Cadence Q1 sales fall further News & Analysis 4/29/2009 Post a comment Cadence Design Systems posted a GAAP net loss of $63 million on revenue of $206 million for the first quarter. Revenue declined 9 percent compared to the previous quarter and 24 percent compared with the same period of 2008.
IC design/verification needs management tools RF & Microwave Designline Blog 4/29/2009 Post a comment IC Design Management systems are needed to reduce the time it takes to find, track and fix
development bugs; increase design team collaboration; improve designer efficiency; raise
product quality, and improve IP reuse.
CoWare, Carbon team for ARM IP models News & Analysis 4/28/2009 Post a comment EDA group CoWare Inc. (San Jose, Calif.) and Carbon Design Systems are joining forces to develop implementation-accurate models of ARM IP targeted for CoWare's SystemC-based designs.
Does the EDA industry have a roadmap? Blog 4/27/2009 Post a comment In the technology world, a roadmap is a living document that projects contexts, requirements, and potential solutions into the future. Every industry roadmaps its key technologies, products and markets, for several basic reasons.
Obama to boost federal R&D spending News & Analysis 4/27/2009 1 comment President Barack Obama pledged to raise the level of U.S. federal spending on research and development to more than three percent of the country's gross domestic product. He also named Microsoft chief research and strategy officer Craig Mundie and Google chief executive Eric Schmidt to his board of advisors on science and technology.
Kontron design wins in Q1 at record level News & Analysis 4/27/2009 Post a comment In the first quarter of the current year, board computer manufacturer Kontron AG (Eching, Germany) continued its upward trend. Despite the crisis, the company raised its sales in comparison to the same quarter last year. Design wins climbed to an all-time high for the company.
Xilinx shipping ISE Design Suite 11.1 Product News 4/27/2009 2 comments Programmable logic vendor Xilinx is now shipping ISE Design Suite 11.1, described as an FPGA design solution with fully interoperable domain-specific design flows and tool configurations for logic, digital signal processing, embedded processing and system-level design.
Auto design gets modular Automotive DesignLine Blog 4/24/2009 Post a comment Those engineers at the cutting edge of automotive design appear to be taking a page from NASA's Apollo program to land humans on the Moon in the 1960s.
CoWare, ACE and Europractice expand collaboration News & Analysis 4/24/2009 Post a comment EDA company CoWare Inc. (San Jose, Calif.) is collaborating with ACE Associated Compiler Experts BV (Amsterdam, The Netherlands) and the Europractice service (Leuven, Belgium) to offer Processor Designer C-Compiler to European universities and research institutes.
Design tool supports Infineon's TriCore Product News 4/23/2009 Post a comment Development tool vendor iSystem has announced a design tool for Infineon's TriCore 32-bit microcontroller family. The device supports a broad spectrum of functions close to the microcontroller hardware.
Analog profile: Andrew Beckett News & Analysis 4/21/2009 Post a comment Analog designer and EDA expert Andrew Beckett's career path is testament to the opportunities that abound during the ups and downs of the semiconductor cycle.
Altium slashes price on 'unified' design tool Product News 4/21/2009 1 comment Australian design tool provider Altium has cut by about 75 percent the price of its Altium Designer, a circuit board design tool which is intended to bring together the traditionally separate worlds of hardware and software design.
Apache offers Totem platform Product News 4/21/2009 Post a comment Apache Design Solutions announced Totem, an integrated power and noise integrity platform for analog, mixed-signal, memory, and high-speed I/O designs.
Samsung adopts IMEC variability-aware modeling for memory News & Analysis 4/21/2009 Post a comment Research institute IMEC (Leuven, Belgium) has transferred an EDA tool for variability-aware modeling (VAM) of memories to Samsung Electronics Co. Ltd. The tool predicts yield loss of SRAMs caused by the process variations of deep-submicron manufacturing processes.
TSMC rolls sign-off flow, RF design kit Product News 4/21/2009 Post a comment Seeking to accelerate the product development process, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is rolling out a one-two punch in the arena: It has unveiled a mixed-signal/RF design kit as well as a foundry-specific integrated sign-off flow.
Food for thought: EDA roadmap? Blog 4/20/2009 1 comment Entire Ph.D. theses have been written on the technology roadmapping process alone, according to guest columnist Andrew B. Kahng. The DAC 2009 chairman explores the path to an EDA roadmap (click on "Guest").
Mentor embraces Autosar Product News 4/20/2009 Post a comment EDA software vendor Mentor Graphics has announced a product family that supports the Autosar software standard for automotive electronics. The products are based on the company's existing Eclipse development environment.
DOCEA Power unveils first ESL tool to optimize dynamic power and thermal behavior Product News 4/20/2009 Post a comment The first electronic system level (ESL) software tool that allows designers to model, simulate and optimize the dynamic power and thermal behaviour of whole complex systems, either on-chip, on-board or with multiple boards is to be previewed by DOCEA Power (Moirans, France) at the Design, Automation & Test in Europe conference in Nice, France, from April 20 to 24, 2009.
Obama names relative unknown as U.S. CTO News & Analysis 4/20/2009 3 comments The United States has its first ever chief technology officer, but Aneesh Chopra is not well known in the electronics industry, and it's not clear whether his focus will be on many of the issues near and dear to the sector.
Counterpoint: Silicon amnesia Blog 4/20/2009 4 comments Semiconductor technology has enabled our computers, the Internet and 50-mpg cars. Your cellphone has more computational power than the computers did on the Apollo moon lander. Yet in spite of the semiconductor's seminal importance, semiconductor history is neglected by historians as "too new" and by the business media as "old news."
Entrepreneurs still key to silicon's progress News & Analysis 4/20/2009 Post a comment A few weeks ago, Moshe Gavrielov, president and chief executive officer of FPGA vendor Xilinx Inc. (San Jose, Calif.), said it was all over: Venture capital would not return to the semiconductor industry--not even after the current recession--because of the heady sums required to launch a chip startup and the more than five-year lag before VC investors see a return.
Faster code generation for wireless sensor networks Design How-To 4/16/2009 Post a comment Wireless sensor networks (WSN) have become a hot research topic and show much promise to become a driver of current and future microelectronic technologies. This emerging technology offers exciting potential for numerous application areas including environmental, medical, military, transportation, entertainment and crisis management.
EVE extends debugging on ZeBu platform News & Analysis 4/14/2009 Post a comment Hardware-software co-verification specialist Emulation and Verification Engineering SA (EVE) has added support for SystemVerilog Assertions, flexible probes, and complete access to all combinational signals at run-time, to its ZeBu (Zero Bugs) emulation systems.
ON Semi offers 110-nm ASIC platform Product News 4/13/2009 Post a comment ON Semiconductor has licensed 110-nanometer process technology and associated IP from LSI Corp. to serve as the basis for a new ASIC platform said it offer customers high-density and performance while minimizing non-recurring engineering costs and time-to-market.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments