Startup Programs Multicores on Data, Not Gut News & Analysis 11/16/2016 1 comment Silexica's engineering team spent more than a decade in multicore software design automation for complex, multicore platforms, before it was spun off from RWTH Aachen University. The startup offers tools both for multicore SoC developers and hardware/software system architects.
Siemens to Buy Mentor Graphics in $4.5B Deal News & Analysis 11/14/2016 14 comments Siemens agreed to buy Mentor Graphics in a $4.5 billion deal. Europe’s largest industrial conglomerate has been beefing up its industrial software capabilities, sees Mentor’s tools as critical for developing “smart” and “connected” products -- including autonomous vehicles.
Cadence Breaks Down Automotive ISO 26262 News & Analysis 10/26/2016 Post a comment As automakers start adding more and more ADAS features, the complexity of software code and SoCs deployed inside vehicles has been skyrocketing. Chip suppliers are under tremendous pressure to prove the functional safety of their products.
Google Fellow Talks Neural Nets, Deep Learning News & Analysis 6/28/2016 2 comments We are already living with deep learning and large-scale neural networks, as evidenced by the growing number of applications that rely on computer vision, language understanding, robotics and more. Google Senior Fellow Jeff Dean discusses what he wants most from neural networks and machine learning.
Universal High-Power AC Inputs: Perk or Pitfall? Blog 6/22/2016 Post a comment Alternating current (AC) power is available throughout almost the entire world and provides a convenient power source for many electronics. Unfortunately, the power around the world is not the same in each location. There are different voltage levels and frequencies, depending on where in the world you may be – but is there a better way to design this power supply?
ARM Describes 10nm Test Chip News & Analysis 5/18/2016 3 comments ARM taped out a 10nm FinFET test chip in January at TSMC and expects similar SoCs will be in handsets by the end of the year, using the process it described as relatively expensive and focused on lowering power.
Building Multi-Port USB Type-C Adapters for Power Blog 5/17/2016 Post a comment In the a previous blog, we discussed some of the challenges when designing AC/DC adapters for USB Type-C power delivery (PD). In that article, we focused on an adapter with a single Type-C output connector. In this article, we’ll examine the complexities introduced when architecting a multi-port Type-C adapter.
Samsung Details Foundry Roadmap News & Analysis 4/22/2016 3 comments Officials from Samsung Semiconductor Inc. detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.
NI's mmW Radio Speeds 5G Research News & Analysis 4/21/2016 1 comment National Instruments announced a software defined radio for the millimeter wave spectrum. The transceiver system that can transmit and/or receive wide-bandwidth signals at 2 GHz real-time bandwidth, covering the 71-76 GHz spectrum. The system comes with accompanying software.
Ams Breaks Ground on N.Y. Fab News & Analysis 4/20/2016 1 comment AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
FD-SOI Expands, But Is It Disruptive? News & Analysis 4/14/2016 5 comments The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
VC Veteran Joins EDA Group News & Analysis 4/13/2016 Post a comment Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Machine Learning Routes Chips News & Analysis 4/8/2016 Post a comment The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
Developing an Accessible Arduino News & Analysis 3/31/2016 Post a comment Development platforms such as Raspberry Pi and Arduino have given access to many makers and entrepreneurs , providing a low-cost method to tinker and prototype. Yet such platforms lack accessibility for at least one group of people who need access to specialized devices.
EDA Group Broadens Mission News & Analysis 3/31/2016 10 comments The EDA Consortium renamed itself the Electronic System Design Alliance, taking on a broader role including semiconductor IP, embedded software and advanced packaging.
Layouts for Buck, Boost, and SEPIC Power Stages Blog 3/23/2016 1 comment A correct printed circuit board (PCB) layout is one of the most important aspects to having a successful power supply design. Non-isolated power stages are the basic building blocks of power systems. Understanding where the currents are flowing and how the high-frequency loops are constructed is the most important step.
5G mmW Models Go Open Source News & Analysis 3/11/2016 Post a comment In an effort to speed 5G development, NYU Wireless will provide its
channel models and measurements for cellular propagation in the millimeter wave (mmW) band as free, open source software. The simulation will help product developers understand the behavior and capabilities of the mmW radio spectrum.
Decoding Electronic Materials Genome News & Analysis 3/8/2016 Post a comment Obama's Material's Genome Initiative is finally bearing electronic-fruit with the University of Connecticut's machine learning algorithm for calculating the electronic characteristics of polymers.
4th ICE Age Upon Us News & Analysis 2/25/2016 Post a comment Mentor Graphics is claiming that it has entered the 4th ICE Age with its accelerated, deterministic in-circuit-emulation apps like accurate design-for-test.
Leti Strains to Improve FDSOI News & Analysis 12/17/2015 Post a comment French research institute CEA-Leti has reported on two techniques to put local strain in the silicon channel of a fully-depleted silicon-on-insulator (FDSOI) manufacturing process.
X-Pessimism: A Realistic Approach is Needed Blog 12/8/2015 9 comments A gate-level simulator is pessimistic when a signal does not resolve to a known logic value (0 or 1), a sign something is off. The fix can mean months of work. How can pessimism be fixed without getting too depressing?
ARM Sizes Up Moore’s Law News & Analysis 12/7/2015 3 comments It’s getting harder and more costly to make chips smaller and faster, but there is still hope for advancing Moore’s Law, said an ARM researcher at IEDM.
Verizon Unveils ThingSpace IoT Platform News & Analysis 10/29/2015 Post a comment Verizon wants to connect billions of things within the space of its 4G LTE network. The company announced an Internet of Things development platform, ThingSpace, that aims to lower the barrier to entry for connectivity in smart cities, healthcare, agriculture, energy, and sharing platforms.