Design tools spur fuel cell development year round Design How-To 5/31/2007 Post a comment Challenge X EXCLUSIVE: Developing a hydrogen fuel cell vehicle in three years is a daunting task. In a northern climate that only allows test driving on roads for eight months of the year, the task is nearly impossible--without the correct tools that is.
REVIEW: PMBus point-of-load DC-to-DC chip has 500-mV to 8-V output ranges Product News 5/30/2007 Post a comment Here's a nifty power conversion and power management IC for synchronous DC-to-DC converter designs. The chip is configured to regulate two independent outputs, or two phases in a single output mode, and supports two types of current-sense topologies. Output range spans 500-mV to 8-V. eeProductCenter Senior Tech Editor Alex Mendelsohn reports.
Neonode handset deploys fractal antenna Product News 5/30/2007 Post a comment Fractal antenna technology pioneer Fractus (Barcelona, Spain) has developed an antenna measuring just 40.8 x 10.74 x 7.45 mm that has enabled Swedish mobile phone maker Neonode to create an ultra-compact handset.
PCI group makes steady progress on Express specs News & Analysis 5/22/2007 Post a comment The PCI Express train is making slow, steady progress forward increasing data rates and expanding into new uses, based on briefings and demonstrations of PCI Express versions 2.0 and 3.0 at the annual PCI Special Interest Group's developer's conference.
European semis distribution sales get lift in Q1 News & Analysis 5/21/2007 Post a comment Sales by members of the Distributors’ and Manufacturers’ Association of Semiconductor Specialists (DMASS) increased by 4.8 percent to Euros 1.48 billion in the first quarter of the year compared with the same period in 2006. The sequential increase from the last quarter of 2006 was 14.5 percent.
Pericom jumps on 5 GHz Express train News & Analysis 5/21/2007 Post a comment Pericom Semiconductor Corp. is launching two switches it claims are the first devices supporting the second generation PCI Express specification that runs at data rates up to 5 GHz, as the PCI Special Interest Group convenes its annual meeting here.
REVIEW: PCI Express plug-ins endow Windows PCs with fast digital I/O Product News 5/18/2007 Post a comment PXI Express is making news at National Instruments. The company is rolling out a number of PXIe high-speed instruments, as well as an 18-slot chassis to house them. The modular instruments include a 100-MHz dual-channel digitizer and two 32-channel digital I/O modules. eeProductCenter Senior Tech Editor Alex Mendelsohn reports.
REVIEW: Power management chip throttles USB source Product News 5/15/2007 Post a comment USB battery charging gets easier, thanks to a new power management chip from IC maker Linear Technology. Its bus controlled LTC3555 multi-function power management device for li-ion/polymer battery applications, integrates a switching manager, battery charger, and multiple synchronous buck regulators, plus an always-on LDO, all in a QFN surface-mount package. eeProductCenter Senior Tech Editor Alex Mendelsohn checks it out.
E Ink displays upgraded imaging film technology Product News 5/9/2007 Post a comment Electronic paper display technology specialist E Ink Corporation has developed an imaging film that offers higher performance switching speed, peak switch speed and brightness than its existing electronic ink. Dubbed Vizplex, the film will also be available in a much wider variety of display sizes and formats.
Five BenQ executives indicted News & Analysis 5/9/2007 Post a comment Another blow reigns down on Taiwan's BenQ Corp. as prosecutors indict five top executives, including the chairman and president, for insider trading.
ESD plan: state of shock News & Analysis 5/8/2007 Post a comment A group of leading chip makers is pushing to reduce the specifications for electrostatic discharge in digital ICs. But some suggest such a move would be reckless, and could lead to catastrophic quality and reliability problems for semiconductors.
C-MAC designs own brand PA modules Product News 5/8/2007 Post a comment C-MAC MicroTechnology has developed a range of solid state microwave amplifier modules, the first to be marketed being Ku band amplifier and LNA modules. Both target the satellite communications, point-to-point, radiolocation and defence sectors.
Bandlet de-interlace and up-conversion for HDTV via "super-resolution" framework Design How-To 5/4/2007 Post a comment Up-converting and de-interlacing standard definition television into high-quality HD raises deep image processing, mathematical and real time processing problems. The Let It Wave approach, using FPGA technology, is based on a full exploration of the 3-D environment of a missing pixel to compute it, by interpolating one or more available pixels located close to a line going through the missing pixel with a particular spatio-temporal direction. This "super-resolution" framework includes the previo
REVIEW: Energy Star power supply reference design uses standard parts Product News 5/2/2007 Post a comment ON Semiconductor says it has an industry-first ATX reference design that meets Enery Star requirements for ATX power supplies used in desktop PCs. Enery Star is scheduled to take effect in July. eeProductCenter Senior Technical Editor Alex Mendelsohn reports on the reference design and ON Semi's latest silicon.
Control board features six GbE LAN ports Product News 5/1/2007 Post a comment WIN Enterprises has introduced a high performance control board for IDS/IPS, firewall, VPN gateway and Unified Threat Management (UTM) applications. The MB-06067 board uses an Intel Pentium M or Celeron M 400-MHz processor with an Intel 852GM express chipset and ICH4 I/O controller.
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.