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posted in May 2009
RFaxis touts integrated, single die BiCMOS front ends
Product News  
5/29/2009   Post a comment
Wireless chip startup RFaxis (Irvine, Calif.) has started sampling its first two devices, both offering a replacement for traditional RF front-end modules, combining all the functionality into a single-die, single-chip that use "breakthrough and disruptive" design methodologies.
Sundance offers WiMax development board
Product News  
5/29/2009   Post a comment
Sundance Multiprocessor Technology Ltd. (Chesham, England), a supplier of signal processing boards, has announced the release of a WiMax development system, called the SMT703.
How to design with capacitive digital isolators
Design How-To  
5/28/2009   Post a comment
To ease the design of isolated systems, this article describes the basic functionality of a capacitive, digital isolator, explains its placement within the signal path, and provides important recommendations for a successful circuit board design.
ST leads the consumer charge in MEMS accelerometers
News & Analysis  
5/28/2009   Post a comment
STMicroelectronics has become the leading supplier of MEMS-based accelerometers because of its focus on supplying designers of consumer electronics and wireless products, according to market research group iSuppli.
AMS, Fraunhofer partner for encoder ICs
News & Analysis  
5/28/2009   Post a comment
Analog IC specialist Austriamicrosystems and the Fraunhofer Institute for Integrated Circuits (IIS) have linked to develop a generation of magnetic motion sensing integrated circuits based on Fraunhofer’s patented HallinOne magnetic sensor technology.
Danish researchers target 4G test
News & Analysis  
5/27/2009   Post a comment
The Danish National Advanced Technology Foundation has awarded Euros 6 million towards a project at Aalborg University in which the researchers there will work with Infineon Technologies and Agilent Technologies on topics such as high performance, easy test infrastructure and low power consumption.
Nujira's DPD module said to simplify basestation design
Product News  
5/27/2009   Post a comment
Power amplifier specialist Nujira (Cambridge, England) claims the digital pre-distortion (DPD) version of its Coolteq-h power modulator will simplify the design of cellular basestations.
Micro-Robotics : Embedded controller features powerful ARM CPU
Product News  
5/27/2009   Post a comment
Micro-Robotics has introduced the VM2, an embedded controller that succeeds the VM1 which has been the company’s flagship product for the past five years.
Ceva, mimoOn partner for LTE baseband
News & Analysis  
5/26/2009   Post a comment
DSP cores IP licensor Ceva Inc. has joined the growing list of companies to port mimoOn's mi!MobilePHY LTE software on to silicon targeting the emerging wireless broadband technology.
Swedish processor startup replaces CEO
News & Analysis  
5/26/2009   Post a comment
Coresonic AB, the Swedish developer of programmable baseband processors targeting wireless and broadcast technologies, has appointed Johan Lodenius as its chief executive officer.
Rambus targets DDR4 DRAMs
News & Analysis  
5/26/2009   1 comment
Rambus has announced a set of new and existing interconnect technologies it says will meet the needs of main memory in 2011 and beyond and hopes the industry adopts them as part of a pending DDR4 DRAM standard.
Rapid growth seen for mobile broadband modems
Survey  
5/25/2009   Post a comment
The mobile broadband modem market in Europe, including USB modem devices, PC Cards, ExpressCards, and internal cellular modems for laptops and mini-laptops, reached around 10.5 million units last year, more than doubling from 4.3 million in 2007.
Wolfson targets integrated DAC/amp at mobile devices
Product News  
5/21/2009   Post a comment
Wolfson Microelectronics has started sampling a single chip mono DAC and speaker amplifier targeted at improving audio quality in a range of devices such as mobile phones, conference speakerphones, digital radios and PNDs.
Interoperable SuperSpeed USB devices, hosts demo'd
News & Analysis  
5/21/2009   Post a comment
A clutch of companies demonstrated interoperable prototype hosts and devices for the upcoming SuperSpeed USB at this week's USB Implementers Forum in Tokyo, Japan.
TED claims first FPGA eval platform with DDR3 SODIMM socket
Product News  
5/20/2009   Post a comment
Tokyo Electron Device announced the release of Virtex-5 DDR3/LV-DDR2 SDRAM evaluation platform featuring high-speed DDR3 SDRAM memory and new LV-DDR2 SDRAM from Elpida Memory.
Wintegra, 4M Wireless team for LTE interoperability
News & Analysis  
5/20/2009   Post a comment
LTE terminal protocol stack specialist 4M Wireless (Luton, England) is partnering with communications processors group Wintegra (Austin, TX) for interoperability testing.
Littelfuse to close German plant as part of global restucturing
News & Analysis  
5/20/2009   Post a comment
Litttelfuse Inc., the Chicago headquartered provider of circuit-protection products, is closing its manufacturing plant in Duensen, Germany, and shifting production to Mexico as part of a number of measures being taken to reduce costs.
Digital isolator IC relieves USB data lines of intimate physical-connection risks
Product News  
5/20/2009   Post a comment
Analog Devices ADuM4160 allows use of USB ports in harsh or safety-critical applications
GE Fanuc introduces the ICS-1556B ADC module
Product News  
5/19/2009   Post a comment
GE Fanuc Intelligent Platforms announced the ICS-1556B 4-channel 400MHz 14-bit ADC PMC Module. It is designed for communication applications such as software defined radio, signals intelligence (SIGINT), digital receivers, and tactical communications where the requirement is to convert analog data into digital information in as close to real-time as possible.
Ericsson urged to sell its stake in handsets JV
News & Analysis  
5/19/2009   Post a comment
Swedish communications equipment maker Ericsson should dispose of its 50 percent stake in its mobile handsets joint venture Sony-Ericsson (SEMC), according to equity research house S&P.
ADI claims power, BoM advances for transceivers
Product News  
5/19/2009   Post a comment
Analog Devices Inc. has started sampling RF transceivers to support 4G picocell and microcell basestations that it claims could reduce power consumption and bill of material costs by 50 percent.
Green PCB Manufacturing Announced
Product News  
5/18/2009   Post a comment
DMRPCB.COM introduces a new, green method for PCB manufacturing.
Innovision confirms NXP as Gem licensee
News & Analysis  
5/18/2009   Post a comment
The deal signed by Innovision Research and Technology plc (Cirencester, England) with an un-named supplier of NFC chips turns out to be with NXP Semiconductors BV (Eindhoven, the Netherlands).
Origin says TDK's SSDs won't turn heads
News & Analysis  
5/18/2009   Post a comment
Storage systems integration specialist Origin Storage (Basingstoke, England) says TDK's announcement that it plans to oust magnetic hard drives with its new range of solid state drives (SSDs) is doomed to failure and 'will not fly'.
NXP finds new head for Identification unit
News & Analysis  
5/18/2009   Post a comment
NXP Semiconductors has a new general manager for its identification business unit, with Rudy Stroh taking over with immediate effect from Christophe Duverne.
Swedish eye-tracking technology pioneer raises VC funds
News & Analysis  
5/15/2009   Post a comment
Tobii Technology AB, the Stockholm, Sweden based start-up developing technology allowing people to control computers using only their eyes, has raised Euros 16 million ($21.7m) in venture funding.
UK to fund ultra fast broadband R&D projects
News & Analysis  
5/14/2009   Post a comment
The UK government is investing £1 million to help companies and universities carry out initial research and feasibility studies into technologies that will be needed for the next generation of broadband beyond that currently available, so called Ultra Fast Broadband.
Verizon calls on Gemalto for LTE UICC card
News & Analysis  
5/14/2009   Post a comment
French smart and security card specialist Gemalto has won a contract to develop and provide an over-the-air (OTA) platform and LTE Universal Integrated Circuit Card for Verizon Wireless, which is the first carrier in the U.S. to roll out a Long Term Evolution (LTE) mobile broadband network.
TI to demo SuperSpeed USB 3.0 transceiver chip
News & Analysis  
5/13/2009   Post a comment
Texas Instruments is demonstrating a 5Gbit/s transceiver test chip at next week's USB Developers Conference in Tokyo, Japan that it says will speed the implementation of the emerging SuperSpeed USB 3.0. specification
Distributors' association sees end to declines
Product News  
5/13/2009   Post a comment
The pace of decline of electronic components distribution in Europe slowed during the first quarter of the year but, according to the International Distribution of Electronics Association (IDEA), they still show every indication of bucking the historic annual billings trend of a strong Q1 followed by three declining quarters.
Are the gloves off for motor control?
Design How-To  
5/12/2009   Post a comment
Developments in MCU performance are creating new opportunities for three-phase motor control solutions, which could lead to greater efficiency in everyday white goods. Which approach is best, hardware of software?
Diamond Point drives storage start-up in UK
News & Analysis  
5/12/2009   Post a comment
Diamond Point International (Rochester, England) has been appointed a specialist reseller and distributor for Fusion-io's innovative NAND flash based soild state drives, the ioDrive and ioDrive Duo.
Samsung starts shipping 30-nm NAND-based memory cards
News & Analysis  
5/12/2009   Post a comment
Samsung Electronics Co., Ltd., has started shipping 32-Gigabyte moviNAND, which the Korean group says is the highest density embedded memory card being made that uses chips made with a 30-nm process.
NXP sampling standards compliant NFC chip to tier 1 handset makers
News & Analysis  
5/11/2009   Post a comment
NXP Semiconductors has started sampling to "all the major mobile handset manufacturers" an NFC chip that is fully compliant with the latest mandated specifications for the short range, low power networking standard, including the important Single Wire Protocol connection with the Subscriber Identity Module (SIM) card and Host Controller Interface.
German group buys Technitrol's MEMS microphones operation
News & Analysis  
5/11/2009   Post a comment
German component manufacturer Epcos AG has bought, for an undisclosed sum said to be in the mid-single digit million Euros, the development activities and patents related to MEMS microphones of Technitrol, Inc. (Philadelphia, PA), opening up a new market for Epcos.
Hectronic : PC104 PC board is designed for harsh environments
Product News  
5/8/2009   Post a comment
Hectronic has announced the H6045, a low-power PC/104 computer board.
ST in licensing deal for FET's battery technology
News & Analysis  
5/7/2009   Post a comment
STMicroelectronics and Front-Edge Technology, the Baldwin Park, California-based developer of rechargeable batteries, have signed a licensing deal under which Franco-Italian chip maker gains access to FET's NanoEnergy ultra-thin lithium battery technology.
Dune raises storm with a further $8.3 million
News & Analysis  
5/5/2009   Post a comment
Switching fabric and networking device specialist Dune Networks (Sunnyvale, California and Yakum, Israel) has raised $8.3 million in additional Series B funding, bringing the round total to $20.3 million and the total amount raised to $53 million since the company was formed nine years ago.
Sales, profits slump at Alcatel-Lucent in Q1
News & Analysis  
5/5/2009   Post a comment
First quarter losses at communications equipment combine Alcatel-Lucent (Paris, France) more than doubled to Euros 402 million ($535 million) from the corresponding period last year.
Benchmark group says NXP has fastest Cortex-M3 MCUs
News & Analysis  
5/5/2009   Post a comment
NXP Semiconductors' LPC1700 series microcontrollers, based on ARM's Cortex-M3 cores, have been ratified as the industry's highest performance Cortex-M3 based microcontroller by the Embedded Microprocessor Benchmark Consortium (EEMBC).
NETWORKING: SMSC's newest 10/100 Ethernet PHYs consume 40% less power
Product News  
5/4/2009   Post a comment
The LAN8710 and LAN8720 10/100 Ethernet physical layer transceivers (PHYs) from SMSC are touted to be the industry's smallest and to consume 40 percent less power than existing SMSC transceivers.
Motorola's "Green Phone" renews and recycles
Design How-To  
5/4/2009   1 comment
With the W233 Renew, Motorola attempts to oblige with a carbon-neutral, mostly recyclable entry-level GSM offering.
IEEE kicks off smart grid effort in June
News & Analysis  
5/4/2009   Post a comment
The IEEE 2030 group will kick off an effort to define standards for a smart electric grid in a meeting hosted at Intel headquarters in Santa Clara, Calif. on June 3-5, gathering computer, communications and power engineers to draft a design guide tand collaborating with a parallel effort at NIST
Lab models swine flu's spread; diagnostic chips being readied
News & Analysis  
5/1/2009   1 comment
A Virginia Tech lab has been modeling the spread of swine flu as chip makers work to develop diagnostic tools to stop the H1N1 flu virus.
Chip sales see slight rebound in March
News & Analysis  
5/1/2009   Post a comment
Global sales of semiconductors were $14.7 billion in March, up 3.3 percent from February 2009, according to the Semiconductor Industry Association (SIA). Year-on-year sales came in at 29.9 percent down on the corresponding month of 2008.


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