2012 Post a comment In late 2008, MCCI started the development of a USB 3.0 host stack for Windows in order to support silicon vendors who were developing USB 3.0 xHCI host controllers. This was a large project, involving significant engineering effort over a period of four years. With the introduction of Windows 8, and the certification of our customers’ products for xHCI 1.0 compliance, the active development phase of the product is essentially complete, and we can look at the lessons learned over the active peri
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.