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posted in August 2011
WIN Enterprises introduces fanless box computer with VIA Nano/Eden CPU
Product News  
8/30/2011   Post a comment
The PL-80320 from WIN Enterprises, Inc. is a fanless box computer for embedded applications powered by VIA Nano/Eden processors.
Flirting with disaster
8/30/2011   5 comments
Your company may have a disaster-preparedness plan, but do your vendors?
UK photovoltaic firm attracts Fister as CEO
News & Analysis  
8/30/2011   5 comments
Mike Fister, a former manager of processor development at Intel and CEO at EDA software vendor Cadence, has been appointed CEO of privately-held Enecsys Ltd. (Cambridge, England).
Axiomtek launches 2-slot fanless industrial barebones system sporting Intel Atom D425 and D525
Product News  
8/29/2011   Post a comment
The IPC922-212-FL from Axiomtek is a new 2-slot fanless industrial barebones system based on the Intel Atom processor D425/ D525, boosting server performance with faster processing speeds.
Fibre Channel over Ethernet, GPON rising
News & Analysis  
8/29/2011   5 comments
Fibre Channel over Ethernet is driving sales and market share shifts for 10 Gbit Ethernet, while China drives sales in GPONs, according to two Dell 'Oro Group reports.
PCB industry challenges that affect profitability and competitive leadership
8/29/2011   1 comment
The PC board is no longer simply a repository for circuitry, but the opportunity for electronics companies to add its unique value and produce a more competitive product.
Axiomtek's new interactive digital signage has high performance per watt, improved graphics
Product News  
8/27/2011   Post a comment
Axiomtek has released the OFP240-D510, a 24-inch full HD multimedia interactive digital signage panel that offers full high-definition video playback and cutting-edge graphics performance.
DDC's ruggedized PMC card provides 16 channels of avionic I/O
Product News  
8/25/2011   Post a comment
BU-65596/7F/M boasts DO-254 compliance and four dual-redundant MIL-STD-1553 channels.
Parallel IGBTs push power with fewer thermal problems
Design How-To  
8/25/2011   Post a comment
Paralleling IGBTs and diodes within one power module provides higher currents. Such use of several small chips allows better heat dissipation.
Heat Removal with Microchannel Heat Sinks
Design How-To  
8/24/2011   1 comment
Liquid-cooled microchannel heat sinks and coolers can be an effective way to remove high heat load from both chips and boards.
IDC: Server demand to slow after strong Q2
News & Analysis  
8/24/2011   2 comments
Demand for servers remained high in the second quarter, but weakening macroeconomic conditions throughout the world are likely to take a toll on server demand later this year, according to market research firm IDC.
Supercomputer, data center nets diverging
News & Analysis  
8/22/2011   3 comments
Networks used inside supercomputers and data centers are diverging, according to papers at this week's Hot Interconnects event.
Panel PC targets self service environment
Product News  
8/21/2011   Post a comment
The panel PC features gigabit Ethernet, 801.11 b/g/n wireless and Bluetooth connectivity as standard, has built-in webcam and microphone and features a choice of either single touch resistive or multi-touch capacitive touchscreens.
Bits from Hot Chips: Robots, Cisco, Oracle
News & Analysis  
8/19/2011   9 comments
Researchers demonstrated personal robots, Oracle discussed its latest server processor and Cisco described an Ethernet chip on the last day of Hot Chips.
Implementing advanced control strategies for DC/DC converters using MCUs (Part 1 of 2)
Design How-To  
8/19/2011   1 comment
Sub: Understand how a microcontroller can provide superior performance for phase-shifted, full-bridge DC/DC converters
Coexistence of wireless medical devices
Design How-To  
8/19/2011   Post a comment
Tests to assess the risks associated with coexistence of wireless technologies are necessary for safe and effective RF wireless medical devices.
Viewpoint: Why I don't think Leo can save HP
News & Analysis  
8/18/2011   17 comments
I understand Leo Apotheker's vision for Hewlett-Packard, but I don't believe he can execute on it given HP's broad and deep woes and the CEO's clumsy methods.
Dead reckoning fills-in GPS navigation gap
Design How-To  
8/18/2011   9 comments
Dead reckoning aids traditional GPS navigation via intelligent algorithms based on a vehicle’s distance and directional changes during GPS signal interruption.
GE HD daq8580 video streaming appliance is optimized for unmanned vehicles
Product News  
8/17/2011   Post a comment
GE Intelligent Platforms has announced the daq8580 rugged streaming network appliance, a complete, standalone, application-ready solution that, according to the company, delivers flexibility, high performance and excellent cost-effectiveness.
GE's new GFG500 Gb Ethernet video processor and 3U OpenVPX-REDI MCP500 processor offer flexibility, faster TTM
Product News  
8/17/2011   Post a comment
The 3U OpenVPX-REDI GFG500 Gigabit Ethernet Video Processor and the 3U OpenVPX-REDI MCP500 Processor from GE Intelligent Platforms are targeted for video and network processing applications deployed in harsh environments.
AMP introduces ultra-low-latency, high-definition H264 encoder on CompactPCI
Product News  
8/14/2011   Post a comment
The H264-ULL-cPCI from Advanced Micro Peripherals is a dual channel, high definition, ultra low latency H.264 encoder for CompactPCI systems.
Sealevel's new compact RISC Embedded SBC is application ready
Product News  
8/12/2011   Post a comment
The compact SBC-R9-2100 ARM9 RISC single board computer (SBC) from Sealevel Systems is an application-ready platform for embedded applications requiring small size, wide operating temperature range, and flexible I/O connectivity.
Sealevel's low profile PCI Express board adds digital inputs and outputs
Product News  
8/12/2011   Post a comment
The DIO-16-LPCIe low profile PCI Express digital I/O interface adapter from Sealevel Systems Inc. provides 8 optically isolated inputs and 8 Reed relay outputs, making it suitable for a variety of monitoring and control applications.
Connector tool joins MapleSim models to dSPACE controller board
Product News  
8/12/2011   Post a comment
Allows real-time implementation in a single environment.
EMI scans verify chip design and accelerate time-to-market
Design How-To  
8/11/2011   3 comments
Very-near-field electromagnetic scanning technology displays spatial and spectral emissions profiles and avoids issues in later, more costly testing at the module, system, or complete vehicle level.
congatec conga-EAF module with AMD Fusion architecture provides broad scalability for ETX standard
Product News  
8/9/2011   Post a comment
congatec Inc. has launched the conga-EAF Computer-on-Module (COM) with the intention of guaranteeing a sustainable future and broad scalability for the ETX standard.
Microchip launches PIC32 board for GUI Development w/o external graphics controller
Product News  
8/9/2011   Post a comment
Microchip Technology Inc.'s new AC164144 PIC32 board is a low-cost, controllerless, graphics PICtail Plus daughter board that enables the development of graphics applications without an external graphics controller.
Lanner’s newest fanless in-vehicle computer sports dual core Intal Atom, GPS, multiple I/Os
Product News  
8/6/2011   Post a comment
The LEC-5510 in-vehicle computer from Lanner Electronics is designed to be used in all mobile land vehicles, including: construction equipment, semis, cabs, vans, trains and buses.
Design your devices for X-ray Inspection
Design How-To  
8/5/2011   Post a comment
Understand and plan for x-ray inspection to ensure a clear, accurate image.
When there’s too many options, but not enough support
Engineering Pop Culture!  
8/4/2011   5 comments
If your ability to add features squeezes out time to do those less-glamorous tools, your users suffer
Axiomtek’s Atom-based HMI touch panel computer sports wide temp support and IP65 protection
Product News  
8/1/2011   Post a comment
Axiomtek's GOT-3156TL-830 is a heavy-duty & fanless HMI touch panel computer utilizing a 15-inch high brightness (400 nits) XGA TFT LCD with a resolution of 1024 x 768 pixels. Parts Search

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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