Put FPGAs In Your SoCs News & Analysis 10/2/2015 5 comments Flex Logix has a new type of FPGA that nearly doubles the number of usable gates per chip. The FPGAs eliminate more than 20% of the room needed for interconnect and switches, and now have nearly 50% more room for gates.
TSMC Preps 10nm, Tunes 16nm News & Analysis 9/17/2015 7 comments The world’s largest chip foundry said it will start “risk” production in 10nm late this year while it fine tunes its 16nm process and plans a basket of IoT offerings.
Dresden Memory Startup To Debut At Semicon Europa News & Analysis 9/15/2015 5 comments A startup company that is working on a ferroelectric non-volatile memory technology based on hafnium oxide is set to make its debut at the Semicon Europa exhibition taking place in Dresden, Germany, October 6 to 8.
Post-Silicon Tech Compared News & Analysis 9/9/2015 4 comments The Semiconductor Research Corporation is creating a joint benchmarking effort with Georgia Tech to guide post-silicon era electronics development at IBM, Intel, Freescale and Texas Instruments.
Flextech Guru Helps U.S. Stretch News & Analysis 9/3/2015 2 comments The head of a new initiative to give the U.S. a lead in flexible hybrid electronics talks about the technology, markets and politics of the $165 million effort.
Nanotech Hub Targets 7nm, Beyond Slideshow 8/27/2015 2 comments We toured the College of Nanoscience and Engineering, part of a State University of New York campus, a hub for advanced semiconductor manufacturing research in areas such as lithography, 450mm wafers, and new materials as well as photonics, biotech and workforce development.
Giga-Scale Challenges Plague Memory Design Blog 8/27/2015 Post a comment Advanced designs are more complex and larger than ever before and designers are balancing between accuracy and performance for large scale memory simulation and verification, fine-tuning options and settings for each circuit type
Intel CEO Sees A Bright Future For IoT, Developers News & Analysis 8/19/2015 Post a comment Tiny computers, real-time depth sensing, and breakthrough memory technology are among the innovations featured at this year's Intel Developer Forum. CEO Brian Krzanich detailed how connected devices will change the way we all do business.
10nm Chips Promise Lower Costs Blog 6/15/2015 38 comments The challenges in the supply chain logistics for semiconductors continue to increase, but the 10nm node will give one more opportunity to gain large benefits from technology scaling.
Smart Glasses Strap On AR News & Analysis 6/10/2015 Post a comment Emerging technologies like AR comes with a series of challenges and opportunities, executives from smart glasses and AR device companies said during a session. Still, as additional use cases develop the possibilities are endless.
Simulate Your Buck-Converter Control Loop Blog 6/8/2015 2 comments Stabilizing the control loop of a voltage-mode (VM) or current-mode (CM) buck converter can be confusing, even intimidating, to non-power engineers. This article shows simple VM and CM SPICE simulation models that can predict your results with accuracy and provide a deeper understanding of key power block functions.
IBM Renting Its EDA Tools News & Analysis 6/7/2015 5 comments Ever since IBM started designing systems over 100 years ago, it has used it own internally developed toolkits, the envy of designers who have to use brand-x electronic design automation (EDA) suites. Now IBM is renting the use of its famous tools online at one-half the price of licensing brand-x tools.
FPGAs Ride HP’s Moonshot News & Analysis 5/28/2015 18 comments SRC Computers announced a new FPGA server card that Hewlett-Packard will sell as an option for its processor-agnostic Moonshot servers.
SoC From Russia With MIPS News & Analysis 5/27/2015 7 comments Baikal Electronics of Russia, announced its T1, the first chip to use MIPS Warrior cores, will take on Broadcom and others in WiFi routers and home gateways.
Microsoft Demos HoloLens News & Analysis 4/29/2015 Post a comment In what was otherwise a developer lingo-heavy event, Microsoft showcased updates to its HoloLens virtual reality platform running on Windows 10. The demos were part of Microsoft’s Build developer conference, held here April 29-March 1.
Smartwatch Uptick in Mobile Slump News & Analysis 4/23/2015 3 comments Smartwatches could grow to sales of 400 million units a year by 2019 when smartphone and tablet sales slump to single-digit levels, said a market watcher.
Mentor Graphics Drives ISPD Contest News & Analysis 4/6/2015 1 comment The contest winners for the Association for Computing Machinery's ACM's) International Symposium on Physical Design (ISPD) are enumerated as well as Kurt Antreich who was honored for his outstanding achievements.
Analog EDA Finally Automated News & Analysis 4/1/2015 9 comments Reutlingen University has created automated techniques for designing analog circuits, the technology for which it transferred to Cadence, and Rob Rutenbar at the University of Illinois in Urbana described how to convince analog designers use the new tools.
Ericsson on Power: We Need To Rethink Structure News & Analysis 3/25/2015 Post a comment Next-generation cellular communications will require a drastic reduction in energy consumption, something researchers at Ericsson are calling “ultra-lean transmission.” A focus on power management software could alleviate some of these issues.
Altium Updates High-Speed PCB Design Tool News & Analysis 3/3/2015 Post a comment Altium next update to its flagship PCB design tool, Altium Designer 15.1, introduces new features the company says improves design productivity, documentation outputs, and high-speed design efficiency.
Open-Silicon: ‘No Software Runs Without Hardware’ News & Analysis 2/9/2015 1 comment As the valuation of high-tech companies goes increasingly lopsided -- disproportionately favoring the software business -- the obvious question is: Who nowadays is willing to get their hands dirty designing high-cost, low-margin hardware?
16 Takeaways from DesignCon 2015 Slideshow 2/2/2015 2 comments At DesignCon 2015 I heard what’s happening in high-speed chip and board interface design including issues with 56G, silicon photonics and optical backplanes.