REVIEW: 300-mV input-voltage boost converter throttles micro-fuel cells Product News 3/29/2007 Post a comment Chip maker Texas Instruments is debuting an ultra-low-input DC-to-DC boost converter IC that promises to let portables operate from new energy sources such as micro-fuel cells. TI's power circuit can let you build converters that operate with input voltages lower than 300-mV. eeProductCenter Senior Technical Editor Alex Mendelsohn reports.
Ethernet upgrades to be sole data center net News & Analysis 3/29/2007 Post a comment Broadcom, IBM, Intel and others are in an early development stage with Converged Enhanced Ethernet (CEE), an interconnect that in addition to improved data networking could take on jobs handled by Fibre Channel and Infiniband, creating a single technology to link all systems in the data center.
Parker acquires French EMI shields maker News & Analysis 3/28/2007 Post a comment Parker Hannifin Corp., which owns Chomerics in Europe, has bought, for an undisclosed sum, French electromagnetic interference shielding and thermal management device specialist Acofab SAS and its majority shareholder Adecem SARL.
Keynote: How multicore will reshape computing News & Analysis 3/28/2007 Post a comment Anant Agarwal, MIT professor and keynote speaker at the Multicore Expo, described how multicore architectures will force developers to rethink resource size selection, methods of connecting cores, and programming models.
Laird Group set to focus on electronics News & Analysis 3/20/2007 Post a comment One of the U.K.'s oldest engineering groups, Laird Group, is set to focus on electronics technology following its decision to sell its security systems division to private equity group Lupus Capital for £242 million ($471 million).
picoChip extends senior management team News & Analysis 3/16/2007 Post a comment picoChip has appointment of Steve Laurenson to the newly-created post of VP Engineering, freeing up Doug Pulley, co-founder and CTO who has been acting as VP engineering, to focus on strategic developments.
REVIEW: Power management chip smoothly throttles USB, battery subsystems Product News 3/15/2007 Post a comment IC maker Maxim Integrated Products rolls out a smart dual-input USB/AC-adapter charger chip for use in circuits powered by single-cell Li+ batteries. The IC's charger integrates all power switches required for charging and switching a load between a battery and external power, eliminating the need for external pass devices. Click to read eeProductCenter Senior Tech Editor Alex Mendelsohn's review of this less-than-$2 device.
Accurate Thermal Analysis of Chip/Package Systems Design How-To 3/15/2007 Post a comment With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming critical for insuring system reliability. Low power design methodologies create their own thermal challenges, as they may generate "hot" and "cool" regions on the chip. Causes and soutions are explored.
Avionics bus interfaces offer automatic label filtering Product News 3/13/2007 Post a comment United Electronic Industries (UEI) released the DNA-429-5xx series of ARINC 429 avionics bus interfaces. The DNA-429-566 offers six transmit (Tx) six receive (Rx) channels, the DNA-429-512 provides twelve Rx channels while the DNA-429-548 has four Tx eight Rx.
Comms slowdown hurts Europe's ICT market News & Analysis 3/9/2007 Post a comment The market for information technology and telecommunications (ICT) in the EU will increase in 2007 by 2.9 percent to Euros 668 billion, according to the latest report from the European Information Technology Observatory - EITO.
CPU module supports fanless operation Product News 3/7/2007 Post a comment WIN Enterprises developed the MB-07303, a PC/104-Plus CPU module with AMD Geode LX800 processor at 500 MHz that measures 96 X 116-mm. The MB-07303 features CRT support, 18-bit or 24-bit TTL LCD and digital I/O functions that include 2 COMs, four USB 2.0 ports, one Ultra ATA-66 interface, CompactFlash.
Antenova closes $10 million investment round News & Analysis 3/6/2007 Post a comment Integrated antenna specialist Antenova Ltd has secured $10 million further funding for growth and expansion. Participating investors in the new investment include institutional firms Artemis, CLS, Invesco and Panmure Capital and existing shareholders Quester, Cambridge Gateway Fund and FNI Venture Capital.
USB module evaluates finished products Product News 3/6/2007 Post a comment Based on its Vinculum VNC1L embedded USB host controller, Future Technology Devices International Ltd. (FTDI) released a USB prototyping module dubbed the VDIP2 that is designed to accelerate VNC1L designs, and integrate into low-volume finished products.
Commentary: We need DFM for PCBs News & Analysis 3/2/2007 Post a comment To optimize a system's design, designers will need to study the cause and effect of each component. To date, however, no design-for-manufacturing (DFM) tools exist to handle this type of design problem.
BenQ plans niche attack on cell phones News & Analysis 3/1/2007 Post a comment After high hopes of being a handset giant, the tattered remains of BenQ-Siemens will be sold off on eBay. But the company is already planning a comeback, focusing on products that have worked in the past.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.