IBM Bests Insulators
News & Analysis 4/7/2017 8 comments
IBM reveals a new, better dielectric formula that reduced parasitic capacitance at advanced nodes.
ISPD Predicts Chip Futures
News & Analysis 4/6/2017 Post a comment
International Symposium on Physical Design (ISPD) concentrated this year on increasing the performance of machine learning to realtime, thus outperforming human-driven chip design.
Machine Learning Comes to Chip Design
News & Analysis 4/6/2017 3 comments
Chip designers are hearing AI’s footsteps as it encroaches on their design work. Solido Design Automation, which has been applying its home-grown machine-learning algorithms to its software, is making its crown jewel available to customers via Machine Learning Labs.
Intel Shows Life Beyond CMOS
News & Analysis 4/3/2017 2 comments
At the International Symposium on Physical Design Intel presented more than dozen different ways to get beyond the limitations of conventional complementary metal oxide semiconductors while using the same fabs.
AI Tapped to Improve Design
News & Analysis 2/3/2017 14 comments
Nine companies and three universities are exploring how machine learning could tackle difficult problems in electronics design.
Startup Programs Multicores on Data, Not Gut
News & Analysis 11/16/2016 1 comment
Silexica's engineering team spent more than a decade in multicore software design automation for complex, multicore platforms, before it was spun off from RWTH Aachen University. The startup offers tools both for multicore SoC developers and hardware/software system architects.
Siemens to Buy Mentor Graphics in $4.5B Deal
News & Analysis 11/14/2016 14 comments
Siemens agreed to buy Mentor Graphics in a $4.5 billion deal. Europe’s largest industrial conglomerate has been beefing up its industrial software capabilities, sees Mentor’s tools as critical for developing “smart” and “connected” products -- including autonomous vehicles.
Cadence Breaks Down Automotive ISO 26262
News & Analysis 10/26/2016 Post a comment
As automakers start adding more and more ADAS features, the complexity of software code and SoCs deployed inside vehicles has been skyrocketing. Chip suppliers are under tremendous pressure to prove the functional safety of their products.
Google Fellow Talks Neural Nets, Deep Learning
News & Analysis 6/28/2016 2 comments
We are already living with deep learning and large-scale neural networks, as evidenced by the growing number of applications that rely on computer vision, language understanding, robotics and more. Google Senior Fellow Jeff Dean discusses what he wants most from neural networks and machine learning.
Universal High-Power AC Inputs: Perk or Pitfall?
Blog 6/22/2016 Post a comment
Alternating current (AC) power is available throughout almost the entire world and provides a convenient power source for many electronics. Unfortunately, the power around the world is not the same in each location. There are different voltage levels and frequencies, depending on where in the world you may be – but is there a better way to design this power supply?
ARM Describes 10nm Test Chip
News & Analysis 5/18/2016 3 comments
ARM taped out a 10nm FinFET test chip in January at TSMC and expects similar SoCs will be in handsets by the end of the year, using the process it described as relatively expensive and focused on lowering power.
Building Multi-Port USB Type-C Adapters for Power
Blog 5/17/2016 Post a comment
In the a previous blog, we discussed some of the challenges when designing AC/DC adapters for USB Type-C power delivery (PD). In that article, we focused on an adapter with a single Type-C output connector. In this article, we’ll examine the complexities introduced when architecting a multi-port Type-C adapter.
Samsung Details Foundry Roadmap
News & Analysis 4/22/2016 3 comments
Officials from Samsung Semiconductor Inc. detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.
NI's mmW Radio Speeds 5G Research
News & Analysis 4/21/2016 1 comment
National Instruments announced a software defined radio for the millimeter wave spectrum. The transceiver system that can transmit and/or receive wide-bandwidth signals at 2 GHz real-time bandwidth, covering the 71-76 GHz spectrum. The system comes with accompanying software.
Ams Breaks Ground on N.Y. Fab
News & Analysis 4/20/2016 1 comment
AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
FD-SOI Expands, But Is It Disruptive?
News & Analysis 4/14/2016 5 comments
The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
Facebook Roadmap Eyes AR/VR, Connectivity
News & Analysis 4/13/2016 2 comments
Facebook's CEO said the company will target three major areas in the next 10 years: connecting everyone to the Internet, artificial intelligence, and virtual and augmented reality.
VC Veteran Joins EDA Group
News & Analysis 4/13/2016 Post a comment
Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Machine Learning Routes Chips
News & Analysis 4/8/2016 Post a comment
The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
Developing an Accessible Arduino
News & Analysis 3/31/2016 Post a comment
Development platforms such as Raspberry Pi and Arduino have given access to many makers and entrepreneurs , providing a low-cost method to tinker and prototype. Yet such platforms lack accessibility for at least one group of people who need access to specialized devices.
EDA Group Broadens Mission
News & Analysis 3/31/2016 10 comments
The EDA Consortium renamed itself the Electronic System Design Alliance, taking on a broader role including semiconductor IP, embedded software and advanced packaging.
Layouts for Buck, Boost, and SEPIC Power Stages
Blog 3/23/2016 1 comment
A correct printed circuit board (PCB) layout is one of the most important aspects to having a successful power supply design. Non-isolated power stages are the basic building blocks of power systems. Understanding where the currents are flowing and how the high-frequency loops are constructed is the most important step.