LTE sales overtake WiMax, says analyst News & Analysis 9/21/2011 3 comments The market for mobile communications infrastructure is growing strongly, according to market research firm Infonetics Research Inc., which said that LTE infrastructure equipment spending greater than that of WiMax for the first time in 2Q11.
USB audio/video codec in 38x70mm footprint Product News 9/20/2011 Post a comment Model 2253 is a compact and robust USB-compatible audio/video codec that is powered from a single USB port. Its 38x70mm footprint and low power consumption (1.5 Watts) make it well suited for both portable and embedded applications.
Inphi samples chips to power 100G ports News & Analysis 9/19/2011 1 comment Inphi Corp. is sampling physical-layer and clock-data recovery chips aimed to simplify designs for next-generation systems supporting 100 Gbit/s Ethernet standards.
SK Telecom embeds NFC in SIM card News & Analysis 9/16/2011 Post a comment Korean mobile phone service provider SK Telecom claims that is has developed the world's first SIM card equipped with a Near Field Communications (NFC) chip which can be retrofitted to non-NFC handsets thereby enabling NFC-based services.
Kontron adopts ARM across the board News & Analysis 9/8/2011 7 comments Kontron AG, a leading supplier of board-level subsystems, has said it plans to introduce a broad range of boards, single-board computers, tablets and industrial PC units based on the ARM architecture.
The benefits of FireWire on PCI Express Design How-To 9/5/2011 Post a comment high-speed protocols such as IEEE 1394b (FireWire) to provide benefits to the consumer: increased bandwidth and more efficient performance, reduced board footprint, improved power management, increased error immunity and support for a long list of feature enhancements.
Mobile measurement supports onboard EHV high-voltage testing Design How-To 9/1/2011 Post a comment On-road EHV testing calls for considerably greater data acquisition and wiring challenges than stationary applications. Onboard or road test data collection within a typical test track environment subjects instrumentation to higher-than-usual shock and vibration inputs, placing greater mechanical demands upon components and systems.