Analyst weighs benefits of Nokia/Qualcomm link News & Analysis 2/27/2009 Post a comment Qualcomm is likely to see its position as the leading supplier of baseband chips for next generation mobile handsets enhanced following its recent deal with Nokia, but the jury is still very much out on just what market share gains it woud enjoy, according to market research group iSuppli.
Analyst: Trio dominated GaAs device market in '08 News & Analysis 2/26/2009 Post a comment The market for Gallium Arsenide devices grew by 9 percent in 2008, according to market research group Strategy Analytics, with early estimates showing that RFMD, Skyworks and TriQuint further consolidated their position in the sector.
HomePlug SoC set to debut at CeBIT News & Analysis 2/24/2009 Post a comment SPiDCOM Technologies, a fabless chip group focusing on ICs and Linux-based software bundles for broadband access and home networks, is set to unveil its next generation HomePlug AV SoC at CeBIT, in Hannover, which kicks off March 3rd.
Huge opportunties seen for 40/100 GigE devices News & Analysis 2/23/2009 Post a comment Market research group CIR, which focuses on optical components and optical communications, suggests the economic downturn will not delay early adopters of 40/100 GigE as companies such as Google and Amazon already have a "desperate need" for 100G connections.
Thermoharvester-driven wireless sensor node enables battery-free operation Product News 2/19/2009 Post a comment Micropelt GmbH claims to offer the world's first commercial availability thermo-powered wireless sensor system, the TE-Power NODE. The company's built-in chip thermogenerator takes a few degrees of temperature differential and harvests that thermal energy to operate the wireless sensor node, enabling unlimited battery-free operation.
Economic realities to impact LTE roll-out News & Analysis 2/18/2009 Post a comment Fourth generation networks and specifically LTE (Long Term Evolution) may be one of the major talking points here at the Mobile World Congress, but the messages are unclear about what their impact will be in the short term.
Qualcomm, Nokia start making up Product News 2/17/2009 Post a comment Both ST-Ericsson and Qualcomm Inc. have revealed partnership programmes with Nokia based round reference platforms that will use the Symbian Foundation's software.
TI unveils multi-core OMAP 4 Product News 2/16/2009 Post a comment Texas Instruments has expanded its popular OMAP mobile applications platform and processors, with the fourth generation set to be the first devices that use ARM's Cortex-A9 MPCores.
Startup aims Wi-Fi at embedded systems Product News 2/16/2009 Post a comment Startup ZeroG Wireless officially throws its hat into the ring of competitors trying to bring Wi-Fi to embedded systems with a new chip and module that could bring 802.11b connectivity to new lows in cost, size and power consumption.
Understanding regeneration Design How-To 2/10/2009 1 comment This article provides an overview of regeneration - what it is and how it occurs - and managing it in RoboteQ controllers.
Serdes about to get extreme makeover Product News 2/10/2009 2 comments Serdes, the serializer/deserializer chips at the heart of many high-speed designs for the past decade, are about to get an extreme makeover from analog to digital techniques for many designs over the next few years according to a panel of experts at the International Solid State Circuits Conference.
CSR buys SiRF to beef up GPS capabilities News & Analysis 2/10/2009 Post a comment Wireless chip group CSR (Cambridge, England) is buying GPS chip specialist SiRF (San Jose, Calif.) in a $136 million, all-share deal , which represents a 91 percent premium to SiRF's close on Feb. 9.
Broadcom combo IC targets GPS enabled mobiles Product News 2/9/2009 Post a comment The race to get ever tighter integrated RF functionalities on to a single chip has hotted up again with Broadcom Corp. extending its combo chip line-up with a device integrating its GPS location based IP, Bluetooth and FM radio.
DesignArt SoC extends mobile broadband backhaul News & Analysis 2/9/2009 Post a comment Wireless chip specialist DesignArt Networks Ltd. (Raanana, Israel), has tweaked its system-on-chip (SoC) "platform architecture" that integrates backhaul capability with WiMax, HSPA and LTE basestation functions so that it can also handle NLOS capability.
Three-core DSP targets LTE infrastructure Product News 2/9/2009 Post a comment Texas Instruments has started sampling to select wireless infrastructure designers a three-core DSP with associated software library for the development of basestation devices supporting all the algorithms for next generation Long Term Evolution (LTE) basestations.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.