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Google Unveils Modular Phone
News & Analysis  
4/16/2014   Post a comment
Mod is back, according to officials from Google's Project Ara team. The module developers kit for the open source, build-your-own-phone was on display at the company's first Ara Developer's Conference, held April 15-16 at the Computer History Museum.
Faroudja’s Bit Rate Reducer Gambit
News & Analysis  
4/16/2014   2 comments
At the NAB show, Yves Faroudja and his new startup showed off new technology designed to provide up to 50 percent reduction in video bit rates without reduction in image quality.
Mushrooms Recover Gold out of Mobile Scrap
News & Analysis  
4/11/2014   11 comments
Researchers have developed a novel way to extract metals, specifically gold, from discarded electronics: mushrooms.
Chip Experts Cautiously Optimistic
News & Analysis  
4/10/2014   14 comments
Scaling looks good down to 5nm but the outlook is dim for alternative technologies such as FD-SOI and mixed for 450mm wafers, experts say.
ISPD-14 Focuses on FinFETs, Security, Supply Chain
News & Analysis  
4/9/2014   Post a comment
The 2014 International Symposium on Physical Design explored many areas in the development of next-generation integrated circuits. In addition to securing the chip supply chain and the latest FinFET developments, the discussion looked at cyberphysical system design.
Windows Opens Console to Phone
News & Analysis  
4/4/2014   9 comments
Windows 8.1 and Phone 8.1 come with a host of new tricks and treats, including a $0 royalty licensing program for OEMs developing mobile devices with screens under 9 inches. Among Microsoft’s big reveals was a converged developer platform that allows developers to create universal Windows apps for a common Windows runtime on tablets, phones, PCs and, eventually, wearables.
Toyota Underestimated 'Deadly' Risks
News & Analysis  
4/1/2014   20 comments
A software expert whose testimony led to a guilty verdict against Toyota said in his keynote at EE Live! that the best assurance for preventing similar "deadly" outbreaks must be stronger, smarter oversight by federal regulators.
S3 Preps DAC Product With a Twist
News & Analysis  
3/28/2014   1 comment
The Irish firm, which has mostly stuck to its role as a supplier of design services and IP, is looking to sell its own ICs soon. The first product is likely to be a high-speed digital-to-analog converter.
Will SMIC Narrow Tech Gap?
News & Analysis  
3/27/2014   13 comments
Critics worry that SMIC, under Tzu-Yin Chiu’s leadership, might have already given up a dream of directly competing with the world’s Tier 1 foundries such as TSMC, Samsung, and Intel.
FinFETs Not the Best Silicon Road
Blog  
3/27/2014   42 comments
The move to 20nm bulk CMOS and 16/14nm FinFETs brings one of the most serious challenges the semiconductor industry has faced in 20 years.
On-Chip Interconnect Costs Spawn Research
Blog  
3/26/2014   Post a comment
The rising cost of on-chip interconnects is spawning inventive research on several fronts, many of which will be debated at a May event.
Can Connected Car Save Fuel?
Blog  
3/26/2014   3 comments
A connected car can help save a lot of fuel and time, along with keeping you safe. These factors will drive the adoption of connected car solutions more than anything else.
Transistor-Cost Declines Slowing, Synopsys Says
News & Analysis  
3/24/2014   10 comments
The cost/transistor is not declining like it used to, forcing shifts and opening opportunities said the chairman of Synopsys at an annual user group event.
Europe Seeing Slower Speeds for IC Compiler II Designs
News & Analysis  
3/24/2014   Post a comment
When compared to the United States and Japan, European engineers are seeing less speed-up in their chip designs from a new version of IC Compiler. Here’s a look at the reasons why.
Synopsys Upgrades Place & Route Tool
News & Analysis  
3/24/2014   1 comment
Synopsys announced the IC Compiler II and an upgrade of its flagship place-and-route chip design tool, boasting faster throughput while using less memory.
Will China Conquer MEMS?
News & Analysis  
3/20/2014   8 comments
After a mad rush to develop apps processors for tablets and smartphones, Chinese entrepreneurs are now concluding that the rapidly growing number of MEMS inside a smartphone is too huge an opportunity to pass up.
Circuit Reliability Is Not a 'New Node' Problem
Blog  
3/20/2014   Post a comment
When migrating to a new node, circuit reliability is a concern: Physics involved may change as process dimensions change, but is your design robust against electrical circuit failure?
5 New Products Not to Miss at EE Live!
Slideshow  
3/19/2014   3 comments
We've highlighted five new products that you shouldn't miss at EE Live! in April. Here's a quick tour of what's hot.
Ex-Nokia Designer Leads Shenzhen Media Lab
News & Analysis  
3/14/2014   8 comments
Ex-Nokia researcher based in Shenzhen knows something about Shenzhen, and about the city’s potential in the next 10 years. He’s betting on Shenzhen’s shift from the world’s low-wage factory to a global prototyping center.
Cadence Expands Its Systems Definition
News & Analysis  
3/13/2014   1 comment
Cadence shows off the fruits of its IP acquisition spree.
ZTE's Bid to Go Upmarket via Nubia
News & Analysis  
3/10/2014   4 comments
Nubia is ZTE's vehicle to go "upmarket," with a mission to establish a viable consumer brand and consumer channels -- not just in China but also in the United States.
Marvell to Launch IoT Maker Kit
News & Analysis  
3/10/2014   17 comments
Marvell has rolled out Kinoma Create, the JavaScript-powered IoT construction kit. Peter Hoddie, Marvell's Kinoma vice president, described it as "a developer prototyping device that leverages our software work to open the 'maker' movement."
16nm Pushes Chip Design Boundaries at CDNLive
News & Analysis  
3/7/2014   1 comment
One of the key issues being debated at the 2014 CDN Live conference is the race to make 16nm chip design more efficient. Engineers from Intel and TSMC are both expected to present papers on the subject.
Google Glass Success Depends on Niche Apps
News & Analysis  
3/6/2014   1 comment
Prototyping applications will be key to the success of Google Glass and other wearable glasses, speakers at Wearables DevCon said. The conference was designed for wearable makers, software developers and app creators.

CDNLive: Verification Challenges Driving Innovation
News & Analysis  
3/6/2014   Post a comment
At the 2014 CDN Live conference later this month, the vast majority of papers being debated at the show will focus on the challenges of delivering full functional design.
New DARPA Program Targets Bootleg Components
News & Analysis  
3/5/2014   9 comments
Counterfeit components remain the scourge of electronics OEMs. The Pentagon is looking to the engineering community for a solution that will authenticate parts at any step in the supply chain.
ARM to Drive Tablet & Set-Top SoC Convergence
News & Analysis  
3/5/2014   14 comments
The players doggedly chasing the DTV and set-top market are no longer traditional TV chip vendors. Instead, mobile (i.e., tablet) SoC vendors have emerged to take the lead.
Google’s Project Ara: Who Are Real Targets?
Blog  
3/3/2014   16 comments
Call it a Lego phone, a modular phone, a DYI phone, or a totally customizable phone. Google's Project Ara is breaking a smartphone into modular pieces and letting people build custom phones.
Temperature Measurement Reference Design: Wide Range, Low Power
Industrial Control DesignLine Blog  
2/27/2014   1 comment
In industrial settings, temperature is one of the most widely measured and transmitted elements -- but it can be a power-sucking exercise.
Ford Invites Open-Source Community to Tinker Away
News & Analysis  
2/27/2014   14 comments
Zachary Nelson, a recent MIT graduate and an engineer with Ford, will speak at EELive! and discuss how the Open XC and open-source platform could allow people with smartphones to connect with real-time vehicle data.
MWC: Best Wearables for Navel Gazers
Blog  
2/25/2014   22 comments
The Mobile World Congress is showcasing a whole new generation of wearables you have to strap on to your wrist. Junko Yoshida says they are designed for navel gazers, and selfies are for idiots.
LTE Built-In GM Cars: No Smartphones Required
News & Analysis  
2/25/2014   24 comments
Smartphones are no longer the only platform hotly pursued by cellular operators eager to boost their revenue. Now, it’s cars. GM has partnered with AT&T, and Qualcomm launched 20nm LTE-A chipset for automotive.
What’s Happening at SPIE?
Blog  
2/20/2014   Post a comment
As we march down the shrink roadmap, foundries are faced with the unenviable task of having to maintain their time-to-mask targets while managing the lithography related computational complexities and doing so with limited resources.
Spansion to Launch HyperBus I/F for Automotive
News & Analysis  
2/18/2014   12 comments
Spansion has developed HyberBus Interface, targeting in-car systems that demand “instant-on” and “interactive graphical user interface.” The proprietary interface offers low latency, high read throughput, and low pin-count.
Sonics' New IP for Low-Power SoCs Patented
News & Analysis  
2/18/2014   3 comments
Sonics revealed the issuance of patent 8,601,288 "Intelligent Power Controller" from the US Patent Office. The hardware-based power-management IP lets SoC designers partition power domains and turn them on and off without software intervention.
Google Ramps Up Chip Design
News & Analysis  
2/12/2014   35 comments
Evidence is mounting that Google is ramping up a broad and deep chip design capability, but its focus and timing are still unclear.
Qualcomm Answers 'Auto-Grade Dilemma'
Blog  
2/10/2014   1 comment
Qualcomm is ideally positioned to answer what I call the "auto-grade dilemma." It's a dilemma because moving technologies originally designed for smartphones to automotive use is a big challenge -- especially for a company like Qualcomm.
Embedded Vision: Detect Pedestrians
Blog  
2/10/2014   Post a comment
Recently published European New Car Assessment Program test results reveal significantly better detection performance from Subaru Outback's vision-based system versus radar and Lidar.
IBM’s Chip Unit on Chopping Block?
News & Analysis  
2/7/2014   50 comments
Discussions about putting IBM’s semiconductor business on the chopping block have returned with a vengeance. IBM reportedly retained Goldman Sachs to look for possible buyers.
Sony Dumps PCs, Splits TV Op, Cuts 5,000 Jobs
Blog  
2/6/2014   26 comments
Sony dumps its PC business, splits its TV division and cuts 5,000 jobs, and issues a fiscal warning. But lacking is clarity: We all know what Sony was, but what is it becoming?
Spansion, Post Merger, to Launch Auto SoC Mid-2014
News & Analysis  
2/5/2014   17 comments
Spansion plans to home in on the automotive market by launching new SoC products, the first fruits of the acquisition of Fujitsu Semiconductor's MCU and analog businesses, in the middle of this year.
Expect India Fabs Green Lighted Within a Week
Blog  
2/4/2014   22 comments
The ball will start rolling at long last for the two semiconductor manufacturing facilities in India. Sources say the Indian government will give the green light within a week.
Qualcomm LTE IC Makes (Auto-) Grade, But Only in Module
News & Analysis  
1/30/2014   8 comments
As car OEMs put together in-vehicle infotainment and telematics systems based on consumer technologies, the question is: Are these consumer chips automotive-qualified?
Macronix-Spansion Clash Heats Up
News & Analysis  
1/28/2014   4 comments
The war of words between Spansion and Macronix, entangled in several separate legal fights over flash memory, escalated when Macronix issued a release entitled “Macronix Demands Spansion Cease and Desist False and Misleading Statements Concerning Macronix.”
Nvidia’s G-Sync Nears Gamers' Nirvana
Blog  
1/27/2014   11 comments
The Holy Grail in computer graphics and in particular games is the suspension of disbelief. If the graphics are good enough the player will become immersed and lose himself in the game.
Slashing Costs in 3D IC Wafer Process
News & Analysis  
1/27/2014   3 comments
AML has filed a patent for its newly developed vacuum wafer carrier solution, using carriers with etched micro-patterns that allow for a vacuum to be created between the carrier and the wafer to be processed.
Samsung SDI Climbing Onto China's EV Bandwagon
News & Analysis  
1/23/2014   2 comments
Samsung SDI Co. Ltd. has signed a preliminary agreement to build an electric car battery factory in Xi'an, China, where Samsung Electronics is already building a multi-billion dollar fab for NAND flash memory chips.
Why SoC Design Teams Still Struggle in a Connected World
Blog  
1/22/2014   5 comments
Global SoC design teams now have more ways to communicate with one another. Why, then, is it still so difficult to complete System-on-a-Chip designs?
MediaTek, Pixelworks Gun for Mobile Video Post-Processing
News & Analysis  
1/16/2014   4 comments
MediaTek is migrating its home-grown Picture Quality engine, originally developed for large-screen HDTVs by its home business unit, into its latest eight-core mobile apps processor called “True Octa.”
TSMC: Solid Growth in Q4 Backed Up by Mobile
News & Analysis  
1/16/2014   6 comments
TSMC showed a solid 10.9% year-over-year growth in revenue in the fourth quarter, backed up strong mobile growth. But the demand for computer, consumer, and industrial-related products all declined by double digits.
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