S3 Preps DAC Product With a Twist
News & Analysis 3/28/2014 1 comment
The Irish firm, which has mostly stuck to its role as a supplier of design services and IP, is looking to sell its own ICs soon. The first product is likely to be a high-speed digital-to-analog converter.
Will SMIC Narrow Tech Gap?
News & Analysis 3/27/2014 13 comments
Critics worry that SMIC, under Tzu-Yin Chiu’s leadership, might have already given up a dream of directly competing with the world’s Tier 1 foundries such as TSMC, Samsung, and Intel.
Can Connected Car Save Fuel?
Blog 3/26/2014 3 comments
A connected car can help save a lot of fuel and time, along with keeping you safe. These factors will drive the adoption of connected car solutions more than anything else.
Synopsys Upgrades Place & Route Tool
News & Analysis 3/24/2014 1 comment
Synopsys announced the IC Compiler II and an upgrade of its flagship place-and-route chip design tool, boasting faster throughput while using less memory.
Will China Conquer MEMS?
News & Analysis 3/20/2014 9 comments
After a mad rush to develop apps processors for tablets and smartphones, Chinese entrepreneurs are now concluding that the rapidly growing number of MEMS inside a smartphone is too huge an opportunity to pass up.
Ex-Nokia Designer Leads Shenzhen Media Lab
News & Analysis 3/14/2014 8 comments
Ex-Nokia researcher based in Shenzhen knows something about Shenzhen, and about the city’s potential in the next 10 years. He’s betting on Shenzhen’s shift from the world’s low-wage factory to a global prototyping center.
ZTE's Bid to Go Upmarket via Nubia
News & Analysis 3/10/2014 4 comments
Nubia is ZTE's vehicle to go "upmarket," with a mission to establish a viable consumer brand and consumer channels -- not just in China but also in the United States.
Marvell to Launch IoT Maker Kit
News & Analysis 3/10/2014 17 comments
16nm Pushes Chip Design Boundaries at CDNLive
News & Analysis 3/7/2014 1 comment
One of the key issues being debated at the 2014 CDN Live conference is the race to make 16nm chip design more efficient. Engineers from Intel and TSMC are both expected to present papers on the subject.
New DARPA Program Targets Bootleg Components
News & Analysis 3/5/2014 9 comments
Counterfeit components remain the scourge of electronics OEMs. The Pentagon is looking to the engineering community for a solution that will authenticate parts at any step in the supply chain.