Image gallery: Xperia Play handset teardown News & Analysis 5/26/2011 5 comments The first "PlayStation certified" smartphone features Qualcomm's Snapdragon, Broadcom's BlueTooth/WiFi/FM combo chip and memory ICs from Micron and Elpida, among others, according to a teardown analysis.
IMEC, Atrenta to show 3-D design flow at DAC Product News 5/24/2011 3 comments EDA company Atrenta Inc., working with the IMEC research institute on a 3-D integration project, has developed a planning and partitioning design flow for heterogeneous 3-D stacked IC assemblies. They plan to demo the flow at the DAC exhibition.
Payload efficiency: MOST and Ethernet square off Design How-To 5/16/2011 Post a comment This article discusses the payload efficiency of MOST and Ethernet and the derived influence on the network architecture of vehicles with high bandwidth needs. Furthermore, ideas for coexistence of these competing technologies are described.
Industrial grade Core i7/i5/i3 Mobile Micro ATX motherboard Product News 5/15/2011 Post a comment BVM Group has augmented its family of compact Micro ATX format motherboards with the introduction of the MS-C71, which combines scalable computing power for heavy processing tasks, a large array of I/O and expansion slots and integrated high definition graphics capability in a 244 x 244mm footprint.
Eurotech's CPU-1440 low power PC/104+ board includes ISA and DOS Support Product News 5/9/2011 Post a comment Eurotech has launched the CPU-1440, a new low power PC/104+ module based on the Vortex86DX processor. Consuming less than 4W of power and featuring fanless operation, the CPU-1440 provides x86 compatibility for legacy applications using DOS as well as for more current PC/104+ embedded applications using Linux and Windows CE.
Solar micro-inverter maker raises $41 million News & Analysis 5/3/2011 3 comments Solar photovoltaic micro-inverter manufacturer Enecsys Ltd. (Cambridge, UK) has secured £25 million ($41 million) in Series B equity financing to invest in its growth plan. This brings the amount invested in Enecsys to about $55 million.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.