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Ams Breaks Ground on N.Y. Fab
News & Analysis  
4/20/2016   1 comment
AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
When 3D Printing Meets PCBs
Blog  
4/20/2016   2 comments
The convergence of electronics and 3D printing will bring the PCB prototyping in-house.
FD-SOI Expands, But Is It Disruptive?
News & Analysis  
4/14/2016   5 comments
The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
Facebook Roadmap Eyes AR/VR, Connectivity
News & Analysis  
4/13/2016   2 comments
Facebook's CEO said the company will target three major areas in the next 10 years: connecting everyone to the Internet, artificial intelligence, and virtual and augmented reality.
VC Veteran Joins EDA Group
News & Analysis  
4/13/2016   Post a comment
Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Machine Learning Routes Chips
News & Analysis  
4/8/2016   Post a comment
The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
FinFET's Father Forecasts Future
News & Analysis  
4/1/2016   3 comments
The father of the FinFET shared emerging ideas for building transistors as semiconductors approach atomic feature sizes.
Developing an Accessible Arduino
News & Analysis  
3/31/2016   Post a comment
Development platforms such as Raspberry Pi and Arduino have given access to many makers and entrepreneurs , providing a low-cost method to tinker and prototype. Yet such platforms lack accessibility for at least one group of people who need access to specialized devices.
EDA Group Broadens Mission
News & Analysis  
3/31/2016   10 comments
The EDA Consortium renamed itself the Electronic System Design Alliance, taking on a broader role including semiconductor IP, embedded software and advanced packaging.
Layouts for Buck, Boost, and SEPIC Power Stages
Blog  
3/23/2016   1 comment
A correct printed circuit board (PCB) layout is one of the most important aspects to having a successful power supply design. Non-isolated power stages are the basic building blocks of power systems. Understanding where the currents are flowing and how the high-frequency loops are constructed is the most important step.
MEMS Grand Challenge Debuts
News & Analysis  
3/16/2016   1 comment
A new design contest features a process design kit that the winners will use to fabricate their MEMS chip at X-Fab.
5G mmW Models Go Open Source
News & Analysis  
3/11/2016   Post a comment
In an effort to speed 5G development, NYU Wireless will provide its channel models and measurements for cellular propagation in the millimeter wave (mmW) band as free, open source software. The simulation will help product developers understand the behavior and capabilities of the mmW radio spectrum.
Decoding Electronic Materials Genome
News & Analysis  
3/8/2016   Post a comment
Obama's Material's Genome Initiative is finally bearing electronic-fruit with the University of Connecticut's machine learning algorithm for calculating the electronic characteristics of polymers.
4th ICE Age Upon Us
News & Analysis  
2/25/2016   Post a comment
Mentor Graphics is claiming that it has entered the 4th ICE Age with its accelerated, deterministic in-circuit-emulation apps like accurate design-for-test.
Parasitic Extraction for Accurate Signal Integrity Analysis
Blog  
2/19/2016   Post a comment
A number of new models have emerged that are useful for parasitic extraction at advanced nodes, including multi-patterning, FinFETs, and resistance and capacitance models.
Free Core, Some Assembly Required
News & Analysis  
1/7/2016   23 comments
The RISC-V free, open-source microprocessor core needs lots of work but has a cadre of seasoned engineers willing to help.
Automated Solution for Voltage-Aware DRC
Blog  
12/23/2015   Post a comment
Advanced nodes have brought to SoC designers a new kind of spacing check, called voltage-aware DRC (VA-DRC). What does this term mean, and what new challenges does it bring to the DRC task?
Leti Strains to Improve FDSOI
News & Analysis  
12/17/2015   Post a comment
French research institute CEA-Leti has reported on two techniques to put local strain in the silicon channel of a fully-depleted silicon-on-insulator (FDSOI) manufacturing process.
X-Pessimism: A Realistic Approach is Needed
Blog  
12/8/2015   9 comments
A gate-level simulator is pessimistic when a signal does not resolve to a known logic value (0 or 1), a sign something is off. The fix can mean months of work. How can pessimism be fixed without getting too depressing?
ARM Sizes Up Moore’s Law
News & Analysis  
12/7/2015   3 comments
It’s getting harder and more costly to make chips smaller and faster, but there is still hope for advancing Moore’s Law, said an ARM researcher at IEDM.
Menta eFPGAs Win Over E.U.
Blog  
11/16/2015   2 comments
Menta offers electronic design tools (EDA) tools that enable you to put an FPGA accelerator on any chip you want.
Confluence of Tech Grows Virtualization Market for OEMs
Blog  
11/2/2015   Post a comment
Increasingly, designers, architects, engineers, and even health care professionals are turning to remote graphics virtualization.
Complex SoCs: Early Use of Physical Design Info Shortens Timing Closure
Blog  
10/30/2015   Post a comment
Chip designs are becoming so complex that they are extremely difficult to implement in the physical design stage. Predicting trouble spots beforehand is paramount.
Verizon Unveils ThingSpace IoT Platform
News & Analysis  
10/29/2015   Post a comment
Verizon wants to connect billions of things within the space of its 4G LTE network. The company announced an Internet of Things development platform, ThingSpace, that aims to lower the barrier to entry for connectivity in smart cities, healthcare, agriculture, energy, and sharing platforms.
Silicon Valley's Role in Digital India Highlighted by Indian PM
Blog  
10/20/2015   1 comment
PM Modi recognizes the talent in Silicon Valley, and of the Indian Diaspora in particular.
Apple Gives a Foundry Lesson
Blog  
10/16/2015   10 comments
The rush to analyze Apple products has led to distorted conclusions from some who fail to appreciate the nuances of semiconductor technology, says one analyst.
5nm Test Lights Litho Path
News & Analysis  
10/7/2015   6 comments
Test chips made in a 5nm process showed the value of pushing today’s 193-immersion and tomorrow’s extreme ultraviolet lithography systems to their limits, said researchers at Imec and Cadence.
Wearables & IoT to Alter Electronic Design Process
Blog  
10/6/2015   Post a comment
Living small requires a lot of planning. Engineers will need all the help they can get designing for the Internet of Things.
New Funding Brings Aquantia Near $200 Million
News & Analysis  
10/5/2015   2 comments
Funding round worth $37 million brings Ethernet chip vendor to $199 million total over 10 years.
Put FPGAs In Your SoCs
News & Analysis  
10/2/2015   5 comments
Flex Logix has a new type of FPGA that nearly doubles the number of usable gates per chip. The FPGAs eliminate more than 20% of the room needed for interconnect and switches, and now have nearly 50% more room for gates.
Startup Raises Online Tool Debate
News & Analysis  
9/30/2015   Post a comment
Upverter upgraded its online service for circuit-board designers, raising questions about the outlook for cloud-based design.
TSMC Preps 10nm, Tunes 16nm
News & Analysis  
9/17/2015   7 comments
The world’s largest chip foundry said it will start “risk” production in 10nm late this year while it fine tunes its 16nm process and plans a basket of IoT offerings.
Dresden Memory Startup To Debut At Semicon Europa
News & Analysis  
9/15/2015   5 comments
A startup company that is working on a ferroelectric non-volatile memory technology based on hafnium oxide is set to make its debut at the Semicon Europa exhibition taking place in Dresden, Germany, October 6 to 8.
Post-Silicon Tech Compared
News & Analysis  
9/9/2015   4 comments
The Semiconductor Research Corporation is creating a joint benchmarking effort with Georgia Tech to guide post-silicon era electronics development at IBM, Intel, Freescale and Texas Instruments.
Flextech Guru Helps U.S. Stretch
News & Analysis  
9/3/2015   2 comments
The head of a new initiative to give the U.S. a lead in flexible hybrid electronics talks about the technology, markets and politics of the $165 million effort.
Nanotech Hub Targets 7nm, Beyond
Slideshow  
8/27/2015   2 comments
We toured the College of Nanoscience and Engineering, part of a State University of New York campus, a hub for advanced semiconductor manufacturing research in areas such as lithography, 450mm wafers, and new materials as well as photonics, biotech and workforce development.
Giga-Scale Challenges Plague Memory Design
Blog  
8/27/2015   Post a comment
Advanced designs are more complex and larger than ever before and designers are balancing between accuracy and performance for large scale memory simulation and verification, fine-tuning options and settings for each circuit type
The Power of Dynamic Voltage Frequency Scaling
Blog  
8/20/2015   3 comments
If dynamic behavior could be adjusted to fit the task at hand in consumer electronics, think of the power that could be saved.
Intel CEO Sees A Bright Future For IoT, Developers
News & Analysis  
8/19/2015   Post a comment
Tiny computers, real-time depth sensing, and breakthrough memory technology are among the innovations featured at this year's Intel Developer Forum. CEO Brian Krzanich detailed how connected devices will change the way we all do business.
Developing Prototype Circuits from Home
Engineering Investigations  
8/18/2015   4 comments
Regardless of whether you are independent or employed by a company, there are many advantages to developing a prototype on your own.
Agile Design for Hardware, Part III
Blog  
8/3/2015   4 comments
In the final installment of a three-part series, two Berkeley professors describe Chisel, a new programming tool suitable for Agile hardware development.
Making a Difference Still Does Make a Difference
Blog  
7/24/2015   Post a comment
The quality of products engineers and designers can make is only limited by the quality of tools that are available to them. Making a difference in the quality and productivity of ASIC and FPGA designers is key.
10 Views of Semicon West
Slideshow  
7/17/2015   4 comments
Systems-in-package could prop up a semiconductor industry falling off Moore’s Law, but hopes IoT will be the next driver may be too optimistic.
Ex-IBMer Fired Up for Foundry
News & Analysis  
7/16/2015   11 comments
Globalfoundries’ new CTO Gary Patton talks about life after IBM and the challenging road ahead for semiconductor makers.
High Customer Interest in FD-SOI, GloFo Says
News & Analysis  
7/16/2015   2 comments
Customers are already lining up to use the 22nm fully depleted silicon-on-insulator (SOI) technology announced by Globalfoundries earlier this week, according to a company executive.
Veteran EDA Analyst Gary Smith Dies
News & Analysis  
7/7/2015   9 comments
Memorial set for July 12 for man who was the voice of EDA for more than three decades.
8 FD-SOI Questions You're Afraid to Ask
Blog  
6/30/2015   13 comments
Paul Boudre, CEO of Soitec, told us last week in Grenoble, “Evidence [for FD-SOI’s advantages] is there. But some choose not to see it.”
Synopsys Acquires Elliptic Technologies, Beefs up Security
News & Analysis  
6/30/2015   Post a comment
Synopsys, Inc. is acquiring security intellectual property company Elliptic Technologies.
EDA Retrospective: 30+ Years of Highlights, Lowlights
Blog  
6/24/2015   3 comments
Technology journalist Richard Goering is about to retire after 30 years covering electronic design automation. He sums up some important EDA milestones.
IBM Demos III-V FinFETs on Silicon
News & Analysis  
6/18/2015   3 comments
IBM has found a way to use confined epitaxial overgrowth (CELO) to build III-V FinFETs on silicon wafers using standard CMOS processing.
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