Toyota Case: Vehicle Testing Confirms Fatal Flaws News & Analysis 10/31/2013 68 comments With gag orders, code reviews locked in windowless rooms, and a car attached to a dynamometer, Bookout v Toyota had enough engineering intrigue to make a good thriller. But what the experts found was serious stuff. Here's how they showed the defects that cause unintended acceleration.
Is ARM Adopting Microsoft Model? News & Analysis 10/28/2013 5 comments XMOS Semiconductor has signed a deal to use ARM-based chips from Silicon Labs alongside its own deterministic multicore silicon in a single package.
Why Toyota’s Oklahoma Case Is Different Blog 10/25/2013 37 comments If you are an engineer or a Toyota vehicle owner, you owe it yourself to remain open-minded and read the followup story we just posted on www.eetimes.com, Toyota Case: Single Bit Flip That Killed.
Toyota Case: Single Bit Flip That Killed News & Analysis 10/25/2013 104 comments Could bad code kill a person? It apparently did. The Bookout v Toyota Motor Corp. case, which blamed sudden acceleration in a Toyota Camry for a wrongful death, touches the issue directly.
Acceleration Case: Jury Finds Toyota Liable News & Analysis 10/24/2013 43 comments A jury finds that Toyota's electronic throttle control system caused the sudden acceleration of a 2005 Camry in a 2007 accident that killed one woman and seriously injured another on an Oklahoma highway off-ramp.
Oklahoma Jury to Deliberate Toyota Acceleration Case News & Analysis 10/24/2013 9 comments The focus of the Toyota case in Oklahoma is on software and electronics used in the electronic throttle control, rather than the entanglement of the accelerator pedal with a floor mat, which Toyota previously cited as the cause of accidents.
China's SMIC Responds to Soaring 3D IC Market News & Analysis 10/21/2013 5 comments To capture the rapidly growing thru-silicon-via technology-based stacked device market, China Semiconductor Manufacturing International Corp. has formed an R&D and manufacturing center dedicated to 3D IC.
Mobile IC Vendors to Alter Automotive SoC Market News & Analysis 10/8/2013 5 comments The rise and fall of smartphone SoC companies has become intricately intertwined with the future of automotive chip suppliers. Many automotive IC companies are racing to dominate the fast-growing segment of in-vehicle infotainment SoCs.
Mike Noonen, GloFo Executive VP, Resigns News & Analysis 10/7/2013 19 comments Mike Noonen has resigned from his position as the executive vice president at GlobalFoundries. Noonen was responsible for global products, design, sales, and marketing at the world’s second largest foundry.
Unlocking the Keyless Car Future Automotive DesignLine Blog 10/2/2013 33 comments For just about everything we do these days, “there's an app for that.” Is the car key destined to become one more little tile on a smartphone screen?
TSMC Shows Path to 16nm, Beyond News & Analysis 10/2/2013 39 comments Chip bellwether TSMC detailed its steady progress on its 20 and 16nm nodes, but said little about the expected costs increases they will carry.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments