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posted in March 2007
Smart junction blocks ease the automotive wiring squeeze: Part 2 - Enablers and advantages
Design How-To  
3/30/2007   Post a comment
Clever connector design and intelligent MOSFETs, with a proper PCB layout and thermal design, come together for a smart, fuse-and-relay-free junction block.
REVIEW: 300-mV input-voltage boost converter throttles micro-fuel cells
Product News  
3/29/2007   Post a comment
Chip maker Texas Instruments is debuting an ultra-low-input DC-to-DC boost converter IC that promises to let portables operate from new energy sources such as micro-fuel cells. TI's power circuit can let you build converters that operate with input voltages lower than 300-mV. eeProductCenter Senior Technical Editor Alex Mendelsohn reports.
Acer fires back at HP over patent dispute
News & Analysis  
3/29/2007   Post a comment
With sales booming, especially in the US, Acer Inc. finds itself the target of a patent infringement lawsuit from rival Hewlett-Packard. It isn't backing down.
Ethernet upgrades to be sole data center net
News & Analysis  
3/29/2007   Post a comment
Broadcom, IBM, Intel and others are in an early development stage with Converged Enhanced Ethernet (CEE), an interconnect that in addition to improved data networking could take on jobs handled by Fibre Channel and Infiniband, creating a single technology to link all systems in the data center.
Smart junction blocks ease the automotive wiring squeeze: Part 1 - The electronic distribution system problem and the MOSFET/IP solution
Design How-To  
3/28/2007   Post a comment
Applying technology and IP, junction block developers target both functionality and cost for a reliable design without any fuses or relays.
Parker acquires French EMI shields maker
News & Analysis  
3/28/2007   Post a comment
Parker Hannifin Corp., which owns Chomerics in Europe, has bought, for an undisclosed sum, French electromagnetic interference shielding and thermal management device specialist Acofab SAS and its majority shareholder Adecem SARL.
Keynote: How multicore will reshape computing
News & Analysis  
3/28/2007   Post a comment
Anant Agarwal, MIT professor and keynote speaker at the Multicore Expo, described how multicore architectures will force developers to rethink resource size selection, methods of connecting cores, and programming models.
Vero buys enclosure product line from APW administrator
News & Analysis  
3/27/2007   Post a comment
Vero Technologies has acquired all the molded enclosure and card guide standard product lines from APW UK Ltd, the Southampton based company that went into administration in January.
REVIEW: Reference design slated to ease diffused IR stereo audio
Product News  
3/27/2007   Post a comment
Designing a consumer audio system? Then check out this upcoming reference design for non-line-of-sight, high bit-rate infrared communications coupled with all-digital audio processing and hefty audio amplification. eeProductCenter's Senior Tech Editor Alex Mendelsohn offers his view.
Stepper motor control card offers four pulse output channels
Product News  
3/23/2007   Post a comment
Check out ADLINK's PCI-8144 4-axis stepper motor control card. Designed with four input channels, the PCI-8144 delivers high-frequency pulse rates of up to 2.4 MHz to support high-speed motors at higher resolutions with faster acceleration.
Virtex-II FPGA PMC modules feature conduction cooling
Product News  
3/20/2007   Post a comment
Acromag's latest PMC I/O modules combine the ruggedness of a conduction-cooled circuit board with customizable FPGA computing while maintaining a price point that is affordable for many mid-level applications.
Laird Group set to focus on electronics
News & Analysis  
3/20/2007   Post a comment
One of the U.K.'s oldest engineering groups, Laird Group, is set to focus on electronics technology following its decision to sell its security systems division to private equity group Lupus Capital for £242 million ($471 million).
Teardown that Prius!
Automotive DesignLine Blog  
3/19/2007   Post a comment
Check out this video to see what it's like to take apart a hybrid vehicle--in about one minute.
Single-slot CompactPCI interface card provides GPS and GSM capability
Product News  
3/16/2007   Post a comment
MEN Micro released a 3U, single-slot CompactPCI interface card equipped with a 12-channel parallel GPS receiver and a GSM device for communications in low-signal strength applications. The GPS and GSM devices are optically isolated from other functions for increased reliability.
Converter boards connect TFT-LCDs to graphics/video interfaces
Product News  
3/16/2007   Post a comment
The PRISMA II series of RGB/DVI/video converter boards with analog control from Apollo Display Technologies connect TFT-LCDs to standard graphics and/or video interfaces.
picoChip extends senior management team
News & Analysis  
3/16/2007   Post a comment
picoChip has appointment of Steve Laurenson to the newly-created post of VP Engineering, freeing up Doug Pulley, co-founder and CTO who has been acting as VP engineering, to focus on strategic developments.
SBC packs PC104 and PC104+ capabilities in half-size slot card
Product News  
3/15/2007   Post a comment
Lanner Electronics has introduced the IAC-H672 SBC equipped with a VIA Mark processor and PC104 and PC104+ expansion capabilities.
Major vendors push green standards
News & Analysis  
3/15/2007   Post a comment
A new standards body promoting energy efficiency in the IT industry is being supported by a veritable who's who of vendors.
REVIEW: Power management chip smoothly throttles USB, battery subsystems
Product News  
3/15/2007   Post a comment
IC maker Maxim Integrated Products rolls out a smart dual-input USB/AC-adapter charger chip for use in circuits powered by single-cell Li+ batteries. The IC's charger integrates all power switches required for charging and switching a load between a battery and external power, eliminating the need for external pass devices. Click to read eeProductCenter Senior Tech Editor Alex Mendelsohn's review of this less-than-$2 device.
Accurate Thermal Analysis of Chip/Package Systems
Design How-To  
3/15/2007   Post a comment
With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming critical for insuring system reliability. Low power design methodologies create their own thermal challenges, as they may generate "hot" and "cool" regions on the chip. Causes and soutions are explored.
Consumer and automotive electronics converge: Part 2 - A MOST implementation
Design How-To  
3/14/2007   Post a comment
To seamlessly move large amounts of audio, video, and control information to, from, and between electronic devices and automotive systems, a car needs to have a flexible and powerful communications backbone.
PC/104 boards provide 48 isolated digital inputs
Product News  
3/14/2007   Post a comment
ACCES I/O Products has expanded its PC/104 isolated digital I/O board family with the introduction of the 104-IDI-48 Series. These are 48-channel PC/104 utility boards with 48 optically-isolated digital inputs.
Avionics bus interfaces offer automatic label filtering
Product News  
3/13/2007   Post a comment
United Electronic Industries (UEI) released the DNA-429-5xx series of ARINC 429 avionics bus interfaces. The DNA-429-566 offers six transmit (Tx) six receive (Rx) channels, the DNA-429-512 provides twelve Rx channels while the DNA-429-548 has four Tx eight Rx.
AMC designed for content-aware networking applications requiring deep packet inspection
Product News  
3/13/2007   Post a comment
Raza Microelectronics, Inc. (RMI) released the MC4100 series of advanced mezzanine cards (AMC) suited for Gigabit line-rate, content-aware networking applications requiring deep packet inspection and manipulation.
Comms slowdown hurts Europe's ICT market
News & Analysis  
3/9/2007   Post a comment
The market for information technology and telecommunications (ICT) in the EU will increase in 2007 by 2.9 percent to Euros 668 billion, according to the latest report from the European Information Technology Observatory - EITO.
Surf integrates TI C642x DSPs for lower cost per channel
Product News  
3/8/2007   Post a comment
Surf Communications Solutions says it's realizing a 50 percent reduction in the price per channel by integrating TI's new C642x DSPs into its chips and AMC/PCIe boards for iPBX and enterprise telecom applications.
CPU module supports fanless operation
Product News  
3/7/2007   Post a comment
WIN Enterprises developed the MB-07303, a PC/104-Plus CPU module with AMD Geode LX800 processor at 500 MHz that measures 96 X 116-mm. The MB-07303 features CRT support, 18-bit or 24-bit TTL LCD and digital I/O functions that include 2 COMs, four USB 2.0 ports, one Ultra ATA-66 interface, CompactFlash.
Nokia calls on Cambridge University for nanotech R&D
News & Analysis  
3/7/2007   Post a comment
Mobile phone maker Nokia is investing what analysts suggest could be £40 milliion (about $75 million) in a joint venture with Cambridge University on projects that will focus on nanotechnology initially.
Broadband chip specialist raises $16 million
News & Analysis  
3/7/2007   Post a comment
Broadband wireless chip specialist Provigent, Inc. has secured $16 Million in a fourth round funding that sees Globespan Capital Partners joining as a new investor.
Antenova closes $10 million investment round
News & Analysis  
3/6/2007   Post a comment
Integrated antenna specialist Antenova Ltd has secured $10 million further funding for growth and expansion. Participating investors in the new investment include institutional firms Artemis, CLS, Invesco and Panmure Capital and existing shareholders Quester, Cambridge Gateway Fund and FNI Venture Capital.
USB module evaluates finished products
Product News  
3/6/2007   Post a comment
Based on its Vinculum VNC1L embedded USB host controller, Future Technology Devices International Ltd. (FTDI) released a USB prototyping module dubbed the VDIP2 that is designed to accelerate VNC1L designs, and integrate into low-volume finished products.
WiFi access point tailored for automotive apps
Product News  
3/5/2007   Post a comment
ACKSYS has expanded its offerings to the automotive wireless market with a WiFi-Bridge, Access-Point, Repeater (WDS) it is marketing under the brand-name WLg-ABOARD/N.
Server console switch delivers effortless device sharing
Product News  
3/5/2007   Post a comment
Hewlett-Packard has developed the HP 1x4 Server Console Switch, a four-port integrated keyboard, video monitor, and mouse (KVM) system for managing multiple USB and PS2 devices from a single console.
French startup tackles full-chip signal integrity
Product News  
3/5/2007   Post a comment
Startup Coupling Wave Solutions is aiming to address chip design signal integrity challenges with software that can analyze noise from multiple sources and across a complete chip.

Intel, Cisco back active RFID startup
News & Analysis  
3/5/2007   Post a comment
AeroScout Inc., a specialist developer of Wi-Fi-based active RFID solutions, has secured $21 million in a Series C round led by Menlo Ventures.
Private equity offers $1 billion for Aeroflex
News & Analysis  
3/5/2007   Post a comment
Component and test equipment maker Aeroflex Inc., is the latest to succumb to private equity, having accepted a $1 billion cash bid from General Atlantic LLC and Francisco Partners.
Commentary: We need DFM for PCBs
News & Analysis  
3/2/2007   Post a comment
To optimize a system's design, designers will need to study the cause and effect of each component. To date, however, no design-for-manufacturing (DFM) tools exist to handle this type of design problem.
6U VME SBC features more I/O options
Product News  
3/2/2007   Post a comment
GE Fanuc Embedded Systems has expanded its EmPower family with the introduction of the EP2A 6U VME single-board computer for military embedded computing applications.
2U network appliance supports dual Xeon CPUs, 10 GbE ports
Product News  
3/1/2007   Post a comment
The PL-01033 from WIN Enterprises offers OEMs a flexible 2U 19-inch rack-mount network security platform.
BenQ plans niche attack on cell phones
News & Analysis  
3/1/2007   Post a comment
After high hopes of being a handset giant, the tattered remains of BenQ-Siemens will be sold off on eBay. But the company is already planning a comeback, focusing on products that have worked in the past.


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Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
7 comments
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
20 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
41 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
151 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

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