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posted in January 2003
Taking on the 130nm node and beyond
News & Analysis  
1/13/2003   Post a comment
Texas Instruments' ASIC design team has been designing large, high-performance chips at the 130nm node for over two years.
Software takes center stage to meet vital SoC goals
News & Analysis  
1/13/2003   Post a comment
ASIC vendors are in the software business — and not just as a nice sideline.
SoC technical difficulties ahead; stand by
News & Analysis  
1/13/2003   Post a comment
Despite the assurances of foundries, ASIC vendors and tool suppliers that the problems with 130-nanometer CMOS are well in hand and that 90 nm is ready to use, there is a rumbling of voices from experienced design teams that not all is well.
SOC Road Map
News & Analysis  
1/13/2003   Post a comment
Next generation SoCs: optimized IP platforms
News & Analysis  
1/13/2003   Post a comment
Consumer demand for more functionality, higher performance and lower cost adds greater continual pressure on SoC manufacturers.
Lessons learned from extending 0.12 µm CMOS for multimillion gate, IP designs
News & Analysis  
1/13/2003   Post a comment
Complexity is very high with multimillion-gate, IP rich designs in CMOS12, involving many components in the nanometer SoC manufacturing chain.
Future success of SoCs and platforms lies in verification
News & Analysis  
1/13/2003   Post a comment
Market demands for high integration and high functionality have driven most silicon devices to become SoC devices.
Async chip design eases process shift
News & Analysis  
1/13/2003   Post a comment
We knew that our innovative asynchronous chip architecture could improve system efficiency by increasing performance and decreasing power consumption.
Advanced library format "attacks" advanced design issues
News & Analysis  
1/13/2003   Post a comment
Traditionally, ASIC design has been focused almost exclusively on timing closure.
Adapting an architecture to fit 130 nm
News & Analysis  
1/13/2003   Post a comment
Designing picoChip's new communications processor chip, the PC101, which arrived in first silicon in November, taught us that using 0.13-micron processes is a lot more difficult that our engineers expected, though no one thought it would be easy.
1T-SRAM improves yield, benefits SoCs
News & Analysis  
1/13/2003   Post a comment
Embedded memory has become essential for achieving greater bandwidth and faster processing in SoC designs at 0.13 µm and below.


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