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Google Fellow Talks Neural Nets, Deep Learning
News & Analysis  
6/28/2016   Post a comment
We are already living with deep learning and large-scale neural networks, as evidenced by the growing number of applications that rely on computer vision, language understanding, robotics and more. Google Senior Fellow Jeff Dean discusses what he wants most from neural networks and machine learning.
System Scaling Key to Semiconductor Progress
Blog  
6/24/2016   Post a comment
System scaling technologies exist but can't go mainstream until IC designers and manufacturing experts cooperate.
Universal High-Power AC Inputs: Perk or Pitfall?
Blog  
6/22/2016   Post a comment
Alternating current (AC) power is available throughout almost the entire world and provides a convenient power source for many electronics. Unfortunately, the power around the world is not the same in each location. There are different voltage levels and frequencies, depending on where in the world you may be – but is there a better way to design this power supply?
IP Business Should Learn from EDA’s Playbook
Blog  
6/15/2016   Post a comment
Industry veteran sees parallels between IP's opportunity, EDA's rise.
DAC: Coventor Adds Electrical Analytics
News & Analysis  
6/7/2016   2 comments
Coventor's SEMulator3D adds electrical analytic tools making the MEMS design program targeted at 3D chip and system design engineers.
Arteris Rolls New Heterogeneous SoC Architecture
News & Analysis  
5/23/2016   Post a comment
Intellectual property vendor touches new technology for designing SoCs with cache coherency.
Synopsys Aims to Deliver ‘Software Signoff’ Platform
News & Analysis  
5/19/2016   Post a comment
Leading EDA vendor looks to software quality and security to broaden its serviceable market.
ARM Describes 10nm Test Chip
News & Analysis  
5/18/2016   3 comments
ARM taped out a 10nm FinFET test chip in January at TSMC and expects similar SoCs will be in handsets by the end of the year, using the process it described as relatively expensive and focused on lowering power.
Building Multi-Port USB Type-C Adapters for Power
Blog  
5/17/2016   Post a comment
In the a previous blog, we discussed some of the challenges when designing AC/DC adapters for USB Type-C power delivery (PD). In that article, we focused on an adapter with a single Type-C output connector. In this article, we’ll examine the complexities introduced when architecting a multi-port Type-C adapter.
Auto Industry Caught in Software Quagmire
Blog  
5/3/2016   Post a comment
Software is changing the automotive industry, but is your approach to software development adapting?
Samsung Details Foundry Roadmap
News & Analysis  
4/22/2016   4 comments
Officials from Samsung Semiconductor Inc. detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.
NI's mmW Radio Speeds 5G Research
News & Analysis  
4/21/2016   1 comment
National Instruments announced a software defined radio for the millimeter wave spectrum. The transceiver system that can transmit and/or receive wide-bandwidth signals at 2 GHz real-time bandwidth, covering the 71-76 GHz spectrum. The system comes with accompanying software.
Ams Breaks Ground on N.Y. Fab
News & Analysis  
4/20/2016   1 comment
AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
When 3D Printing Meets PCBs
Blog  
4/20/2016   2 comments
The convergence of electronics and 3D printing will bring the PCB prototyping in-house.
FD-SOI Expands, But Is It Disruptive?
News & Analysis  
4/14/2016   5 comments
The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
Facebook Roadmap Eyes AR/VR, Connectivity
News & Analysis  
4/13/2016   2 comments
Facebook's CEO said the company will target three major areas in the next 10 years: connecting everyone to the Internet, artificial intelligence, and virtual and augmented reality.
VC Veteran Joins EDA Group
News & Analysis  
4/13/2016   Post a comment
Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Machine Learning Routes Chips
News & Analysis  
4/8/2016   Post a comment
The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
FinFET's Father Forecasts Future
News & Analysis  
4/1/2016   3 comments
The father of the FinFET shared emerging ideas for building transistors as semiconductors approach atomic feature sizes.
Developing an Accessible Arduino
News & Analysis  
3/31/2016   Post a comment
Development platforms such as Raspberry Pi and Arduino have given access to many makers and entrepreneurs , providing a low-cost method to tinker and prototype. Yet such platforms lack accessibility for at least one group of people who need access to specialized devices.
EDA Group Broadens Mission
News & Analysis  
3/31/2016   10 comments
The EDA Consortium renamed itself the Electronic System Design Alliance, taking on a broader role including semiconductor IP, embedded software and advanced packaging.
Layouts for Buck, Boost, and SEPIC Power Stages
Blog  
3/23/2016   1 comment
A correct printed circuit board (PCB) layout is one of the most important aspects to having a successful power supply design. Non-isolated power stages are the basic building blocks of power systems. Understanding where the currents are flowing and how the high-frequency loops are constructed is the most important step.
MEMS Grand Challenge Debuts
News & Analysis  
3/16/2016   1 comment
A new design contest features a process design kit that the winners will use to fabricate their MEMS chip at X-Fab.
5G mmW Models Go Open Source
News & Analysis  
3/11/2016   Post a comment
In an effort to speed 5G development, NYU Wireless will provide its channel models and measurements for cellular propagation in the millimeter wave (mmW) band as free, open source software. The simulation will help product developers understand the behavior and capabilities of the mmW radio spectrum.
Decoding Electronic Materials Genome
News & Analysis  
3/8/2016   Post a comment
Obama's Material's Genome Initiative is finally bearing electronic-fruit with the University of Connecticut's machine learning algorithm for calculating the electronic characteristics of polymers.
4th ICE Age Upon Us
News & Analysis  
2/25/2016   Post a comment
Mentor Graphics is claiming that it has entered the 4th ICE Age with its accelerated, deterministic in-circuit-emulation apps like accurate design-for-test.
Parasitic Extraction for Accurate Signal Integrity Analysis
Blog  
2/19/2016   Post a comment
A number of new models have emerged that are useful for parasitic extraction at advanced nodes, including multi-patterning, FinFETs, and resistance and capacitance models.
Free Core, Some Assembly Required
News & Analysis  
1/7/2016   23 comments
The RISC-V free, open-source microprocessor core needs lots of work but has a cadre of seasoned engineers willing to help.
Automated Solution for Voltage-Aware DRC
Blog  
12/23/2015   Post a comment
Advanced nodes have brought to SoC designers a new kind of spacing check, called voltage-aware DRC (VA-DRC). What does this term mean, and what new challenges does it bring to the DRC task?
Leti Strains to Improve FDSOI
News & Analysis  
12/17/2015   Post a comment
French research institute CEA-Leti has reported on two techniques to put local strain in the silicon channel of a fully-depleted silicon-on-insulator (FDSOI) manufacturing process.
X-Pessimism: A Realistic Approach is Needed
Blog  
12/8/2015   9 comments
A gate-level simulator is pessimistic when a signal does not resolve to a known logic value (0 or 1), a sign something is off. The fix can mean months of work. How can pessimism be fixed without getting too depressing?
ARM Sizes Up Moore’s Law
News & Analysis  
12/7/2015   3 comments
It’s getting harder and more costly to make chips smaller and faster, but there is still hope for advancing Moore’s Law, said an ARM researcher at IEDM.
Menta eFPGAs Win Over E.U.
Blog  
11/16/2015   2 comments
Menta offers electronic design tools (EDA) tools that enable you to put an FPGA accelerator on any chip you want.
Confluence of Tech Grows Virtualization Market for OEMs
Blog  
11/2/2015   Post a comment
Increasingly, designers, architects, engineers, and even health care professionals are turning to remote graphics virtualization.
Complex SoCs: Early Use of Physical Design Info Shortens Timing Closure
Blog  
10/30/2015   Post a comment
Chip designs are becoming so complex that they are extremely difficult to implement in the physical design stage. Predicting trouble spots beforehand is paramount.
Verizon Unveils ThingSpace IoT Platform
News & Analysis  
10/29/2015   Post a comment
Verizon wants to connect billions of things within the space of its 4G LTE network. The company announced an Internet of Things development platform, ThingSpace, that aims to lower the barrier to entry for connectivity in smart cities, healthcare, agriculture, energy, and sharing platforms.
Silicon Valley's Role in Digital India Highlighted by Indian PM
Blog  
10/20/2015   1 comment
PM Modi recognizes the talent in Silicon Valley, and of the Indian Diaspora in particular.
Apple Gives a Foundry Lesson
Blog  
10/16/2015   10 comments
The rush to analyze Apple products has led to distorted conclusions from some who fail to appreciate the nuances of semiconductor technology, says one analyst.
5nm Test Lights Litho Path
News & Analysis  
10/7/2015   6 comments
Test chips made in a 5nm process showed the value of pushing today’s 193-immersion and tomorrow’s extreme ultraviolet lithography systems to their limits, said researchers at Imec and Cadence.
Wearables & IoT to Alter Electronic Design Process
Blog  
10/6/2015   Post a comment
Living small requires a lot of planning. Engineers will need all the help they can get designing for the Internet of Things.
New Funding Brings Aquantia Near $200 Million
News & Analysis  
10/5/2015   2 comments
Funding round worth $37 million brings Ethernet chip vendor to $199 million total over 10 years.
Put FPGAs In Your SoCs
News & Analysis  
10/2/2015   5 comments
Flex Logix has a new type of FPGA that nearly doubles the number of usable gates per chip. The FPGAs eliminate more than 20% of the room needed for interconnect and switches, and now have nearly 50% more room for gates.
Startup Raises Online Tool Debate
News & Analysis  
9/30/2015   Post a comment
Upverter upgraded its online service for circuit-board designers, raising questions about the outlook for cloud-based design.
TSMC Preps 10nm, Tunes 16nm
News & Analysis  
9/17/2015   7 comments
The world’s largest chip foundry said it will start “risk” production in 10nm late this year while it fine tunes its 16nm process and plans a basket of IoT offerings.
Dresden Memory Startup To Debut At Semicon Europa
News & Analysis  
9/15/2015   5 comments
A startup company that is working on a ferroelectric non-volatile memory technology based on hafnium oxide is set to make its debut at the Semicon Europa exhibition taking place in Dresden, Germany, October 6 to 8.
Post-Silicon Tech Compared
News & Analysis  
9/9/2015   4 comments
The Semiconductor Research Corporation is creating a joint benchmarking effort with Georgia Tech to guide post-silicon era electronics development at IBM, Intel, Freescale and Texas Instruments.
Flextech Guru Helps U.S. Stretch
News & Analysis  
9/3/2015   2 comments
The head of a new initiative to give the U.S. a lead in flexible hybrid electronics talks about the technology, markets and politics of the $165 million effort.
Nanotech Hub Targets 7nm, Beyond
Slideshow  
8/27/2015   2 comments
We toured the College of Nanoscience and Engineering, part of a State University of New York campus, a hub for advanced semiconductor manufacturing research in areas such as lithography, 450mm wafers, and new materials as well as photonics, biotech and workforce development.
Giga-Scale Challenges Plague Memory Design
Blog  
8/27/2015   Post a comment
Advanced designs are more complex and larger than ever before and designers are balancing between accuracy and performance for large scale memory simulation and verification, fine-tuning options and settings for each circuit type
The Power of Dynamic Voltage Frequency Scaling
Blog  
8/20/2015   3 comments
If dynamic behavior could be adjusted to fit the task at hand in consumer electronics, think of the power that could be saved.
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