Design Con 2015
Breaking News
Content tagged with Boards/Buses
posted in February 2009
Page 1 / 2   >   >>
Analyst weighs benefits of Nokia/Qualcomm link
News & Analysis  
2/27/2009   Post a comment
Qualcomm is likely to see its position as the leading supplier of baseband chips for next generation mobile handsets enhanced following its recent deal with Nokia, but the jury is still very much out on just what market share gains it woud enjoy, according to market research group iSuppli.
Analyst: Trio dominated GaAs device market in '08
News & Analysis  
2/26/2009   Post a comment
The market for Gallium Arsenide devices grew by 9 percent in 2008, according to market research group Strategy Analytics, with early estimates showing that RFMD, Skyworks and TriQuint further consolidated their position in the sector.
Congatec : Hard- and sofware kit introduces PLC automation
News & Analysis  
2/26/2009   Post a comment
Congatec presents the conga-ARkit, a complete solution package for the implementation of PLC functions.
ESL : Interface converter changes Ethernet to RS485, 422, 232
Product News  
2/26/2009   Post a comment
Electro Standards Laboratories announces the model 4163/4164 Ethernet-to-RS485/422/232 interface converter.
INTERFACES: PCI Express Digital I/O Interface is isolated
News & Analysis  
2/26/2009   Post a comment
SeaLevel Systems' DIO-32.PCIe adaptor has 16 optically isolated inputs & 16 Reed relay outputs (SPST) and is PCI Express X1 compliant.
Altera's Stratix III selected for largest ASIC prototyping engine
Product News  
2/25/2009   Post a comment
The Dini Group uses Altera's Stratix III in its single-board prototyping engine for custom ASICs that are devoted to wireless communications, networking, and graphics processing.
Module combines Virtex-5 and embedded PowerPC core for high-performance I/O signal processing
Product News  
2/25/2009   Post a comment
Acromag's PMC-VFX modules enable users to offload CPU-intensive operations such as video/3D data processing or floating-point math to improve system performance. See it at Acromag's booth at the Embedded Systems Conference.
BOARDS: Direct Digital Synthesis Board offers higher speed, powerful signal generation
Product News  
2/24/2009   Post a comment
dSPACE has added new APU slave interface, enlarged memory, and new DSPs
HomePlug SoC set to debut at CeBIT
News & Analysis  
2/24/2009   Post a comment
SPiDCOM Technologies, a fabless chip group focusing on ICs and Linux-based software bundles for broadband access and home networks, is set to unveil its next generation HomePlug AV SoC at CeBIT, in Hannover, which kicks off March 3rd.
Siano expands in China, touts lowest-cost MDTV chip
News & Analysis  
2/24/2009   Post a comment
Mobile TV chip specialist Siano Mobile Silicon (Kfar Neter, Israel) has opened offices in Shenzhen, the hub of China's design, development and manufacturing activities in consumer electronics.
Companies partner for NFC-enabled electronic wallet
News & Analysis  
2/24/2009   Post a comment
Atmel and French contactless card system developer TazTag (Rennes) are collaborating to develop a secure NFC module that can be used to protect personal data.
At ESC Silicon Valley, survival's in the bag
Product News  
2/23/2009   Post a comment
Books, scholarships, games, training, and more, all in a pretty cool Safari bag--yours if you register quickly for ESC Silicon Valley.
2009 EE Times ACE Awards finalists announced
Product News  
2/23/2009   Post a comment
See the companies, executives, teams, and others selected as ACE Award finalists.
Huge opportunties seen for 40/100 GigE devices
News & Analysis  
2/23/2009   Post a comment
Market research group CIR, which focuses on optical components and optical communications, suggests the economic downturn will not delay early adopters of 40/100 GigE as companies such as Google and Amazon already have a "desperate need" for 100G connections.
SP Devices : 12 bit digitizer handles 1.1 Gsamples per second
News & Analysis  
2/23/2009   Post a comment
SP Devices has announced its latest ADQ series digitizer. With a 1.1 Gsamples/s real-time sampling rate and 12 bits resolution, the unit claims the best-performing combination of high speed and high resolution on the market today.
802.11n client device forms core of WiFi sensor networking systems
Product News  
2/20/2009   Post a comment
Redpine Signals has developed an 802.11n wireless sensor module it is marketing under the brand name SenSiFi that it says provides all the control and wireless functionality required to build and deploy wireless sensor nodes in the industrial and enterprise sectors.
Protection algorithms provide a new way of fault mitigation
Design How-To  
2/19/2009   Post a comment
Smart switches, with protection "in silicon," improve reliability and safety while cutting harness cost.
Thermoharvester-driven wireless sensor node enables battery-free operation
Product News  
2/19/2009   Post a comment
Micropelt GmbH claims to offer the world's first commercial availability thermo-powered wireless sensor system, the TE-Power NODE. The company's built-in chip thermogenerator takes a few degrees of temperature differential and harvests that thermal energy to operate the wireless sensor node, enabling unlimited battery-free operation.
Teardown ESC: Open-source cell phone
Design How-To  
2/18/2009   3 comments
See what's inside Openmoko's open-source cell phone at the Embedded Systems Conference in San Jose.
Teardown ESC: Beat your child to a real 3D gaming experience
Product News  
2/18/2009   Post a comment
Check out the teardown of a 3rd SpaceVest from TN Games at ESC in Silicon Valley--your child will envy you.
Teardown ESC: Oregon Scientific's SmartGlobe Deluxe
Product News  
2/18/2009   Post a comment
The SmartGlobe is the first Internet-updatable model of the earth. Check out its innards at the Embedded Systems Conference in San Jose.
Economic realities to impact LTE roll-out
News & Analysis  
2/18/2009   Post a comment
Fourth generation networks and specifically LTE (Long Term Evolution) may be one of the major talking points here at the Mobile World Congress, but the messages are unclear about what their impact will be in the short term.
SOFTWARE TOOLS: LinuxLink now supports Freescale MPC8313E Processor
News & Analysis  
2/18/2009   Post a comment
Timesys Factory can base Linux platforms on Freescale-enabled 2.6.23 kernel or the 2.6.28 mainline kernel.
BOARDS: C160 SBC combines low power, rugged design, virtualization
Product News  
2/18/2009   Post a comment
Aitech's 160 is Core2 Duo-based and runs multiple applications simultaneously using Intel's Virtualization Technology
Understanding regeneration - Part 2: The motor as a generator
Design How-To  
2/17/2009   1 comment
This white paper on regeneration concludes with a look at the motor as a generator and offers example formulas for calculating the required size of a motor.
Qualcomm, Nokia start making up
Product News  
2/17/2009   Post a comment
Both ST-Ericsson and Qualcomm Inc. have revealed partnership programmes with Nokia based round reference platforms that will use the Symbian Foundation's software.
BOARDS: New communications PCIe boards feature direct FPGA connectivity
Product News  
2/17/2009   Post a comment
Pentek's 7700 family designed for routing flexibility for communications, software radio, radar, telemetry, and signal intelligence
BOARDS: Rugged JBOD system thrives in high altitude platforms
News & Analysis  
2/17/2009   Post a comment
Curtiss-Wright's 2.7 Terabyte VMETRO SANbric sealed cartridge deploys 6 high speed hard drives
TI unveils multi-core OMAP 4
Product News  
2/16/2009   Post a comment
Texas Instruments has expanded its popular OMAP mobile applications platform and processors, with the fourth generation set to be the first devices that use ARM's Cortex-A9 MPCores.
Startup aims Wi-Fi at embedded systems
Product News  
2/16/2009   Post a comment
Startup ZeroG Wireless officially throws its hat into the ring of competitors trying to bring Wi-Fi to embedded systems with a new chip and module that could bring 802.11b connectivity to new lows in cost, size and power consumption.
BOARDS: Rugged PMC card offloads CANbus, MilCAN, and Utility Bus host cards
News & Analysis  
2/13/2009   Post a comment
Curtiss-Wright's SPMC/DPMC-214 is designed to withstand harsh conditions in aerospace and defense systems
HARDWARE TOOLS: TTTech Evaluation Systems for TTEthernet include TTE-Tools
News & Analysis  
2/13/2009   Post a comment
TTEthernet is available in 100Mbit/s or 1 Gbit/s versions
NXP name dropped as ST-Ericsson powers ahead
News & Analysis  
2/12/2009   Post a comment
STMicroelectronics NV and Ericsson have named their 50:50 joint venture that combines the efforts of Ericsson Mobile Platforms with ST-NXP Wireless --- ST-Ericsson.
Want to connect at ESC? Use Facebook, LinkedIn, Twitter, and MyESC
Product News  
2/11/2009   2 comments
Embedded systems designers can exchange ideas via Internet-based social networking.
Infineon, Epson team for single-chip A-GPS design
Product News  
2/11/2009   Post a comment
Infinenon Technologies AG (Neubiberg, Germany) and Seiko Epson Corporation (Tokyo, Japan) have started sampling a single-chip A-GPS device targeted at cellular phones with navigation features.
Ceva targets DSP cores at 4G mobiles, infrastructure
Product News  
2/11/2009   Post a comment
DSP silicon intellectual property licensor Ceva Inc. has started sampling to select customers a multimode communications processor targeting 4G terminals and infrastructure it claims offers the industry's best performance to date.
BOARDS: Managed Layer-2 Gigabit Ethernet Switch supports up to 24 Gigabit Ethernet ports
News & Analysis  
2/10/2009   Post a comment
GE Fanuc: NETernity Front I/O routing provides alternative to RM980RC, RM982RC
Understanding regeneration
Design How-To  
2/10/2009   1 comment
This article provides an overview of regeneration - what it is and how it occurs - and managing it in RoboteQ controllers.
Serdes about to get extreme makeover
Product News  
2/10/2009   2 comments
Serdes, the serializer/deserializer chips at the heart of many high-speed designs for the past decade, are about to get an extreme makeover from analog to digital techniques for many designs over the next few years according to a panel of experts at the International Solid State Circuits Conference.
Dialog powers up PMIC flexibility for mobiles
Product News  
2/10/2009   Post a comment
Dialog Semiconductor has started sampling a multi-output power management IC targeted at mobile phones that is said to offer unprecedented levels of configurability.
CSR buys SiRF to beef up GPS capabilities
News & Analysis  
2/10/2009   Post a comment
Wireless chip group CSR (Cambridge, England) is buying GPS chip specialist SiRF (San Jose, Calif.) in a $136 million, all-share deal , which represents a 91 percent premium to SiRF's close on Feb. 9.
Connect with international press at ESC
Product News  
2/9/2009   Post a comment
Spread the news about your products around the world. ESC Silicon Valley has new opportunities to meet the international press.
Free sponsored sessions at ESC deliver real stuff
Product News  
2/9/2009   Post a comment
Vendors offer indepth info about Windows' Embedded, nonvolatile memory architectures, and more.
BOARDS: Mercury launches MicroTCA Carrier Hub & 12-slot chassis combo
News & Analysis  
2/9/2009   Post a comment
The new duo can be combined with AdvancedMC mezzanine cards to create high performance solutions in a small form factor
Broadcom combo IC targets GPS enabled mobiles
Product News  
2/9/2009   Post a comment
The race to get ever tighter integrated RF functionalities on to a single chip has hotted up again with Broadcom Corp. extending its combo chip line-up with a device integrating its GPS location based IP, Bluetooth and FM radio.
DesignArt SoC extends mobile broadband backhaul
News & Analysis  
2/9/2009   Post a comment
Wireless chip specialist DesignArt Networks Ltd. (Raanana, Israel), has tweaked its system-on-chip (SoC) "platform architecture" that integrates backhaul capability with WiMax, HSPA and LTE basestation functions so that it can also handle NLOS capability.
Antenova touts success in '08, senses difficult 09
News & Analysis  
2/9/2009   Post a comment
Mobile phone antenna specialist Antenova (Cambridge, England) has seen its turnover increase by 85 percent in 2008 and is gearing up for even better growth with tighter integrated devices due out during the year.
Three-core DSP targets LTE infrastructure
Product News  
2/9/2009   Post a comment
Texas Instruments has started sampling to select wireless infrastructure designers a three-core DSP with associated software library for the development of basestation devices supporting all the algorithms for next generation Long Term Evolution (LTE) basestations.
More about PCIExpress (or PCIe)
Product News  
2/7/2009   Post a comment
Here's a list of resources on Embedded.com and TechOnline about PCIExpress. These are the classes, VirtuaLabs, papers, and webinars available.
16-bit microcontroller extends battery life in portable equipment by 15 percent
Product News  
2/5/2009   Post a comment
Maxim Integrated Products has introduced the MAXQ610 16-bit microcontroller, which has been designed to extend battery life in low-power applications.
Page 1 / 2   >   >>


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Book Review: Deadly Odds by Allen Wyler
Max Maxfield
11 comments
Generally speaking, when it comes to settling down with a good book, I tend to gravitate towards science fiction and science fantasy. Having said this, I do spend a lot of time reading ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
1 Comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
14 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).