Silicon Valley, Wall Street meet at interconnect event News & Analysis 7/30/2009 Post a comment The Hot Interconnects conference will move from its longstanding home on the Stanford campus to Lower Manhattan next month as organizers try to bring together Silicon Valley technologists and bleeding edge systems users on Wall Street, in part to debate the competition between 10 Gbit Ethernet and Infiniband.
When good grounds turn bad--isolate! Design How-To 7/17/2009 Post a comment
To make designers aware of these design pitfalls, this article explains where ground potential differences originate in the electrical installation, how ground loops are created unintentionally, and how isolation circumvents both conditions to yield a robust data-transmission system.
Big falls and rises seen for graphics chips News & Analysis 7/16/2009 Post a comment The graphics chip market is predicted to suffer its worst ever year-on-year shipments performance this year, to be followed by an amazing comeback in 2010, according to market tracker Jon Peddie Research (Tiburon, Calif.).
Printed silicon pioneer raises another $20 million News & Analysis 7/15/2009 Post a comment Kovio Inc. (Milpitas, Calif.), the startup developing manufacturing technology that combines the low cost of graphics printing with the functionality of silicon-based semiconductor integrated circuits, has raised $20 million in Series E funding.
Personal rapid transit ready to roll at terminal 5 Design How-To 7/14/2009 Post a comment Unmanned electric Personal Rapid Transit (PRT) vehicles are to be introduced towards the end of this year at to Heathrow Airport to ease the transfer of passengers between two remote stations at the terminal 5 (T5) business car parking and the T5 building.
Renesas touts faster SiP design process Product News 7/13/2009 Post a comment Renesas has started using new tools that the company says can halve system-in-package (SiP) design time since they rely on a top-down (predictive) design approach in which key characteristics, such as design quality and heat dispersion, are verified during the initial design stage.
PROGRAMMING TOOLS - Corelis unveils stand-alone in-system programming solutions News & Analysis 7/10/2009 Post a comment Corelis, Inc., has launched two new product bundles for stand-alone in-system programming environments, the ISP-TAFP and ISP-JTAG. The ISP-TAFP (Target Assisted Flash Programmer) is capable of performing CPU-assisted programming by taking control of a processor's JTAG port. ISP-JTAG allows programming of Flash and SEEPROM devices that interface directly with IEEE-1149.1 compliant devices.
Huge take-up seen for accelerometers in cellphones News & Analysis 7/10/2009 Post a comment Good news for suppliers of MEMS based accelerometers such as STMicroelectronics, Kionix Inc., Freescale and ADI. A report from market trackers iSuppli predicts that by next year, one out of three mobile phones shipped worldwide will include one, up from one out of five in 2009, and one out of 11 in 2008.
EMS costs, margins stabilize despite weak sales News & Analysis 7/9/2009 Post a comment EMS companies are keeping pricing and labor costs as well as profit margins unchanged despite continued weakness in demand for their services. A research and consulting firm believes the situation will remain unchanged through the third quarter with minor variations across certain global markets.
Groups partner on LTE reference design Product News 7/9/2009 Post a comment Lime Microsystems (Guildford, England) and Blue Wonder Communications (Dresden, Germany) are partnering on the development of an LTE reference design using Lime's single chip LTE transceiver alongside the German group's baseband.
Infineon sells wireline group for $350 million News & Analysis 7/7/2009 Post a comment Struggling German chip group Infineon Technologies AG is selling its wireline communications operation to an affiliate of U.S. based private equity firm Golden Gate Capital for 250 million euro (about $250 million).
MediaTek the latest to take to ARM Mali News & Analysis 7/7/2009 Post a comment MediaTek, the fast-growing Taiwanese group developing SoCs for wireless communications devices, has become the latest to take a license on ARM's Mali-400 MP multicore graphics processing unit (GPU) for its system-on-chips.
Skyworks said to have pipped RFMD in cellphone PA stakes News & Analysis 7/7/2009 Post a comment The two leading suppliers of power amplifiers for the mobile communications sector, Skyworks and RFMD, ended last year with close to one-third of the market, but Skyworks has for the first time edged slightly ahead of RFMD, according to market trackers Strategy Analytics.
Oki buys Renesas plant to increase LED capacity News & Analysis 7/6/2009 Post a comment OKI Data Corporation is to buy substantially all the assets of Renesas Technology Corp's former semiconductor front-end process line in Takasaki, Gunma Prefecture, Japan , in effect increasing by a factor of four its capacity to make LEDs.
Startup touts major advance in wireless sensor's temp sensitivity News & Analysis 7/6/2009 Post a comment A start-up based in Cambridge, England, focusing on healthcare technologies, has started user trials of a wireless temperature sensor that can measure body temperature to within a thousandth of a degree. Cambridge Temperature Concepts (CTC) has already used the sensor to create a device to assist women in getting pregnant.
Via Licensing signals progress with NFC patent pool News & Analysis 7/1/2009 Post a comment The formation of a patent pool for technologies related to near field communications (NFC) is gathering steam with one of the major players in the field, Via Licensing Corporation, signing up Motorola Inc. for its joint licensing program.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.