RFaxis touts integrated, single die BiCMOS front ends Product News 5/29/2009 Post a comment Wireless chip startup RFaxis (Irvine, Calif.) has started sampling its first two devices, both offering a replacement for traditional RF front-end modules, combining all the functionality into a single-die, single-chip that use "breakthrough and disruptive" design methodologies.
How to design with capacitive digital isolators Design How-To 5/28/2009 Post a comment To ease the design of isolated systems, this article describes the basic functionality of a capacitive, digital isolator, explains its placement within the signal path, and provides important recommendations for a successful circuit board design.
AMS, Fraunhofer partner for encoder ICs News & Analysis 5/28/2009 Post a comment Analog IC specialist Austriamicrosystems and the Fraunhofer Institute for Integrated Circuits (IIS) have linked to develop a generation of magnetic motion sensing integrated circuits based on Fraunhofer’s patented HallinOne magnetic sensor technology.
Danish researchers target 4G test News & Analysis 5/27/2009 Post a comment The Danish National Advanced Technology Foundation has awarded Euros 6 million towards a project at Aalborg University in which the researchers there will work with Infineon Technologies and Agilent Technologies on topics such as high performance, easy test infrastructure and low power consumption.
Ceva, mimoOn partner for LTE baseband News & Analysis 5/26/2009 Post a comment DSP cores IP licensor Ceva Inc. has joined the growing list of companies to port mimoOn's mi!MobilePHY LTE software on to silicon targeting the emerging wireless broadband technology.
Rambus targets DDR4 DRAMs News & Analysis 5/26/2009 1 comment Rambus has announced a set of new and existing interconnect technologies it says will meet the needs of main memory in 2011 and beyond and hopes the industry adopts them as part of a pending DDR4 DRAM standard.
Rapid growth seen for mobile broadband modems Survey 5/25/2009 Post a comment The mobile broadband modem market in Europe, including USB modem devices, PC Cards, ExpressCards, and internal cellular modems for laptops and mini-laptops, reached around 10.5 million units last year, more than doubling from 4.3 million in 2007.
GE Fanuc introduces the ICS-1556B ADC module Product News 5/19/2009 Post a comment GE Fanuc Intelligent Platforms announced the ICS-1556B 4-channel 400MHz 14-bit ADC PMC Module. It is designed for communication applications such as software defined radio, signals intelligence (SIGINT), digital receivers, and tactical communications where the requirement is to convert analog data into digital information in as close to real-time as possible.
Innovision confirms NXP as Gem licensee News & Analysis 5/18/2009 Post a comment The deal signed by Innovision Research and Technology plc (Cirencester, England) with an un-named supplier of NFC chips turns out to be with NXP Semiconductors BV (Eindhoven, the Netherlands).
Origin says TDK's SSDs won't turn heads News & Analysis 5/18/2009 Post a comment Storage systems integration specialist Origin Storage (Basingstoke, England) says TDK's announcement that it plans to oust magnetic hard drives with its new range of solid state drives (SSDs) is doomed to failure and 'will not fly'.
UK to fund ultra fast broadband R&D projects News & Analysis 5/14/2009 Post a comment The UK government is investing £1 million to help companies and universities carry out initial research and feasibility studies into technologies that will be needed for the next generation of broadband beyond that currently available, so called Ultra Fast Broadband.
Verizon calls on Gemalto for LTE UICC card News & Analysis 5/14/2009 Post a comment French smart and security card specialist Gemalto has won a contract to develop and provide an over-the-air (OTA) platform and LTE Universal Integrated Circuit Card for Verizon Wireless, which is the first carrier in the U.S. to roll out a Long Term Evolution (LTE) mobile broadband network.
TI to demo SuperSpeed USB 3.0 transceiver chip News & Analysis 5/13/2009 Post a comment Texas Instruments is demonstrating a 5Gbit/s transceiver test chip at next week's USB Developers Conference in Tokyo, Japan that it says will speed the implementation of the emerging SuperSpeed USB 3.0. specification
Distributors' association sees end to declines Product News 5/13/2009 Post a comment The pace of decline of electronic components distribution in Europe slowed during the first quarter of the year but, according to the International Distribution of Electronics Association (IDEA), they still show every indication of bucking the historic annual billings trend of a strong Q1 followed by three declining quarters.
Are the gloves off for motor control? Design How-To 5/12/2009 Post a comment Developments in MCU performance are creating new opportunities for three-phase motor control solutions, which could lead to greater efficiency in everyday white goods. Which approach is best, hardware of software?
NXP sampling standards compliant NFC chip to tier 1 handset makers News & Analysis 5/11/2009 Post a comment NXP Semiconductors has started sampling to "all the major mobile handset manufacturers" an NFC chip that is fully compliant with the latest mandated specifications for the short range, low power networking standard, including the important Single Wire Protocol connection with the Subscriber Identity Module (SIM) card and Host Controller Interface.
German group buys Technitrol's MEMS microphones operation News & Analysis 5/11/2009 Post a comment German component manufacturer Epcos AG has bought, for an undisclosed sum said to be in the mid-single digit million Euros, the development activities and patents related to MEMS microphones of Technitrol, Inc. (Philadelphia, PA), opening up a new market for Epcos.
ST in licensing deal for FET's battery technology News & Analysis 5/7/2009 Post a comment STMicroelectronics and Front-Edge Technology, the Baldwin Park, California-based developer of rechargeable batteries, have signed a licensing deal under which Franco-Italian chip maker gains access to FET's NanoEnergy ultra-thin lithium battery technology.
Dune raises storm with a further $8.3 million News & Analysis 5/5/2009 Post a comment Switching fabric and networking device specialist Dune Networks (Sunnyvale, California and Yakum, Israel) has raised $8.3 million in additional Series B funding, bringing the round total to $20.3 million and the total amount raised to $53 million since the company was formed nine years ago.
Benchmark group says NXP has fastest Cortex-M3 MCUs News & Analysis 5/5/2009 Post a comment NXP Semiconductors' LPC1700 series microcontrollers, based on ARM's Cortex-M3 cores, have been ratified as the industry's highest performance Cortex-M3 based microcontroller by the Embedded Microprocessor Benchmark Consortium (EEMBC).
IEEE kicks off smart grid effort in June News & Analysis 5/4/2009 Post a comment The IEEE 2030 group will kick off an effort to define standards for a smart electric grid in a meeting hosted at Intel headquarters in Santa Clara, Calif. on June 3-5, gathering computer, communications and power engineers to draft a design guide tand collaborating with a parallel effort at NIST
Chip sales see slight rebound in March News & Analysis 5/1/2009 Post a comment Global sales of semiconductors were $14.7 billion in March, up 3.3 percent from February 2009, according to the Semiconductor Industry Association (SIA). Year-on-year sales came in at 29.9 percent down on the corresponding month of 2008.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.