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posted in December 2012
DesignCon's 5 Toughest Tech Questions
News & Analysis  
12/28/2012   6 comments
FPGA or ASIC? What are the issues for 3-D interconnects? Enquiring tech minds want to know.
Intel claims latest tablet SoC beats Nvidia Tegra 3
News & Analysis  
12/20/2012   24 comments
Atom-based Clover Trail SoCs outperformed Nvidia’s Tegra 3 while using less power, Intel claimed in a briefing that covered a sub-10W Haswell Ultrabook.
Silicon Valley Nation: Processor speed kings crowned
Blog  
12/20/2012   Post a comment
Want to know who's got the fastest CPUs and GPUs? Ask gamers. (Hint: AMD and Intel.)
Propeller P8X32A project board speeds circuit building
Product News  
12/20/2012   Post a comment
The Propeller P8X32A project board from Parallax is designed for any project using the Propeller P8X32A multicore microcontroller.
Servers cool it with liquid refrigerant
News & Analysis  
12/20/2012   7 comments
Startup Clustered Systems lets data centers pack 200 KW of electronics into a rack using its sealed liquid cooling system.
Most popular Automotive DesignLine stories of 2012
Design How-To  
12/19/2012   3 comments
What stories struck readers' fancy in 2012? Plenty it appears.
Apple, Nvidia may stack graphics for Macs, iPads
Blog  
12/18/2012   7 comments
Rumor is Apple is working with Nvidia on some chip stacks that could power novel iMacs, Macbooks and even iPads starting late next year.
400-Gbit Ethernet effort kicks off in March
Blog  
12/18/2012   3 comments
I just made a request for an official Call For Interest on 400-Gigabit Ethernet at the IEEE 802 Plenary in March in Orlando, so come on down and make a vacation out of it.
Top 10 automotive electronics stories of 2012
Design How-To  
12/18/2012   5 comments
Volt teardown, new fuel-efficiency standards, Intel enters the game and battery maker woes top the industry's most notable stories in 2013.
PLX, Kontron drive PCIe backplane to 5.6 GB/s
News & Analysis  
12/17/2012   Post a comment
Kontron used switches from PLX Technology to drive a PCI Express 3.0 backplane at average rates of 5.6 GBytes/second.
Top 10 shifts in chips, comms
News & Analysis  
12/17/2012   4 comments
It was a down year for semiconductors that saw shifting fortunes for many chip and comms companies as growth fled to the extremes of mobile and cloud.
Dublin Calling: Intel Labs drives Digital Europe
Blog  
12/17/2012   Post a comment
Intel's network of research labs in Europe now embraces more than 4,000 R&D professionals and has more than quadrupled in size since its formation in January 2009. The question that remains is: where is the return on investment for Intel and the benefit for Europe?
Meeting Zuckerberg and Mr. EUV
Blog  
12/13/2012   3 comments
I learned a little something in brief encounters this week with Facebook’s Mark Zuckerberg and the man I think of as Mr. EUV—two very unique men in black.
Mil-Aero top 10 'How-To' articles for 2012
Design How-To  
12/12/2012   Post a comment
The year’s most popular contributed articles to Military & Aerospace Designline include design features on embedded vision, image sensors, FPGA testing and more.
IBM details 3-D server chip stacks
News & Analysis  
12/12/2012   4 comments
IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
IBM paves way for wearable electronics, folding displays
News & Analysis  
12/11/2012   6 comments
A cost effective way to manufacture thin, flexible electronics could revolutionize system design.
Safety, powertrain to lift automotive semiconductor sales
Design How-To  
12/11/2012   Post a comment
Faster processors and more affordable memories open up many doors and windows into automotive electronics.
Intel leapfrogs ARM (for now) with Atom server SoC
News & Analysis  
12/11/2012   20 comments
Intel is shipping Centerton, aka the S1200, claiming design wins for the server SoC aimed at fending off a growing crowd of ARM server SoCs.
3-D printers for medical use ahead says researcher
News & Analysis  
12/7/2012   Post a comment
3-D printers may someday produce more bio-friendly implants, valves, microneedles and other medical devices, said a researcher at the BioMeDevice conference.
Lessons Learned: Developing a production-quality USB stack
Design How-To  
12/5/2012   Post a comment
In late 2008, MCCI started the development of a USB 3.0 host stack for Windows in order to support silicon vendors who were developing USB 3.0 xHCI host controllers. This was a large project, involving significant engineering effort over a period of four years. With the introduction of Windows 8, and the certification of our customers’ products for xHCI 1.0 compliance, the active development phase of the product is essentially complete, and we can look at the lessons learned over the active peri
PMC’s Lang talks of comms, storage and mergers
News & Analysis  
12/5/2012   3 comments
PMC-Sierra CEO Greg Lang deflected reports that the chip company is under pressure to consider a sale.
Home patient monitoring slowly gets on its feet
News & Analysis  
12/4/2012   4 comments
Big growth is ahead for remote patient monitoring but regulatory, reimbursement and cultural challenges are still ahead, said a keynoter at BioMeDevices.
Caption contest: Santa Claus is coming to town!
Blog  
12/3/2012   3 comments
Have you been naughty or nice? We don't care, as long as you have a great caption for this month's contest!


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8 comments
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The Circle – The Future's Imperfect in the Present Tense
Betajet
5 comments
The Circle, a satirical, dystopian novel published in 2013 by San Francisco-based writer Dave Eggers, is about a large, very powerful technology company that combines aspects of Google, ...

Martin Rowe

Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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