Cadence exec downplays Connections controversy News & Analysis 11/26/2008 Post a comment An executive from EDA vendor Cadence Design Systems downplayed a report that suggested that Cadence had removed from membership a large number of software vendors from its Connections partnership program and defended Cadence as having the "broadest partner program in the industry."
Analog Profile: Jim Solomon News & Analysis 11/25/2008 Post a comment As part of the 'Analog Profiles' series in which we dig a little deeper into the backgrounds of the people shaping the analog sector, ADLE interviews Jim Solomon, Executive Chairman at Gemini Design Technology.
Viewpoint: EDA disconnected? Blog 11/25/2008 Post a comment As much as it is every business' prerogative to decide who they should partner with, it is quite disturbing to analyze the implication of the "eviction" action by Cadence Design Systems in removing member companies from its Connections partner program, writes Yatin Trivedi, senior director for strategic industry alliances at Magma Design Automation Inc.
Multi-Voltage verification for power management Design How-To 11/25/2008 1 comment Power management techniques are a necessity in today's low-power designs, introducing voltage as a new architectural variable, often changed by a combination of software and hardware. This paper discusses the challenges faced in verification of a low-power chip, short comings of conventional verification techniques and how a structured verification solution has addressed those issues.
FTC asks Supreme Court to overturn Rambus decision News & Analysis 11/25/2008 2 comments The U.S. Federal Trade Commission is asking the U.S. Supreme Court to overturn an April decision by a lower court that found the FTC failed to demonstrate that actions by memory technology vendor Rambus harmed competition.
Nasdaq warns Cadence on compliance News & Analysis 11/25/2008 Post a comment Cadence Design Systems has been notified by the Nasdaq stock market that the company is not in compliance with market rules for failing to file a 10-Q report with the U.S. Securities and Exchange Commission for the quarter ended Sept. 27.
Cisco, IBM join subscription patent service News & Analysis 11/24/2008 Post a comment Startup RPX Corp. has signed up Cisco Systems and IBM as members for a novel subscription service for patent licenses that aims to act as a broad umbrella shielding members from patent infringement suits.
Revell RC Helicopter: Fun with mechatronics Design How-To 11/24/2008 1 comment Even if you're not a kid (at least in age) the toy section of stores can hold some intriguing electronic gems and we'll take a look at a remote-control (RC) device in the form of Revell's RC helicopter.
Packaging goes vertical Design How-To 11/24/2008 Post a comment Functional density, weight and configurability are just a few of many reasons a growing number of semiconductor products are going vertical using stacked-die, package-on-package or through-silicon-via packages.
Cadence promotes three to exec leadership team News & Analysis 11/21/2008 Post a comment EDA vendor Cadence Design Systems Inc., which saw its leadership team gutted in October with the resignations of five top executives, has promoted three people to executive management positions in R&D, worldwide sales, field operations.
Report: Obama gives peek into H-1B policy News & Analysis 11/21/2008 Post a comment If President-elect Barack Obama appoints Arizona Gov. Janet Napolitano to be secretary of the Department of Homeland Security the move would have significant implications on the incoming administration's policy on H-1B visas, according to a report.
Comment: Google phones need to be more open News & Analysis 11/18/2008 Post a comment There's no doubt the first phone to use the Google Android mobile software is open in new and important ways, but the T-Mobile G1 handset also reminds me of how Microsoft bundled its applications and browser with Windows to leverage its dominance in one market to get a leg up in another one.
Planning, adopting and implementing adaptive reuse Design How-To 11/18/2008 Post a comment If you have to question the reuse benefit, then you should not spend resources making anything reusable. Similarly, no convincing is necessary when reuse becomes a practice weaved into the design process such that when it is built, it gets used with cool efficiency.
Report: Patent office continues to fall behind News & Analysis 11/17/2008 1 comment The U.S. Patent and Trademark Office gave itself high marks in an annual report but the office still has not found a route to clearing its growing backlog of applications despite several programs in the works.
RIM's Bold bests other phones' transfer times Teardown 11/17/2008 Post a comment We pitted five smartphones against each other to test their download speeds and get a feel for the user experience with movies, TV shows and audio CDs. For the second consecutive year, the BlackBerry Bold took the gold.
Optimizing video content delivery Design How-To 11/17/2008 Post a comment Moving content to the edge of the network, close to subscribers, optimizes transport costs, ensures a scalable quality of experience and creates new value on which to build new business models.
New technologies target design issues at 65, 45 nm Product News 11/13/2008 Post a comment Fabless ASIC company Open-Silicon has introduced new technologies to address design issues common to the 65- and 40-nm nodes. Depending on customer needs, Open-Silicon will use the PowerMAX, CoreMAX and VariMAX technologies to build better custom silicon by designing in lower power, increased performance and managed process variability, the company said.
Cadence launches ActiveParts Portal News & Analysis 11/12/2008 Post a comment EDA vendor Cadence Design Systems expanded its ActiveParts online component data solution with a portal to offer PCB design teams greater access to component information.
Denali offers USB 3.0 verification IP News & Analysis 11/12/2008 Post a comment EDA and IP provider Denali Software said its PureSpec verification IP (VIP) product now supports the USB 3.0 specification from the USB 3.0 Promoter Group, allowing device and system designers to begin advanced USB 3.0 development.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.