Breaking News
Content tagged with Boards/Buses
posted in February 2012
Connect One unveils miniature high-speed WiFi module
Product News  
2/29/2012   Post a comment
Connect One's Nano WiReach USB is a miniature WiFi module that brings wireless connectivity to consumer devices not originally intended to support wireless functionality.
Eurotech's DynaCOR 10-00 rugged industrial computer for M2M apps features modular fanless design, IP65 certification
Product News  
2/29/2012   Post a comment
The EN50155-rated DynaCOR 10-00 from Eurotech is a new family of rugged mobile computer that targets demanding machine-to-machine (M2M) applications.
Serial interfaces for high-speed A/D converters
Design How-To  
2/28/2012   Post a comment
There are tradeoffs between the serial interfaces which reduce the number of pins on the ADC and FPGA
OCZ rolls out 16 TB solid-state storage for cloud computing
Product News  
2/27/2012   Post a comment
The Z-Drive R4 CloudServ transfers multiple gigabytes per second and delivers more than 1 million IOPS.
LED drivers provide control, circuit-protection design options
Design How-To  
2/27/2012   1 comment
While the basic operating requirement for an LED driver is to supply a constant current for consistent lighting, automotive uses have stringent guidelines regarding temperature and humidity, voltage, ability to withstand harsh chemicals, electromagnetic interference and compatibility, as well as circuit protection.
RTX launches world’s smallest fully embedded Wi-Fi Module
Product News  
2/27/2012   4 comments
RTX has launched what the company claims is the world’s smallest fully embedded Wi-Fi module, the RTX4100.
World’s first quad core Mini-ITX board
Product News  
2/27/2012   Post a comment
The EPIA-M900 and EPIA-M910 boards use the 1.2GHz VIA QuadCore E-Series processor for enhanced multi-tasking and multimedia performance on the lowest quad core power budget for next generation embedded products.
Compact second-generation NanoServer for embedded media applications
Product News  
2/27/2012   Post a comment
DSM Computer is launching the first member of its second-generation NanoServer industrial computer with Intel Core processors and the energy-saving QM67 mobile chip set.
Ericsson plays standards cards to LTE win
Blog  
2/25/2012   3 comments
Ericsson played the standards game for a winning hand in LTE, according to ABI Research, but they are neither first nor last to play that game.
Leverage commercial off-the-shelf tools to create verifiable hardware and software solutions
Design How-To  
2/24/2012   Post a comment
FPGAs can help designers reduce their time to market while providing flexibility and verifiable designs.
ISSCC: Pictures from a silicon exhibition
News & Analysis  
2/23/2012   7 comments
Here’s a few postcards from the International Solid-State Circuit Conference, the annual smorgasbord of innovations in silicon across everything from processors to implants.
Smart roles high endurance MLC drive
News & Analysis  
2/22/2012   1 comment
Smart Storage officially debuted as a company focused on solid-state drives for business systems, rolling out the Optimus Ultra, a high-end serial-attached SCSI drive.
ISSCC: Path to optical links still dark
News & Analysis  
2/21/2012   2 comments
Experts agree printed circuit boards and processors will eventually need optical interconnects, but just when and how the industry will get there is still unclear.
Why I don’t buy Eyal’s 40G story
Blog  
2/21/2012   4 comments
The chief executive of Mellanox is pushing server makers to adopt this year his 40 Gbit/s Ethernet controller, but I see him facing a steep hill and a big new competitor.
WIN Enterprises' new PC/104+ Module targets space-constrained apps
Product News  
2/19/2012   Post a comment
The MB-73240 from WIN Enterprises is a low-power PC/104+ module that offers a choice of the Intel AtomTMD525, D425, or N455 processors.
AMD Fusion-based congatec COMs support OpenCL
Product News  
2/19/2012   Post a comment
congatec Inc. has announced support for OpenCL (Open Computing Language) for its Computers-on-Modules (COMs) with AMD Fusion technology across module standards ETX, XTX, COM Express, and Qseven.
Industry considers counterfeit risk analysis tool
Blog  
2/17/2012   11 comments
Obsolescence, market shortages and price hikes are the key motivational factors for counterfeiters to target a part and make a quick buck, according to data compiled by electronic components database firm SiliconExpert Technologies.
Kontron announces deployable industrial temp-rated platform  for smart M2M applications
Product News  
2/14/2012   Post a comment
Kontron’s new ready-to-deploy Machine-to-Machine (M2M) hardware platform, the KontronKM2M806XT, is targeted for applications that must operate in extended temperatures and industrial environments.
ZigBee Smart Energy gateway optimized for large device deployments
Product News  
2/12/2012   Post a comment
The gateway connects ZigBee Smart Energy devices from a Home Area Network (HAN) to an energy service provider via broadband.
Why is DesignCon important for IC designers?
Social Mania  
2/8/2012   Post a comment
Not one, but two videos of your editor speaking at DesignCon or a variety of subjects including the impact that board design has on chip design…
Kontron supports OCTEON III multicore MIPS64 processors
Product News  
2/8/2012   Post a comment
Kontron has announced support for the new OCTEON III MIPS64 family of 1-48 core multicore processors from Cavium, Inc.
ST adds 32-bit MCU to 9-axis inertial sensor
Product News  
2/8/2012   4 comments
STMicroelectronics NV has added a 32-bit microcontroller to its iNemo inertial sensor to create a smart multi-sensor module. The module is sampling and is set for volume production in 2Q12.
Intel’s Romley poised to roil data center
News & Analysis  
2/7/2012   1 comment
Romley server boards coming from Intel in March will accelerate the growth of 10 Gbit Ethernet and attack AMD at the high-end, two of many data center shifts ahead.
Video: HP's Prith Banerjee discusses HP labs, ARM servers and optical interconnects
News & Analysis  
2/3/2012   1 comment
Director of HP Labs Prith Banerjee gave his DesignCon keynote on the future of optical interconnects in the industry, including photonic interconnects and light to communicate instantaneously.
Rick Merritt DesignCon wrap up; 3D stacking, optical interconnects
News & Analysis  
2/2/2012   Post a comment
EE Times editor Rick Merritt wraps up some of the key trends at DesignCon 2012, including the shifts in design flow from copper to optical interconnects and the cost dynamic challenges involved in the switch.
HP rolls OpenFlow code for its switches
News & Analysis  
2/2/2012   1 comment
Hewlett-Packard has released OpenFlow software for 16 of its network switches with plans to extend that support this year to all its switches.
Signal Integrity Reference Kit
Blog  
2/2/2012   Post a comment
The folks over at Tektronix have created a reference kits about signal integrity containing a primer and webinar…
Panel probes T&M’s tech chiefs
News & Analysis  
2/2/2012   Post a comment
A DesignCon panel probed the leaders of the major test and measurement companies on a broad range of issues.
HP R&D chief shows road to terabyte backplane
News & Analysis  
2/1/2012   2 comments
Prith Banerjee, director of HP Labs, described in a DesignCon keynote the path to a terabyte/second backplane as one step toward tomorrow’s computer architectures.
Sophisticated thermal management solutions cool hi-rel systems - Part 1
Design How-To  
2/1/2012   1 comment
Complex and demanding military applications elevate thermal issues for designers.
CEA-Leti opens 3-D IC packaging service
News & Analysis  
2/1/2012   Post a comment
French research institute CEA-Leti has announced the launch of a 3-D packaging platform and service that provides industrial and academic partners with what it describes as a "mature" process for the production of 3-D interconnected products and projects.
Wanted: 3-D IC standards within six months
News & Analysis  
2/1/2012   13 comments
Standards for 3-D chip stacks need to be in place within six months to stay ahead of chips rolling out in 2013, said a Qualcomm executive driving some of the efforts.


Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
3 comments
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
19 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
39 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
144 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)