Embedded Systems Conference
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posted in August 2012
CST offers EMC and SI tool for PCBs
Product News  
8/31/2012   Post a comment
Computer Simulation Technology launched CST BOARDCHECK for design engineers dealing with electromagnetic compatibility and signal integrity of PCBs to get a quick overview of potential problems in their layout.
Experts see promise, threat in SDN, OpenFlow
News & Analysis  
8/24/2012   4 comments
Software-defined networking and the OpenFlow protocol holds promise but also could disrupt business models said a panel of experts.
IDT NVMe flash controller
Product News  
8/21/2012   Post a comment
IDT announced samples of its NVM Express (NVMe) enterprise flash memory controller with native support for PCIe® Gen 3.
Startup delivers integrated storage, server
News & Analysis  
8/20/2012   1 comment
Startup SimpliVity comes out of stealth mode today debuting OmniCube, an integrated server, storage and networking system packed into a single 2U box.
New group to set goals for next-gen Ethernet
News & Analysis  
8/20/2012   1 comment
A new group will tackle an issue that’s been a hot debate in communications for two years—should the next big leap for Ethernet be to 400 Gbits/second or a Terabit/s.
Tech manufacturing returning, U.S, group says
News & Analysis  
8/16/2012   6 comments
Electronics manufacturing operations with a total value of at least $2.5 billion are expected to be brought to North America in the next three years with companies citing quality control as the primary reason for bringing operations back from overseas.
ADLINK cPCI Blade sports 8-core Intel Xeon processor E5-2448L
Product News  
8/14/2012   Post a comment
The cPCI-6930 6U dual-slot CompactPCI (cPCI) processor blade from ADLINK Technology, Inc. features a 1.8 GHz eight-core Intel Xeon processor E5-2448L.
Mini-ITX motherboard based on Intel QM77 supports Intel Coreä processors
Product News  
8/14/2012   Post a comment
The new MI970 Mini-ITX motherboard from IBASE Technology Inc. is based on the Intel QM77 Express Chipset.
Inside RIM Blackberry Playbook LTE
News & Analysis  
8/10/2012   11 comments
UBM TechInsights found parts from TI, Samsung, Qualcomm, Freescale and others in a teardown of RIM's Blackberry Playbook LTE.
COM Express Type 2 module boasts 3rd gen Intel Core processors
Product News  
8/9/2012   Post a comment
The conga-BP77 3rd generation Intel Core module from congatec, Inc. is based on the COM Express Type 2 connector pin-out and supports the PCI Express graphics port for high-performance external graphics.
Mini PCI Express card enables wireless M2M for commercial and industrial apps
Product News  
8/7/2012   Post a comment
The HE910 with Mini PCIe Adapter from Telit Wireless Solutions offers M2M connectivity for embedded PCs in commercial and industrial applications.
Low wattage embedded computer powers vertical market apps with Ubuntu
Product News  
8/1/2012   Post a comment
The Waysmall Silverlode computer from Gumstix, Inc. is a compact 11.0 x 4 .4cm, 1.8cm tall, low-wattage computer designed for developers of commercial and industrial vertical market applications.


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Max Maxfield

ESC Minneapolis 2015 Sneak Peek! Baking Pis in Africa
Max Maxfield
Post a comment
One of the great things about my job is that so many interesting people get to meet me I get to meet so many interesting people (LOL). For example, I just received an email from Kurtis ...

Bernard Cole

A Book For All Reasons
Bernard Cole
1 Comment
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
5 comments
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

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