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posted in June 2012
How to select power line polarity protection diodes
Design How-To  
6/30/2012   1 comment
Diode rectifiers are ideal solutions for automotive electronic power line protection and have several important parameters for these applications, including: Forward current, repetitive reverse voltage, forward surge current, and fusing rate.
Multi-network support is now available for ZigBee PRO networks
Product News  
6/30/2012   1 comment
Ember claims to be the world’s first ZigBee technology provider to support multiple interconnecting networks on a single system-on-chip (SoC) or network co-processor (NCP) for Connected Home applications.
Single Chip SATA II DOM SSD meets multiple rugged app requirements
Product News  
6/29/2012   Post a comment
RunCore has launched what it claims to be the world’s first single chip SATA II DOM SSD for advanced embedded SSD solutions, the RunCore Mini DOM.
DoD's dubious achievement awards
6/29/2012   20 comments
The Pentagon has announced its "value engineering" awards. The F-35 fighter program was not among the winners.
Bluetooth HCI module with antenna for automobiles
Product News  
6/27/2012   Post a comment
ALPS Electric Europe has developed the UGXZD–G Series Bluetooth HCI module with antenna for automobiles. Mass production is already underway. Principal applications are car navigation and audio systems.
Small cells still not ready for mobile prime time
News & Analysis  
6/22/2012   9 comments
Engineers still have significant work ahead to deliver small cell base stations to ease heavily loaded mobile data networks, according to talks at a recent mobile event.
TI brings HD to 3-D printing
News & Analysis  
6/19/2012   5 comments
Digital light processing can be used with ultraviolet light to cure the top surface of a liquid polymer used in 3-D printers, TI said.
Atom gets first ride in HP's CPU-agnostic server
News & Analysis  
6/19/2012   5 comments
An Intel dual-core Atom chip will be the first processor to populate a CPU-agnostic low power server Hewlett-Packard will ship before the end of the year.
Ford test drives Android in Silicon Valley lab
News & Analysis  
6/19/2012   4 comments
Ford researchers at a new Silicon Valley lab have created a version of Android that taps into dozens of car sensors in an effort to explore its own automotive OS.
Cray will use Intel MIC, branded Xeon Phi
News & Analysis  
6/18/2012   2 comments
Intel’s second run at graphics got some badly needed traction as supercomputer maker Cray said it will use Intel’s Knights Corner—now Xeon Phi--in its Cascades system.
SBC replaces multiple boards for high-end embedded apps
Product News  
6/16/2012   Post a comment
VersaLogic Corp., in collaboration with Intel’s elite Early Access program, has announced Copperhead, a new benchmark for embedded single board computer (SBC) performance.
1U network appliance has Intel Cedarview D2550/N2600 Processors
Product News  
6/13/2012   Post a comment
The PL-80700 from WIN Enterprises, Inc., is a 1U rackmount hardware platform designed for network service applications.
3G router connects, generates WLAN inside cars
Product News  
6/10/2012   Post a comment
Increasingly, mobile terminals such as smartphones, netbooks and the like are used in cars. The new 3G router for in-car deployment from Funkwerk Dabendorf improves the internet experience for passengers and driver.
TurtleCore expansion board simplifies mobile robotic dev
Product News  
6/8/2012   Post a comment
The TurtleCore from Gumstix, Inc., is a new low-cost expansion board that enables robotics enthusiasts to build robots easily and cost-effectively using the iRobot Create Platform.
Mobile data flood spurs network innovations
News & Analysis  
6/6/2012   1 comment
Cellular enterprise networks, Cloud RAN, carrier Wi-Fi based on 802.11ac and other innovations are shaking up otherwise slow moving wireless carrier networks.
UMC, IME team on TSV process for image sensors
News & Analysis  
6/5/2012   1 comment
The Institute of Microelectronics in Singapore and Taiwanese foundry UMC have agreed to develop jointly a through-silicon-via process for backside illuminated CMOS image sensors.
GE SBCs feature dual core 3rd Gen Intel core processors
Product News  
6/4/2012   Post a comment
GE Intelligent Platforms has announced that dual core versions of its rugged single board computers (SBCs) based on quad core 3rd Generation Intel Core processors are available.
Gigabit serial links: Gateways to multicore scalability
Design How-To  
6/4/2012   Post a comment
Built on top of the serdes for data-intensive apps, gigabit serial interfaces cut system cost and pin count while upping parallelism, performance and capacity.
Dev kit for Zynq-7000 EPP speeds development
Product News  
6/4/2012   Post a comment
The ZedBoard kit includes the ZedBoard, power supply, USB cable, and pre-configured SD card containing a bootable Linux reference design.
Etron preps DRAMs using through silicon vias
News & Analysis  
6/1/2012   2 comments
Taiwan’s Etron Technoogy has started work on buffered DRAMs using through-hole vias for 3-D ICs and is working on an upgrade of its gesture recognition module.

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Max Maxfield

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