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Content tagged with Design Tools (EDA)
posted in December 2003
Achieving signal integrity for ASICs, PCBs and packages
News & Analysis  
12/19/2003   Post a comment
High-speed designs are causing signal-integrity problems in ASICs, packages and boards. In this tutorial, LSI Logic engineer David Chase shows you how to avoid problems due to reflections, crosstalk, noise, simultaneous switching outputs, IR drop, and voltage droop.
Open-source planning tool helps make live voice-quality measurements
Product News  
12/19/2003   Post a comment
Here's news of an open-source add-on tool for making meaningful voice quality measurements on all kinds of telephony gear---both wired and wireless. Used during the design phase of a product, it can yield margin by avoiding customer-related issues in the field. It can also help you evaluate voice network performance.
ADI broadens software tools line for DSPs
Product News  
12/19/2003   Post a comment
Analog Devices, Inc. is beefing -up its line of software tools for its DSPs with the launching monday Dec. 22 of USB-based emulators and the VisualDSP++ integrated development and debugging environment (IDDE) release 3.5.
High-voltage tech supports Borscht phone features
News & Analysis  
12/18/2003   Post a comment
Legerity's dual-channel subscriber line interface controller (SLIC) device has enhanced and optimized features to directly address the requirements of voice-over-broadband applications.
Modeling is key to analog/RF foundry support
News & Analysis  
12/18/2003   Post a comment
Not every semiconductor company needs leading-edge technology.
Analog CMOS supports precision specs
News & Analysis  
12/18/2003   Post a comment
Many new portable applications call for higher levels of integration and low power, along with highly integrated digital and analog electronics, requiring low-power electronics to extend battery life and reduce device size.
CB process supports consumer amplifiers
News & Analysis  
12/18/2003   Post a comment
Today the market for high-speed analog ICs is growing rapidly because of the ever-increasing demand for bandwidth. High-bandwidth amplifiers are finding such applications as xDSL and cable modems, set-top boxes, contact image scanners, DVD players and CD-ROMs.
High-speed op amps built using SiGe
News & Analysis  
12/18/2003   Post a comment
High-performance applications such as third-generation wireless basestations and measurement and medical equipment demand faster response times from high-speed, high-resolution data converters and the amplifiers used to drive them.
Nanometer IC routing requires new approaches
News & Analysis  
12/12/2003   Post a comment
What's the difference between gridded, shape-based, and graph-based routers? How do interconnect delays and signal integrity impact routing? Cadence Design Systems' David Desharnais answers these questions in this look at nanometer routing challenges.
JTAG chip eases multi-board structural test, FPGA config, in-field updates
Product News  
12/11/2003   1 comment
A new parallel test-and-configuration BIST chip from Intellitech is for use in circuit boards on multi-slot or multi-cabled backplanes. The JTAG device provides the infrastructure necessary for multi-board FPGA configuration, as well as board-to-board interconnect test.
Passive integration activates wireless
Product News  
12/10/2003   Post a comment
Ron Wood of Atmel Corp. and Sotiris Bantas of Helic SA reveals why it has become important to understand the impact the package has on silicon circuits and to integrate an EDA tool into a foundry design kit in order to optimize both on-chip and in-package passives.
Signal integrity key for Gbit interconnects
News & Analysis  
12/8/2003   Post a comment
As modern signaling standards push digital designs to the gigahertz and gigabit ranges, interconnect performance becomes the key factor in enabling reliable system operation.
Concurrent FPGA/board co-design ties in
News & Analysis  
12/8/2003   Post a comment
Historically, field-programmable gate arrays and printed-circuit boards have been conceived in disparate design environments.
Unified data model brings signal integrity
News & Analysis  
12/8/2003   Post a comment
Electronic design automation has evolved over the past 20 years as isolated activities for each piece of a design.
Speedy FPGAs need IC/package co-design
News & Analysis  
12/8/2003   Post a comment
Until recently, chip designers mainly focused on optimizing their designs within the silicon.
Methodology enshrines IC, package and pcb
News & Analysis  
12/8/2003   Post a comment
The designs of an IC, its package and its target system board have traditionally been separate development processes driven from common specifications.
Co-design strategies tame PC system bus
News & Analysis  
12/8/2003   Post a comment
In a modern high-speed bus, numerous subsystems make up the entire interconnect.
Start thinking out of known 'design box'
News & Analysis  
12/8/2003   Post a comment
Recent major innovations in packaging technology have led to a number of more powerful and more flexible packages that attempt to cope with the challenges posed by designs containing multimillion gates and multigigahertz systems-on-chip.
Passive integration activates wireless
News & Analysis  
12/8/2003   Post a comment
The wireless-design community has placed increased pressure on CMOS and BiCMOS foundries to combine multiplatform design environments into a single one to support both silicon and packaging co-design.
National Instruments's popular LabVIEW battered by legal fire
Product News  
12/8/2003   Post a comment
SoftWIRE says it's seeking damages for past sales of National Instrument's popular LabVIEW product. Significantly, SoftWIRE is seeking an order prohibiting NI from selling the LabVIEW product!
From Box To Box
Product News  
12/8/2003   Post a comment
From Box To Box
Write your own PCB database translator
News & Analysis  
12/6/2003   Post a comment
If you ever have to move PCB placement files from one CAD system to another, you can write a simple translator using Perl. Luke Chang, verification engineer at Intel, shows how it's done in this step-by-step tutorial.
Accord helps EEs model non-linear, microwave, RF devices
Product News  
12/3/2003   Post a comment
Instrument supplier Anritsu is teaming up with EDA supplier Modelithics to give developers the ability to do characterization of frequency-translating devices such as microwave mixers, up- and down-converters, and frequency multipliers. Characterization of devices working at frequencies as high as 40-GHz is possible.
Tech award underscores DFT
Product News  
12/2/2003   Post a comment
A new design-for-test system is claimed to help IC manufacturers get products to market weeks faster than by using conventional tools.
FPGAs will stifle EDA, analyst says
News & Analysis  
12/1/2003   Post a comment
'Best practices' improve hierarchical design constraints
Design How-To  
12/1/2003   Post a comment
Setting the right physical and timing constraints is crucial for deep submicron ICs, especially with hierarchical design. In this article, Vijay Gullapalli from Synopsys Professional Services shows you "best practices" for managing constraints in hierarchical flows.


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