Google Fellow Talks Neural Nets, Deep Learning News & Analysis 6/28/2016 2 comments We are already living with deep learning and large-scale neural networks, as evidenced by the growing number of applications that rely on computer vision, language understanding, robotics and more. Google Senior Fellow Jeff Dean discusses what he wants most from neural networks and machine learning.
Universal High-Power AC Inputs: Perk or Pitfall? Blog 6/22/2016 Post a comment Alternating current (AC) power is available throughout almost the entire world and provides a convenient power source for many electronics. Unfortunately, the power around the world is not the same in each location. There are different voltage levels and frequencies, depending on where in the world you may be – but is there a better way to design this power supply?
ARM Describes 10nm Test Chip News & Analysis 5/18/2016 3 comments ARM taped out a 10nm FinFET test chip in January at TSMC and expects similar SoCs will be in handsets by the end of the year, using the process it described as relatively expensive and focused on lowering power.
Building Multi-Port USB Type-C Adapters for Power Blog 5/17/2016 Post a comment In the a previous blog, we discussed some of the challenges when designing AC/DC adapters for USB Type-C power delivery (PD). In that article, we focused on an adapter with a single Type-C output connector. In this article, we’ll examine the complexities introduced when architecting a multi-port Type-C adapter.
Samsung Details Foundry Roadmap News & Analysis 4/22/2016 3 comments Officials from Samsung Semiconductor Inc. detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.
NI's mmW Radio Speeds 5G Research News & Analysis 4/21/2016 1 comment National Instruments announced a software defined radio for the millimeter wave spectrum. The transceiver system that can transmit and/or receive wide-bandwidth signals at 2 GHz real-time bandwidth, covering the 71-76 GHz spectrum. The system comes with accompanying software.
Ams Breaks Ground on N.Y. Fab News & Analysis 4/20/2016 1 comment AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
FD-SOI Expands, But Is It Disruptive? News & Analysis 4/14/2016 5 comments The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
VC Veteran Joins EDA Group News & Analysis 4/13/2016 Post a comment Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Machine Learning Routes Chips News & Analysis 4/8/2016 Post a comment The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
Developing an Accessible Arduino News & Analysis 3/31/2016 Post a comment Development platforms such as Raspberry Pi and Arduino have given access to many makers and entrepreneurs , providing a low-cost method to tinker and prototype. Yet such platforms lack accessibility for at least one group of people who need access to specialized devices.
EDA Group Broadens Mission News & Analysis 3/31/2016 10 comments The EDA Consortium renamed itself the Electronic System Design Alliance, taking on a broader role including semiconductor IP, embedded software and advanced packaging.
Layouts for Buck, Boost, and SEPIC Power Stages Blog 3/23/2016 1 comment A correct printed circuit board (PCB) layout is one of the most important aspects to having a successful power supply design. Non-isolated power stages are the basic building blocks of power systems. Understanding where the currents are flowing and how the high-frequency loops are constructed is the most important step.
5G mmW Models Go Open Source News & Analysis 3/11/2016 Post a comment In an effort to speed 5G development, NYU Wireless will provide its
channel models and measurements for cellular propagation in the millimeter wave (mmW) band as free, open source software. The simulation will help product developers understand the behavior and capabilities of the mmW radio spectrum.
Decoding Electronic Materials Genome News & Analysis 3/8/2016 Post a comment Obama's Material's Genome Initiative is finally bearing electronic-fruit with the University of Connecticut's machine learning algorithm for calculating the electronic characteristics of polymers.
4th ICE Age Upon Us News & Analysis 2/25/2016 Post a comment Mentor Graphics is claiming that it has entered the 4th ICE Age with its accelerated, deterministic in-circuit-emulation apps like accurate design-for-test.
Leti Strains to Improve FDSOI News & Analysis 12/17/2015 Post a comment French research institute CEA-Leti has reported on two techniques to put local strain in the silicon channel of a fully-depleted silicon-on-insulator (FDSOI) manufacturing process.
X-Pessimism: A Realistic Approach is Needed Blog 12/8/2015 9 comments A gate-level simulator is pessimistic when a signal does not resolve to a known logic value (0 or 1), a sign something is off. The fix can mean months of work. How can pessimism be fixed without getting too depressing?
ARM Sizes Up Moore’s Law News & Analysis 12/7/2015 3 comments It’s getting harder and more costly to make chips smaller and faster, but there is still hope for advancing Moore’s Law, said an ARM researcher at IEDM.
Verizon Unveils ThingSpace IoT Platform News & Analysis 10/29/2015 Post a comment Verizon wants to connect billions of things within the space of its 4G LTE network. The company announced an Internet of Things development platform, ThingSpace, that aims to lower the barrier to entry for connectivity in smart cities, healthcare, agriculture, energy, and sharing platforms.
Apple Gives a Foundry Lesson Blog 10/16/2015 10 comments The rush to analyze Apple products has led to distorted conclusions from some who fail to appreciate the nuances of semiconductor technology, says one analyst.
5nm Test Lights Litho Path News & Analysis 10/7/2015 6 comments Test chips made in a 5nm process showed the value of pushing today’s 193-immersion and tomorrow’s extreme ultraviolet lithography systems to their limits, said researchers at Imec and Cadence.
Put FPGAs In Your SoCs News & Analysis 10/2/2015 5 comments Flex Logix has a new type of FPGA that nearly doubles the number of usable gates per chip. The FPGAs eliminate more than 20% of the room needed for interconnect and switches, and now have nearly 50% more room for gates.
TSMC Preps 10nm, Tunes 16nm News & Analysis 9/17/2015 7 comments The world’s largest chip foundry said it will start “risk” production in 10nm late this year while it fine tunes its 16nm process and plans a basket of IoT offerings.
Dresden Memory Startup To Debut At Semicon Europa News & Analysis 9/15/2015 5 comments A startup company that is working on a ferroelectric non-volatile memory technology based on hafnium oxide is set to make its debut at the Semicon Europa exhibition taking place in Dresden, Germany, October 6 to 8.
Post-Silicon Tech Compared News & Analysis 9/9/2015 4 comments The Semiconductor Research Corporation is creating a joint benchmarking effort with Georgia Tech to guide post-silicon era electronics development at IBM, Intel, Freescale and Texas Instruments.
Flextech Guru Helps U.S. Stretch News & Analysis 9/3/2015 2 comments The head of a new initiative to give the U.S. a lead in flexible hybrid electronics talks about the technology, markets and politics of the $165 million effort.
Nanotech Hub Targets 7nm, Beyond Slideshow 8/27/2015 2 comments We toured the College of Nanoscience and Engineering, part of a State University of New York campus, a hub for advanced semiconductor manufacturing research in areas such as lithography, 450mm wafers, and new materials as well as photonics, biotech and workforce development.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.